# US 2017/0287764 A1 · Electrostatic chuck device

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- Number: US 2017/0287764 A1
- Document ID: US20170287764A1
- Status: Published application
- Kind: A1
- Application number: 15/510,224
- Filed: 2015-09-24
- Published: 2017-10-05
- Earliest claimed: 2014-09-30
- Assignees: Sumitomo Osaka Cement Co., Ltd.
- Applicants: Sumitomo Osaka Cement Co., Ltd.
- Inventors: Hitoshi KOUNO; Kentaro TAKAHASHI; Fumihiro GOBOU
- Web page: https://patentgrep.com/patent/US20170287764A1

## CPC

- H10P 72/722: {Details of electrostatic chucks}
- H02N 13/00: Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
- H05K 7/20009: {using a gaseous coolant in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954)}
- H10P 50/242: {of Group IV materials}
- H10P 72/0434: {mainly by convection}
- H10P 72/72: using electrostatic chucks
- H10P 72/7611: {characterised by edge profile or support profile}
- B23Q 3/15: Devices for holding work using magnetic or electric force acting directly on the work
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H02N: ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- B23Q: DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING (tools of the kind used in lathes or boring machines B23B27/00); MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT

## Abstract

The present invention provides an electrostatic chuck device capable of increasing the electrostatic adsorptive force for a focus ring and uniformly cooling the focus ring. In an electrostatic chuck device (10) of the present invention, a mounting table (11) has a holder (15) being provided in the periphery of a placing surface (24a) along the circumferential direction of a focus ring (12) and electrostatically adsorbing the focus ring (12), the holder (15) has a pair of banks (16) being provided in the circumferential direction and being for placing the focus ring (12) thereon, and an annular groove (17) formed between these banks, and, in at least a bank (16A) on an outer circumferential position of the focus ring (12) among the pair of the banks (16), a micro-protruding part including a plurality of micro-protrusions is formed on a surface facing the focus ring (12), or convex parts (18) are provided on a bottom (17a) of the groove (17). The convex parts (18) do not come into contact with the focus ring, and the pair of the banks (16) or the plurality of the micro-protrusions comes into contact with the focus ring (12) and electrostatically adsorbs the focus ring (12) in coordination with the convex parts (18).

## Claims

### Claim 1

An electrostatic chuck device, comprising:
a mounting table provided with a placing surface on which a plate-like specimen is to be placed;
an annular focus ring being placed on the mounting table and surrounding a periphery of the placing surface; and
a cooler for cooling the mounting table and the focus ring;
wherein:
the mounting table comprises a holder for electrostatically adsorbing the focus ring, the holder being provided in a periphery of the placing surface along a circumferential direction of the focus ring,
the holder comprises a pair of banks being provided in a circumferential direction and being for placing the focus ring thereon, and an annular groove formed between the pair of the banks,
the cooler provides a heat-transferring gas to the groove,
convex parts are provided on a bottom of the groove,
the pair of the banks is in contact with the focus ring,
the convex parts are not in contact with the focus ring, and
the pair of the banks and the convex parts electrostatically adsorb the focus ring in a coordinating fashion.

### Claim 2 (depends on 1)

The electrostatic chuck device according to claim 1, wherein the convex part comprises a plurality of protruding portions.

### Claim 3 (depends on 1)

The electrostatic chuck device according to claim 1, wherein the convex part comprises protruded strips.

### Claim 4 (depends on 1)

The electrostatic chuck device according to claim 1, wherein an area of the convex parts is 10% or more and 80% or less of an area of the groove.

### Claim 5 (depends on 1)

The electrostatic chuck device according to claim 1, wherein a distance between a lower surface of the focus ring and a peak of the convex part is 1 μm or more and 10 μm or less.

### Claim 6

An electrostatic chuck device, comprising:
a mounting table provided with a placing surface on which a plate-like specimen is to be placed;
an annular focus ring being placed on the mounting table and surrounding a periphery of the placing surface; and
a cooler for cooling the mounting table and the focus ring;
wherein:
the mounting table comprises a holder for electrostatically adsorbing the focus ring, the holder being provided in a periphery of the placing surface along a circumferential direction of the focus ring,
the holder comprises a pair of banks being provided in a circumferential direction and being for placing the focus ring thereon, and an annular groove formed between the pair of the banks,
a micro-protruding part comprising a plurality of a micro-protrusions is formed on a surface facing the focus ring in at least on a bank on an outer circumferential position of the focus ring among the pair of the banks,
the cooler provides a heat-transferring gas to the groove, and
the plurality of the micro-protrusions is in contact with the focus ring and electrostatically adsorbs the focus ring.

### Claim 7 (depends on 6)

The electrostatic chuck device according to claim 6, wherein:
the micro-protruding part is formed on a surface facing the focus ring in both of the pair of the banks, and
the plurality of the micro-protrusions is in contact with the focus ring and electrostatically adsorbs the focus ring.

### Claim 8 (depends on 6)

The electrostatic chuck device according to claim 6, wherein an amount of the heat-transferring gas flowing out of one of the pair of the banks on an outer circumferential position of the focus ring is larger than an amount of the heat-transferring gas flowing out of the other bank of the pair.

### Claim 9 (depends on 7)

The electrostatic chuck device according to claim 7, wherein a distance between the plurality of the micro-protrusions provided on the bank on the outer circumference of the focus ring is larger than a distance between the plurality of micro-protrusions provided on the bank on the inner circumference of the focus ring.

### Claim 10 (depends on 7)

The electrostatic chuck device according to claim 7, wherein a height of the plurality of the micro-protrusions provided on the bank on the outer circumference of the focus ring is higher than a height of the plurality of the micro-protrusions provided on the bank on the inner circumference of the focus ring.

### Claim 11 (depends on 6)

The electrostatic chuck device according to claim 6, wherein
convex parts are provided on a bottom of the groove, and
the convex parts are not in contact with the focus ring, and electrostatically adsorb the focus ring.

### Claim 12 (depends on 11)

The electrostatic chuck device according to claim 11, wherein the convex part comprises a plurality of protrusions.

### Claim 13 (depends on 11)

The electrostatic chuck device according to claim 11, wherein the convex part comprises protruding strips.

### Claim 14 (depends on 1)

The electrostatic chuck device according to claim 1, wherein
the mounting table comprises a placing surface made of a dielectric layer, in which a material for forming the dielectric layer is one type of ceramic selected from the group consisting of: aluminum nitride (AlN), aluminum oxide (Al2O3), silicon nitride (Si3N4), yttrium oxide (Y2O3), and silicon carbide (SiC); or a complex ceramic consisting of two or more types selected from the group.

### Claim 15 (depends on 14)

The electrostatic chuck device according to claim 14, wherein the material for forming the dielectric layer is ceramics material having an average crystal grain diameter of 10 μm or less.