# US 2017/0287883 A1 · Light-emitting device and method of manufacturing the same

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2017/0287883 A1
- Document ID: US20170287883A1
- Status: Published application
- Kind: A1
- Application number: 15/623,211
- Filed: 2017-06-14
- Published: 2017-10-05
- Earliest claimed: 2012-08-31
- Assignees: Nichia Corporation
- Applicants: Nichia Corporation
- Inventors: Yukitoshi MARUTANI; Hiroto TAMAKI; Tadaaki MIYATA
- Web page: https://patentgrep.com/patent/US20170287883A1

## CPC

- H10W 90/00: Package configurations
- H10H 20/851: Wavelength conversion means
- H10H 20/856: Reflecting means
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- F21K 9/27: Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
- F21Y 2103/10: comprising a linear array of point-like light-generating elements
- F21Y 2115/10: Light-emitting diodes [LED]
- H10W 72/07251: {characterised by changes in properties of the bump connectors during connecting}
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED

## Abstract

A method of manufacturing a light-emitting device includes steps of: preparing at least one substrate having a plurality of through holes; providing an electric wire on a rear surface side of the substrate so that a plurality of portions of the electric wire communicates with a front surface side of the substrate at the plurality of through holes of the substrate; and respectively mounting a plurality of light-emitting diodes to the respective portions of the electric wire that communicate with the front surface side of the substrate.

## Claims

### Claim 1

A method of manufacturing a light-emitting device, comprising the steps of:
preparing at least one substrate having a plurality of through holes;
providing an electric wire on a rear surface side of the substrate so that a plurality of portions of the electric wire communicates with a front surface side of the substrate at the plurality of through holes of the substrate; and
respectively mounting a plurality of light-emitting diodes to the respective portions of the electric wire that communicate with the front surface side of the substrate.

### Claim 2 (depends on 1)

The method of manufacturing a light-emitting device according to claim 1, wherein after the mounting step, sealing the plurality of light-emitting diodes mounted on the electric wire.

### Claim 3 (depends on 1)

The method of manufacturing a light-emitting device according to claim 1, wherein each of the plurality of light-emitting diodes is an LED chip.

### Claim 4 (depends on 1)

The method of manufacturing a light-emitting device according to claim 1,
wherein the electric wire comprises an anode electric wire and a cathode electric wire,
wherein respective portions of the anode electric wire to which the plurality of light-emitting diodes is mounted and respective portions of the cathode electric wire to which the plurality of light-emitting diodes is mounted are bent so as to project to the front surface side of the substrate from the rear surface side of the substrate through the through holes and then again pass through the through holes to return to the rear surface side of the substrate, and
wherein the plurality of light-emitting diodes is provided on the front surface side of the substrate, and positive and negative electrodes of the plurality of light-emitting diodes are respectively connected to the anode electric wire and the cathode electric wire.

### Claim 5 (depends on 1)

The method of manufacturing a light-emitting device according to claim 1, wherein the electric wire comprises a plurality of electric wires,
wherein one end of each electric wire and another end of each electric wire pass through the through holes from the rear surface side of the substrate and project to the front surface side of the substrate, and
wherein the plurality of light-emitting diodes is provided on the front surface side of the substrate, and positive and negative electrodes of the plurality of light-emitting diodes are respectively connected to the one end of one electric wire among the plurality of electric wires and the another end of another electric wire among the plurality of electric wires.

### Claim 6 (depends on 5)

The method of manufacturing a light-emitting device according to claim 5, further comprising a step of folding the electric wires, which pass through the through holes from the rear surface side of the substrate and project to the front surface side of the substrate, toward the front surface side of the substrate.

### Claim 7 (depends on 1)

The method of manufacturing a light-emitting device according to claim 1, wherein the electric wire comprises an anode electric wire and a cathode electric wire,
wherein the anode electric wire and the cathode electric wire traverse opening planes of the through holes on the rear surface side of the substrate, and
wherein the plurality of light-emitting diodes is provided in the through holes, and positive and negative electrodes of the plurality of light-emitting diodes are respectively connected to the anode electric wire and the cathode electric wire.

### Claim 8 (depends on 1)

The method of manufacturing a light-emitting device according to claim 1 further comprising a step of mounting a light-emitting diode from the plurality of light-emitting diodes, protective element, or a combination thereof to the electric wire on the rear surface side of the substrate.