# US 2017/0287799 A1 · Removable ic package stiffener

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2017/0287799 A1
- Document ID: US20170287799A1
- Status: Published application
- Kind: A1
- Application number: 15/088,998
- Filed: 2016-04-01
- Published: 2017-10-05
- Earliest claimed: 2016-04-01
- Inventors: Steven A. Klein; Aditya S. Vaidya; Vijay Krishnan Subramanian; Santosh Sankarasubramanian; Pramod Malatkar; Suriyakala Suriya Ramalingam; Ashish Dhall
- Web page: https://patentgrep.com/patent/US20170287799A1

## CPC

- H10W 76/40: Fillings or auxiliary members in containers, e.g. centering rings (fillings or auxiliary members for thermal protection or control in containers or encapsulations H10W40/70)
- H10W 72/877: {Bump connectors and die-attach connectors}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A stiffener, an IC package and methods of fabrication of an IC package including a removable stiffener are shown. A removable stiffener for use with an integrated circuit (IC), including a plurality of adhesive portions disposed between a surface of the stiffener and a surface of a substrate of the IC is shown. Such a removable stiffener including at least one removal tab is shown. An IC package including a removable stiffener including a plurality of adhesive portions disposed between a surface of the stiffener and a surface of a substrate of the IC is shown. Methods of fabrication of an IC package including a removable stiffener are shown.

## Claims

### Claim 1

A stiffener for use with an integrated circuit (IC) including a substrate having a surface, the stiffener comprising:
a planar portion having a first surface and a second surface; and
a plurality of adhesive portions disposed between the second surface of planar portion of the stiffener and the surface of the substrate.

### Claim 2 (depends on 1)

The stiffener of claim 1, wherein the plurality of adhesive portions are located at or near one or more corners of the second surface of the planar portion of the stiffener.

### Claim 3 (depends on 1)

The stiffener of claim 1, wherein the planar portion comprises a rectangular frame including at least one aperture.

### Claim 4 (depends on 1)

The stiffener of claim 1, further comprising at least one removal tab.

### Claim 5 (depends on 4)

The stiffener of claim 4, wherein the at least one removal tab comprises a heat resistant tape.

### Claim 6 (depends on 4)

The stiffener of claim 4, wherein the at least one removal tab comprises a handle.

### Claim 7 (depends on 1)

The stiffener of claim 1, wherein the adhesive is a debonding adhesive.

### Claim 8

An integrated circuit (IC) package, comprising:
an IC, comprising:
at least one die; and
a substrate having a surface, wherein the at least one die is attached to the surface of the substrate; and
a stiffener attached to the IC, comprising:
a planar portion having a first surface and a second surface; and
a plurality of adhesive portions disposed between the second surface of planar portion of the stiffener and the surface of the substrate.

### Claim 9 (depends on 8)

The IC package of claim 8, wherein the plurality of adhesive portions are located at or near one or more corners of the second surface of the planar portion of the stiffener.

### Claim 10 (depends on 8)

The IC package of claim 8, wherein the planar portion comprises a rectangular frame including at least one aperture.

### Claim 11 (depends on 8)

The IC package of claim 8, wherein the planar portion comprises a perimeter frame attached at or near a perimeter of the surface of the substrate, the frame arranged apart from the at least one die on the surface of the substrate.

### Claim 12 (depends on 8)

The IC package of claim 8, wherein the stiffener further comprises at least one removal tab.

### Claim 13 (depends on 12)

The IC package of claim 12, wherein the at least one e oval tab comprises a handle.

### Claim 14 (depends on 12)

The IC package of claim 12, wherein the at least one removal tab comprises a heat resistant tape.

### Claim 15 (depends on 8)

The IC package of claim 8, wherein the adhesive is a debonding adhesive.

### Claim at position 16

-20. (canceled)