# US 2017/0287704 A1 · Substrate processing apparatus, control method of substrate processing apparatus and substrate processing system > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2017/0287704 A1 - Document ID: US20170287704A1 - Status: Published application - Kind: A1 - Application number: 15/454,269 - Filed: 2017-03-09 - Published: 2017-10-05 - Earliest claimed: 2016-03-30 - Assignees: Tokyo Electron Limited - Applicants: Tokyo Electron Limited - Inventors: Yoshifumi Amano; Satoshi Morita; Ryoji Ikebe; Isamu Miyamoto - Web page: https://patentgrep.com/patent/US20170287704A1 ## CPC - H10P 74/23: {characterised by multiple measurements, corrections, marking or sorting processes} - H10P 72/0424: {using mainly spraying means, e.g. nozzles} - H10P 72/0604: {Process monitoring, e.g. flow or thickness monitoring} - H10P 72/0606: {Position monitoring, e.g. misposition detection or presence detection} - G05B 2219/45031: Manufacturing semiconductor wafers - H10P 74/203: {Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - G05B: CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS (systems for controlling or regulating non-electric variables G05D; systems for regulating electric or magnetic variables G05F; control devices or systems insofar as characterised by mechanical features only G05G) ## Abstract Whether a film on a peripheral portion of a substrate is appropriately removed is rapidly determined without depending on a kind of the film on the peripheral portion to be removed. An acquisition process S502 of acquiring information upon the kind of the film of the substrate; a selection process S503 of selecting a measurement setting corresponding to the acquired kind of the film from a table for measurement settings previously stored in a storage unit; a control process S504 of controlling an imaging unit 270 to image the peripheral portion of the substrate by using the measurement setting selected in the selection process are provided. ## Claims ### Claim 1 A control method of a substrate processing apparatus including a rotating/holding unit configured to hold and rotate a substrate; a processing liquid supply unit configured to supply a processing liquid for removing a film on a peripheral portion of the substrate; and an imaging unit configured to image the peripheral portion of the substrate, the control method of the substrate processing apparatus comprising: an acquisition process of acquiring information upon a kind of the film of the substrate; a selection process of selecting a measurement setting corresponding to the acquired kind of the film from a table for measurement settings previously stored in a storage unit; a control process of controlling the imaging unit to image the peripheral portion of the substrate by using the measurement setting selected in the selection process. ### Claim 2 (depends on 1) The control method of the substrate processing apparatus of claim 1, wherein imaging conditions for brightness are stored as the measurement settings in the storage unit, and the imaging condition suitable for the acquired kind of the film is selected in the selection process. ### Claim 3 (depends on 2) The control method of the substrate processing apparatus of claim 2, wherein the imaging conditions having different brightness levels and suitable for the acquired kind of the film are selected in the selection process, and the substrate is imaged plural times by the imaging unit under the imaging conditions having different brightness levels in the control process. ### Claim 4 (depends on 1) The control method of the substrate processing apparatus of claim 1, wherein setting information on a to-be-removed width of the film on the peripheral portion of the substrate is further acquired in the acquisition process, and the measurement setting corresponding to the setting information of the to-be-removed width and the kind of the film is selected in the selection process. ### Claim 5 (depends on 1) The control method of the substrate processing apparatus of claim 1, wherein the information upon the kind of the film of the substrate is acquired from a substrate processing recipe using the substrate processing apparatus in the acquisition process. ### Claim 6 (depends on 2) The control method of the substrate processing apparatus of claim 2, wherein setting information on a to-be-removed width of the film on the peripheral portion of the substrate is further acquired in the acquisition process, and the measurement setting corresponding to the setting information of the to-be-removed width and the kind of the film is selected in the selection process. ### Claim 7 (depends on 2) The control method of the substrate processing apparatus of claim 2, wherein the information upon the kind of the film of the substrate is acquired from a substrate processing recipe using the substrate processing apparatus in the acquisition process. ### Claim 8 (depends on 3) The control method of the substrate processing apparatus of claim 3, wherein setting information on a to-be-removed width of the film on the peripheral portion of the substrate is further acquired in the acquisition process, and the measurement setting corresponding to the setting information of the to-be-removed width and the kind of the film is selected in the selection process. ### Claim 9 (depends on 3) The control method of the substrate processing apparatus of claim 3, wherein the information upon the kind of the film of the substrate is acquired from a substrate processing recipe using the substrate processing apparatus in the acquisition process. ### Claim 10 (depends on 4) The control method of the substrate processing apparatus of claim 4, wherein the information upon the kind of the film of the substrate is acquired from a substrate processing recipe using the substrate processing apparatus in the acquisition process. ### Claim 11 A substrate processing apparatus which performs a processing of removing a film on a peripheral portion of a substrate, the substrate processing apparatus comprising: a rotating/holding unit configured to rotate the substrate while attracting and holding the substrate from a bottom surface thereof; a processing liquid supply unit configured to supply a processing liquid for removing the film onto the peripheral portion of the substrate while the substrate is being rotated by the rotating/holding unit; and an imaging unit configured to image the peripheral portion of the substrate, wherein the imaging unit is allowed to set a plurality of different imaging conditions selectively and is configured to image the peripheral portion of the substrate by using the imaging condition selected depending on a kind of the film of the substrate. ### Claim 12 A substrate processing system including a substrate processing apparatus configured to perform a processing of removing a film on a peripheral portion of a substrate; a measurement processing device configured to perform a measurement processing based on an image; and an information processing device configured to manage information upon the measurement processing, wherein the substrate processing apparatus comprises: a rotating/holding unit configured to rotate the substrate while attracting and holding the substrate from a bottom surface thereof; a processing liquid supply unit configured to supply a processing liquid for removing the film onto the peripheral portion of the substrate while the substrate is being rotated by the rotating/holding unit; and an imaging unit configured to image the peripheral portion of the substrate, wherein the information processing device comprises: a controller configured to acquire information upon a kind of the film of the substrate and select a measurement setting corresponding to the acquired kind of the film from a plurality of measurement settings, and wherein the measurement processing device comprises: a controller configured to control the imaging unit to image the peripheral portion of the substrate by using the measurement setting selected by the information processing device.