# US 2017/0287750 A1 · Management method of substrate processing apparatus and substrate processing system

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- Number: US 2017/0287750 A1
- Document ID: US20170287750A1
- Status: Published application
- Kind: A1
- Application number: 15/454,346
- Filed: 2017-03-09
- Published: 2017-10-05
- Earliest claimed: 2016-03-30
- Assignees: Tokyo Electron Limited
- Applicants: Tokyo Electron Limited
- Inventors: Yoshifumi Amano; Satoshi Morita; Ryoji Ikebe; Isamu Miyamoto
- Web page: https://patentgrep.com/patent/US20170287750A1

## CPC

- H10P 72/0604: {Process monitoring, e.g. flow or thickness monitoring}
- H10P 72/0406: {for cleaning followed by drying, rinsing, stripping, blasting or the like}
- H10P 72/0442: {Apparatus for placing on an insulating substrate, e.g. tape}
- H10P 72/0606: {Position monitoring, e.g. misposition detection or presence detection}
- H10P 72/0616: {Monitoring of warpages, curvatures, damages, defects or the like}
- H10P 72/53: {using optical controlling means}
- H10P 74/23: {characterised by multiple measurements, corrections, marking or sorting processes}
- H10P 74/203: {Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects}
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

A measurement processing process S103 of measuring a cut width of a film based on an image obtained by imaging, with an imaging unit 270, a peripheral portion of a substrate which is processed based on a substrate processing recipe; a creation process S602 of creating a management list in which a set value of the cut width of the film, a measurement value of the cut width of the film measured through the measurement processing process and time information at which the measurement result is obtained are correlated; an analysis process S603 (S606) of analyzing a state of the processed substrate based on the created management list; and a notification process S605 (S608, S609) of making a preset notification to a user based on an analysis result obtained through the analysis process are provided.

## Claims

### Claim 1

A management method of a substrate processing apparatus including a rotating/holding unit configured to hold and rotate a substrate; a processing liquid supply unit configured to supply a processing liquid for removing a film on a peripheral portion of the substrate; and an imaging unit configured to image the peripheral portion of the substrate, the management method of the substrate processing apparatus comprising:
a recipe acquisition process of acquiring a substrate processing recipe including a set value of a cut width of the film;
a measurement processing process of measuring the cut width of the film based on an image obtained by imaging, with the imaging unit, the peripheral portion of the substrate which is processed based on the substrate processing recipe;
a creation process of creating a management list in which the set value of the cut width of the film, a measurement value of the cut width of the film measured through the measurement processing process and time information at which a measurement result is obtained are correlated;
an analysis process of analyzing a state of the processed substrate based on the created management list; and
a notification process of making a preset notification to a user based on an analysis result obtained through the analysis process.

### Claim 2 (depends on 1)

The management method of the substrate processing apparatus of claim 1,
wherein whether a difference between the set value and the measurement value of the cut width of the film exceeds a preset threshold value is determined in the analysis process, and
if it is determined that the difference exceeds the preset threshold value, the preset notification is made in the notification process.

### Claim 3 (depends on 2)

The management method of the substrate processing apparatus of claim 2,
wherein the preset threshold value includes a first threshold value and a second threshold value smaller than the first threshold value,
whether the difference between the set value and the measurement value of the cut width of the film exceeds the first threshold value and the second threshold value is determined in the analysis process, and
a content of the notification is changed in the notification process depending on which of the first threshold value and the second threshold value the difference exceeds.

### Claim 4 (depends on 1)

The management method of the substrate processing apparatus of claim 1,
wherein information upon an eccentric amount of the substrate with respect to the rotating/holding unit is measured in the measurement processing process,
the measured information upon the eccentric amount is related to the management list in the creation process,
whether the eccentric amount of the management list exceeds a preset threshold value is determined in the analysis process,
if it is determined that the eccentric amount exceeds the preset threshold value, the preset notification is made in the notification process.

### Claim 5 (depends on 1)

The management method of the substrate processing apparatus of claim 1,
wherein, in the notification process, a graph showing a change of the measurement result with the lapse of time is created based on the management list created in the creation process.

### Claim 6 (depends on 1)

The management method of the substrate processing apparatus of claim 1,
wherein the notification is visually made by using a display device in the notification process.

### Claim 7 (depends on 2)

The management method of the substrate processing apparatus of claim 2,
wherein information upon an eccentric amount of the substrate with respect to the rotating/holding unit is measured in the measurement processing process,
the measured information upon the eccentric amount is related to the management list in the creation process,
whether the eccentric amount of the management list exceeds a preset threshold value is determined in the analysis process,
if it is determined that the eccentric amount exceeds the preset threshold value, the preset notification is made in the notification process.

### Claim 8 (depends on 2)

The management method of the substrate processing apparatus of claim 2,
wherein, in the notification process, a graph showing a change of the measurement result with the lapse of time is created based on the management list created in the creation process.

### Claim 9 (depends on 2)

The management method of the substrate processing apparatus of claim 2,
wherein the notification is visually made by using a display device in the notification process.

### Claim 10 (depends on 3)

The management method of the substrate processing apparatus of claim 3,
wherein information upon an eccentric amount of the substrate with respect to the rotating/holding unit is measured in the measurement processing process,
the measured information upon the eccentric amount is related to the management list in the creation process,
whether the eccentric amount of the management list exceeds a preset threshold value is determined in the analysis process,
if it is determined that the eccentric amount exceeds the preset threshold value, the preset notification is made in the notification process.

### Claim 11 (depends on 3)

The management method of the substrate processing apparatus of claim 3,
wherein, in the notification process, a graph showing a change of the measurement result with the lapse of time is created based on the management list created in the creation process.

### Claim 12 (depends on 3)

The management method of the substrate processing apparatus of claim 3,
wherein the notification is visually made by using a display device in the notification process.

### Claim 13 (depends on 4)

The management method of the substrate processing apparatus of claim 4,
wherein, in the notification process, a graph showing a change of the measurement result with the lapse of time is created based on the management list created in the creation process.

### Claim 14 (depends on 4)

The management method of the substrate processing apparatus of claim 4,
wherein the notification is visually made by using a display device in the notification process.

### Claim 15 (depends on 5)

The management method of the substrate processing apparatus of claim 5,
wherein the notification is visually made by using a display device in the notification process.

### Claim 16

A substrate processing system including a substrate processing apparatus configured to perform a processing of removing a film on a peripheral portion of a substrate; a measurement processing device configured to perform a measurement processing based on an image; an information processing device configured to manage information upon the measurement processing; and a control device configured to control the substrate processing apparatus,
wherein the substrate processing apparatus comprises:
a rotating/holding unit configured to hold and rotate the substrate;
a processing liquid supply unit configured to supply a processing liquid for removing the film onto the peripheral portion of the substrate; and
an imaging unit configured to image the peripheral portion of the substrate,
wherein the measurement processing device comprises:
a controller configured to measure a cut width of the film based on the image obtained by imaging the peripheral portion of the substrate which is processed based on a substrate processing recipe including a set value of the cut width of the film,
wherein the information processing device comprises:
a controller configured to create a management list in which identification information of the substrate, the set value of the cut width of the film, a measurement value of the cut width of the film and time information at which a measurement result is obtained are correlated and configured to analyze a state of the processed substrate based on the created management list, and
wherein the control device comprises:
a controller configured to make a preset notification to a user based on an analysis result of the information processing device.
