# US 2017/0287803 A1 · Extended temperature operation for electronic systems using induction heating > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2017/0287803 A1 - Document ID: US20170287803A1 - Status: Published application - Kind: A1 - Application number: 15/089,332 - Filed: 2016-04-01 - Published: 2017-10-05 - Earliest claimed: 2016-04-01 - Assignees: Intel Corporation - Applicants: Intel Corporation - Inventors: Prakriti CHOUDHARY; Arnab CHOUDHURY - Web page: https://patentgrep.com/patent/US20170287803A1 ## CPC - H10W 40/10: Arrangements for heating - H05B 6/06: Control, e.g. of temperature, of power - H05B 6/105: {using a susceptor} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H05B: ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL ## Abstract Embodiments are generally directed to extended temperature operation for electronic systems using induction heating. An embodiment of an apparatus includes an electronic device including: a die or package; a thermal solution coupled with the die or package for cooling of the die or package; and ferromagnetic material, wherein the ferromagnetic material is to generate induction heating of the die or package in response to an alternating magnetic field. ## Claims ### Claim 1 An apparatus comprising: an electronic device including: a die or package, a thermal solution coupled with the die or package for cooling of the die or package, and ferromagnetic material; wherein the ferromagnetic material is to generate induction heating of the die or package in response to an alternating magnetic field. ### Claim 2 (depends on 1) The apparatus of claim 1, further comprising inductor coils, the inductor coils surrounding the electronic device at least in part to generate the alternating magnetic field. ### Claim 3 (depends on 1) The apparatus of claim 1, wherein the thermal solution includes a heatsink. ### Claim 4 (depends on 1) The apparatus of claim 1, wherein the ferromagnetic material is embedded in the thermal solution. ### Claim 5 (depends on 1) The apparatus of claim 1, wherein the ferromagnetic material is disposed between the thermal solution and the die or package. ### Claim 6 (depends on 5) The apparatus of claim 5, wherein the electronic device further includes an integrated heater spreader between the thermal solution and the die or package, and wherein the ferromagnetic material is embedded in the integrated heater spreader. ### Claim 7 A system comprising: an electronic device including: a die or package, a heatsink coupled with the die or package for cooling of the die or package, and ferromagnetic material; and induction coils around the electronic device at least in part; wherein the ferromagnetic material is to generate induction heating of the die or package in response to an alternating magnetic field generated by the induction coils. ### Claim 8 (depends on 7) The system of claim 7, further comprising an oscillator to produce a high frequency alternating current in the induction coils to generate the alternating magnetic field. ### Claim 9 (depends on 8) The system of claim 8, further comprising a control logic to enable and disable operation of the oscillator. ### Claim 10 (depends on 9) The system of claim 9, further comprising a thermal sensor, wherein the control logic is to enable or disable the operation of the oscillator based at least in part on a signal from the thermal sensor. ### Claim 11 (depends on 10) The system of claim 10, wherein the thermal sensor is a part of the electronic device. ### Claim 12 (depends on 10) The system of claim 10, wherein the thermal sensor is external to the electronic device. ### Claim 13 (depends on 7) The system of claim 7, wherein the ferromagnetic material is embedded in a base of the heatsink. ### Claim 14 (depends on 7) The system of claim 7, wherein the ferromagnetic material is disposed between the heatsink and the die or package. ### Claim 15 (depends on 14) The system of claim 14, wherein the electronic device further includes an integrated heater spreader between the heatsink and the die or package, and wherein the ferromagnetic material is embedded in the integrated heater spreader. ### Claim 16 A non-transitory computer-readable storage medium having stored thereon data representing sequences of instructions that, when executed by a processor, cause the processor to perform operations comprising: initializing a system including an electronic device, the electronic device including ferromagnetic material for induction heating; receiving a temperature signal; upon determining based on the temperature signal that a temperature is below a threshold temperature, enabling the induction heating of the electronic device; and upon determining based on the temperature signal that a temperature is above the threshold temperature, disabling the induction heating of the electronic device. ### Claim 17 (depends on 16) The medium of claim 16, wherein the electronic device includes ferromagnetic material, and wherein enabling the induction heating includes enabling an alternating current through induction coils that are coiled around the electronic device at least in part, and wherein disabling the induction heating includes disabling an alternating current through the induction coils. ### Claim 18 (depends on 17) The medium of claim 17, wherein enabling and disabling the alternating current includes enabling or disabling operation of an oscillator. ### Claim 19 (depends on 16) The medium of claim 16, wherein receiving the temperature signal includes receiving the temperature signal from a temperature sensor within the electronic device. ### Claim 20 (depends on 16) The medium of claim 16, wherein receiving the temperature signal includes receiving the temperature signal from a temperature sensor that is external to the electronic device.