# US 2017/0287798 A1 · Baseplate for an electronic module and method of manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2017/0287798 A1 - Document ID: US20170287798A1 - Status: Published application - Kind: A1 - Application number: 15/630,750 - Filed: 2017-06-22 - Published: 2017-10-05 - Earliest claimed: 2014-04-13 - Assignees: Infineon Technologies AG - Applicants: Infineon Technologies AG - Inventors: Fabio BRUCCHI; Davide CHIOLA - Web page: https://patentgrep.com/patent/US20170287798A1 ## CPC - H10W 70/68: Shapes or dispositions thereof - H10W 40/10: Arrangements for heating - H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections - H10W 40/255: {having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates} - H10W 40/258: {Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence)} - H10W 70/023: {Connecting or disconnecting interconnections thereto or therefrom, e.g. connecting bond wires or bumps} - H10W 70/027: {Mechanical treatments, e.g. deforming, punching or cutting} - H10W 70/24: {characterised by materials} - H10W 70/479: {on or in insulating or insulated package substrates, interposers, or redistribution layers} - H10W 70/65: Shapes or dispositions of interconnections - H10W 74/016: {using moulds} - H10W 74/114: {by a substrate and the encapsulations} - H10W 90/00: Package configurations - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H10W 70/682: {comprising holes having chips therein} - H10W 72/352: {comprising metals or metalloids, e.g. solders} - H10W 72/354: {comprising polymers} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Various embodiments provide an electronic module comprising a baseplate. A recess is formed in one main surface of the baseplate, wherein the recess is adapted to accommodate an electronic chip. The electronic chip is attached to a substrate or carrier and is placed in the recess. ## Claims ### Claim 1 An electronic module, the electronic module comprising: a baseplate; a recess being formed in one main surface of the baseplate, wherein the recess is adapted to accommodate an electronic chip, the electronic chip being attached to a substrate or carrier; and the electronic chip being placed in the recess. ### Claim 2 (depends on 1) The electronic module according to claim 1, wherein the electronic chip is a pre-packaged dice. ### Claim 3 (depends on 1) The electronic module according to claim 1, the electronic chip being attached to the baseplate. ### Claim 4 (depends on 1) The electronic module according to claim 1, the electronic chip being adhered to the baseplate. ### Claim 5 (depends on 1) The electronic module according to claim 1, further comprising an insulating layer arranged on the one main surface of the baseplate. ### Claim 6 (depends on 1) The electronic module according to claim 1, further comprising a mold compound at least partially encapsulating the baseplate and the electronic chip placed in the recess of the baseplate. ### Claim 7 (depends on 1) The electronic module according to claim 1, further comprising at least one terminal arranged to contact the electronic chip with an exterior of the electronic module. ### Claim 8 (depends on 1) The electronic module according to claim 1, comprising a plurality of baseplates each having formed therein a recess in one main surface of the baseplate, wherein the recess is adapted to accommodate an electronic chip; and a plurality of electronic chips being placed in the plurality of recesses of the plurality of baseplates. ### Claim 9 (depends on 8) The electronic module according to claim 8, further comprising at least two of the plurality of baseplates stacked on top of each other. ### Claim 10 (depends on 1) The electronic module according to claim 1, wherein the electronic module is a power module and the baseplate consists of electrically conductive material. ### Claim 11 (depends on 1) The electronic module according to claim 1, wherein the recess is a recess being formed by one process out of the group consisting of: drilling; machining; milling; etching; punching; stamping; extruding; cold extruding; and 3D-printing. ### Claim 12 (depends on 1) The electronic module according to claim 1 herein the baseplate comprises a conductive material. ### Claim 13 (depends on 1) The electronic module according to claim 1, the recess being formed with a depth adapted to fully accommodate the electronic chip. ### Claim 14 (depends on 1) The electronic module according to claim 1, wherein the baseplate has a thickness in the range between 2 mm and 10 mm. ### Claim 15 (depends on 12) The electronic module according to claim 12, wherein the baseplate comprises a material selected out of the group consisting of: aluminum; brass; copper; and Metal Matrix Composite. ### Claim 16 (depends on 1) The electronic module according to claim 1, further comprising: a contact area being formed in the recess. ### Claim 17 An electronic power module, the electronic power module comprising: a baseplate consisting of an electrically conductive material; a recess being formed in one main surface of the baseplate; an electronic chip being attached to a substrate or carrier; and the electronic chip being placed in the recess.