# US 2017/0287735 A1 · Electronic device package > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2017/0287735 A1 - Document ID: US20170287735A1 - Status: Published application - Kind: A1 - Application number: 15/089,136 - Filed: 2016-04-01 - Published: 2017-10-05 - Earliest claimed: 2016-04-01 - Assignees: Intel Corporation - Applicants: Intel Corporation - Inventors: Jimin Yao; Eric Li; Shawna Liff - Web page: https://patentgrep.com/patent/US20170287735A1 ## CPC - H10W 74/012: {of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills} - H10W 74/016: {using moulds} - H10W 74/141: {the encapsulations being on at least the sidewalls of the semiconductor body} - H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills - H10W 72/072: {of bump connectors} - H10W 72/073: {of die-attach connectors} - H10W 72/387: {Flow barriers} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Electronic device package technology is disclosed. In one example, an electronic device package can include a substrate, an electronic component disposed on the substrate and electrically coupled to the substrate, and an underfill material disposed at least partially between the electronic component and the substrate. A lateral portion of the underfill material can comprises a lateral surface extending away from the substrate and a meniscus surface extending between the lateral surface and the electronic component. ## Claims ### Claim 1 An electronic device package, comprising: a substrate; an electronic component disposed on the substrate and electrically coupled to the substrate; and an underfill material disposed at least partially between the electronic component and the substrate, wherein a lateral portion of the underfill material comprises an exposed a lateral surface extending away from the substrate and intersecting a meniscus surface extending between the lateral surface and the electronic component. ### Claim 2 (canceled) ### Claim 3 (depends on 1) The electronic device package of claim 1, wherein an intersection of the meniscus surface and the lateral surface defines an edge. ### Claim 4 (depends on 1) The electronic device package of claim 1, wherein the lateral surface comprises an irregular surface. ### Claim 5 (depends on 1) The electronic device package of claim 1, wherein a height of the lateral surface from the substrate is greater than a gap between the electronic component and the substrate. ### Claim 6 (depends on 1) The electronic device package of claim 1, wherein the electronic component comprises a semiconductor device. ### Claim 7 (depends on 1) The electronic device package of claim 1, wherein the electronic component is coupled to the substrate through a plurality of solder bumps. ### Claim 8 An electronic device package, comprising: a substrate; an electronic component disposed on the substrate and electrically coupled to the substrate; and an underfill material disposed at least partially between the electronic component and the substrate, wherein a lateral portion of the underfill material extends from a lateral side of the electronic component to the substrate, the lateral portion of the underfill material having an edge between two surfaces of the underfill material, and wherein one of the two surfaces of the underfill material comprises an exposed lateral surface that extends from the substrate. ### Claim 9 (canceled) ### Claim 10 (canceled) ### Claim 11 (depends on 8) The electronic device package of claim 8, wherein the lateral surface comprises an irregular surface. ### Claim 12 (depends on 8) The electronic device package of claim 8, wherein a height of the lateral surface from the substrate is greater than a gap between the electronic component and the substrate. ### Claim 13 (depends on 8) The electronic device package of claim 8, wherein the electronic component comprises a semiconductor device. ### Claim 14 (depends on 8) The electronic device package of claim 8, wherein the electronic component is coupled to the substrate through a plurality of solder bumps. ### Claim 15 A method for making an electronic device package, comprising: disposing an electronic component on a substrate, such that the electronic component is electrically coupled to the substrate; forming a barrier with a sacrificial material about at least a portion of the electronic component; disposing an underfill material at least partially between the electronic component and the substrate, wherein flow of the underfill material is mechanically inhibited at least partially by the barrier; and removing the barrier. ### Claim 16 (depends on 15) The method of claim 15, wherein forming the barrier comprises dispensing the sacrificial material on the substrate. ### Claim 17 (depends on 15) The method of claim 15, wherein forming the barrier comprises printing the sacrificial material on the substrate. ### Claim 18 (depends on 17) The method of claim 17, wherein printing the sacrificial material on the substrate comprises disposing a stencil about the substrate, the stencil having an aperture corresponding to a location of the barrier. ### Claim 19 (depends on 18) The method of claim 18, wherein printing the sacrificial material on the substrate further comprises causing the sacrificial material to pass through the aperture and onto the substrate. ### Claim 20 (depends on 19) The method of claim 19, wherein printing the sacrificial material on the substrate further comprises removing the stencil. ### Claim 21 (depends on 19) The method of claim 19, wherein printing the sacrificial material on the substrate further comprises drying the sacrificial material. ### Claim 22 (depends on 15) The method of claim 15, wherein removing the barrier comprises heating the sacrificial material. ### Claim 23 (depends on 22) The method of claim 22, wherein the sacrificial material is thermally decomposed. ### Claim 24 (depends on 15) The method of claim 15, wherein removing the barrier comprises dissolving the sacrificial material. ### Claim 25 (depends on 24) The method of claim 24, wherein the sacrificial material is water soluble.