# US 2017/0287746 A1 · Substrate transfer method and processing system

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2017/0287746 A1
- Document ID: US20170287746A1
- Status: Published application
- Kind: A1
- Application number: 15/512,244
- Filed: 2015-09-07
- Published: 2017-10-05
- Earliest claimed: 2014-09-19
- Assignees: Tokyo Electron Limited
- Applicants: Tokyo Electron Limited
- Inventors: Keisuke KONDOH
- Web page: https://patentgrep.com/patent/US20170287746A1

## CPC

- H10P 72/0432: {mainly by conduction}
- H10P 72/0454: {surrounding a central transfer chamber}
- H10P 72/32: {between different workstations}
- H10P 72/3304: {characterised by movements or sequence of movements of transfer devices}
- H10P 72/7602: {the wafers being placed on a robot blade or gripped by a gripper for conveyance}
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

Provided is a substrate transfer method for sequentially transferring a substrate between a heat treatment chamber and another chamber different from the heat treatment chamber using a transfer unit having a first pick and a second pick. An unprocessed substrate is held by the first pick, and the substrate is transferred to the heat treatment chamber. A processed substrate, heat-treated in the heat treatment chamber, is held by the second pick, and the unprocessed substrate held by the first pick is loaded into the heat treatment chamber. The processed substrate held by the second pick is transferred to the other chamber. An unprocessed substrate in the other chamber is held by the first pick, the processed substrate held by the second pick is loaded into the other chamber, and then both the first pick and the second pick are put into a state of not holding a substrate.

## Claims

### Claim 1

A substrate transfer method for sequentially transferring a substrate between a heat treatment chamber and another chamber different from the heat treatment chamber by using a transfer unit having a first pick and a second pick, the method comprising:
a first process of holding an unprocessed substrate by the first pick and transferring the unprocessed substrate to the heat treatment chamber;
a second process of holding a processed substrate, which has been subjected to heat treatment in the heat treatment chamber, by the second pick, unloading the processed substrate from the heat treatment chamber, and loading the unprocessed substrate held by the first pick into the heat treatment chamber;
a third process of transferring the processed substrate held by the second pick to said another chamber; and
a fourth process of holding an unprocessed substrate in said another chamber by the first pick, loading the processed substrate held by the second pick into said another chamber, and then putting both the first pick and the second pick into a state of not holding a substrate.

### Claim 2 (depends on 1)

The method of claim 1, further comprising, after the fourth process, a fifth process of holding the unprocessed substrate, by the second pick and switching functions of the first pick and the second pick between holding an unprocessed substrate and holding a processed substrate.

### Claim 3 (depends on 1)

The method of claim 1, wherein the fourth process is performed while a substrate is being subjected to the heat treatment in the heat treatment chamber.

### Claim 4 (depends on 1)

The method of claim 1, wherein a plurality of substrates is subjected to the heat treatment at the same time in the heat treatment chamber, and
in the fourth process, both of the first pick and the second pick are put into the state of not holding a substrate after, among the substrates subjected to the heat treatment at the same time, a last processed substrate held by the second pick is loaded into said another chamber.

### Claim 5 (depends on 1)

The method of claim 1, wherein in the fourth process, both of the first pick and the second pick are put into the state of not holding a substrate by temporarily mounting the unprocessed substrate held by the first pick on a buffer unit.

### Claim 6 (depends on 1)

The method of claim 1, wherein the heat treatment chamber is provided in plural number, and
the fourth process is performed while the heat treatment on substrates is being performed in the respective heat treatment chambers.

### Claim 7 (depends on 1)

A processing system for performing heat treatment on a substrate sequentially transferred between a heat treatment chamber and another chamber different from the heat treatment chamber by using the substrate transfer method of claim 1.