# US 2017/0287873 A1 · Electronic assembly components with corner adhesive for warpage reduction during thermal processing

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2017/0287873 A1
- Document ID: US20170287873A1
- Status: Published application
- Kind: A1
- Application number: 15/084,032
- Filed: 2016-03-29
- Published: 2017-10-05
- Earliest claimed: 2016-03-29
- Inventors: Santosh Sankarasubramanian; Hong Xie; Nachiket R. Raravikar; Steven A. Klein; Pramod Malatkar
- Web page: https://patentgrep.com/patent/US20170287873A1

## CPC

- H10W 42/121: {protecting against mechanical damage (H10W76/00, H10W74/00 take precedence)}
- H10W 72/30: Die-attach connectors
- H05K 1/0271: {Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion}
- H05K 3/305: {Affixing by adhesive}
- H05K 3/3436: {having an array of bottom contacts, e.g. pad grid array or ball grid array components}
- H05K 2201/09136: Means for correcting warpage
- H05K 2201/10515: Stacked components
- H10W 72/07235: {Applying EM radiation, e.g. induction heating or using a laser}
- H10W 72/07236: {Soldering or alloying}
- H10W 72/07254: {changes in dispositions}
- H10W 72/073: {of die-attach connectors}
- H10W 72/07353: {changes in shapes}
- H10W 72/07354: {changes in dispositions}
- H10W 72/248: {Top-view layouts, e.g. mirror arrays}
- H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
- H10W 72/253: {not comprising solid metals or solid metalloids, e.g. polymers or ceramics}
- H10W 72/257: {Multiple bump connectors having different materials}
- H10W 72/263: {Providing mechanical bonding or support, e.g. dummy bumps}
- H10W 72/267: {Multiple bump connectors having different functions}
- H10W 72/334: {Cross-sectional shape, i.e. in side view}
- H10W 72/344: {relative to underlying supporting features, e.g. bond pads, RDLs or vias}
- H10W 72/348: {Top-view layouts, e.g. mirror arrays}
- H10W 72/856: {Bump connectors and die-attach connectors (bumps embedded in underfills H10W74/15)}
- H10W 72/877: {Bump connectors and die-attach connectors}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 90/722: {between stacked chips}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

An IC package, an electronic assembly, and methods of preventing warpage of components of an electronic assembly during fabrication of the electronic assembly are shown. An IC package including an adhesive disposed at or near at least one of four corners of a die of the IC package is shown. An electronic assembly including an IC package that includes an adhesive disposed at or near at least one of four corners of a second surface of a first substrate is shown. Methods of preventing warpage of components of an electronic assembly during fabrication of the electronic assembly that include applying an adhesive to at least one of four corners of a first surface of a first component are shown.

## Claims

### Claim 1

An integrated circuit (IC) package, comprising
an integrated circuit die having four corners;
a first substrate having a first surface and a second surface;
a first plurality of solder bump structures electrically coupling the die to the first surface of the first substrate; and
an adhesive disposed only at or near the four corners of the die of the integrated circuit package, wherein the adhesive is disposed between the die and the first substrate and is configured to couple the die and the first substrate during high temperature processing and to limit bridging of the solder bump structures and warpage of the integrated circuit package.

### Claim 2 (depends on 1)

The integrated circuit package of claim 1, wherein the adhesive includes at least one drop of adhesive.

### Claim 3 (depends on 1)

The integrated circuit package of claim 1, in combination with a second substrate, wherein a second plurality of solder bump structures electrically couples the second substrate to the second surface of the first substrate.

### Claim 4 (depends on 3)

The integrated circuit package of claim 3, wherein the second substrate is a printed circuit board.

### Claim 5 (depends on 1)

The integrated circuit package of claim 1, wherein the second substrates an interposer.

### Claim 6 (depends on 1)

The integrated circuit package of claim 1, wherein the adhesive is an adhesive tape.

### Claim 7 (depends on 1)

The integrated circuit package of claim 1, wherein the first substrate is a second die.

### Claim at position 8

8-9. (canceled)

### Claim 10

An electronic assembly comprising:
an integrated circuit including:
an integrated circuit die;
a first substrate having a first surface and a second surface and four corners; and
a first plurality of solder bump structures electrically coupling the die to the first surface of the first substrate;
a second substrate;
a second plurality of solder bump structures electrically coupling the second surface of the first substrate to the second substrate; and
an adhesive disposed only at or near the four corners of the second surface of the first substrate, wherein the adhesive is disposed between the first substrate and the second substrate and is configured to couple the first substrate and the second substrate to prevent warpage of the electronic assembly during high temperature processing of the electronic assembly.

### Claim 11 (depends on 10)

The electronic assembly of claim 10, wherein the adhesive includes at least one drop of adhesive.

### Claim 12 (depends on 10)

The electronic assembly of claim 10, wherein the second substrate is a printed circuit board.

### Claim 13 (depends on 10)

The electronic assembly of claim 10, wherein the second substrate is an interposer.

### Claim 14 (depends on 10)

The electronic assembly of claim 10, wherein the adhesive is an adhesive tape.

### Claim at position 14

15-16. (canceled)

### Claim 17

A method of preventing warpage of components of an electronic assembly during fabrication of the electronic assembly, comprising:
providing a first component having a first surface and a second surface;
applying a first plurality of solder bump structures to the first surface of the first substrate;
applying an adhesive only at or near four corners of the first surface of the first component in order to couple the first component and a second component during high temperature processing and to limit bridging of the solder bump structures and warpage of the first and the second components;
providing the second component;
placing the second component in contact with the plurality of solder bump structures and the adhesive on the first surface of the first substrate; and
thermally processing the first component and the second component after the second component is in contact with the plurality of solder bump structures and after the adhesive on the first surface of the first substrate is cured and has coupled the first component and the second component together.

### Claim 18 (depends on 17)

The method of claim 17, wherein the first component is a die or an IC package substrate.

### Claim 19 (depends on 17)

The method of claim 17, wherein the second component is a PCB, a patch, an interposer or a die.

### Claim 20 (depends on 17)

The method of claim 17, wherein the adhesive is a liquid adhesive or a film adhesive.

### Claim 21 (depends on 1)

The integrated circuit package of claim 1, wherein the adhesive is selected from the group consisting of an epoxy, a polyepoxide, an acrylate, a polyimide, and a polyamide.

### Claim 22 (depends on 10)

The electronic assembly of claim 10, wherein the adhesive is selected from the group consisting of an epoxy, a polyepoxide, an acrylate, a polyimide, and a polyamide.

### Claim 23 (depends on 17)

The method of claim 17, wherein the adhesive is selected from the group consisting of an epoxy, a polyepoxide, an acrylate, a polyimide, and a polyamide.