# US 2017/0287699 A1 · Substrate processing apparatus, liquid processing method, and storage medium

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- Number: US 2017/0287699 A1
- Document ID: US20170287699A1
- Status: Published application
- Kind: A1
- Application number: 15/464,679
- Filed: 2017-03-21
- Published: 2017-10-05
- Earliest claimed: 2016-03-30
- Assignees: Tokyo Electron Limited
- Applicants: Tokyo Electron Limited
- Inventors: Akira Fujita; Tsuyoshi Mizuno
- Web page: https://patentgrep.com/patent/US20170287699A1

## CPC

- H10P 70/15: {by wet cleaning only (H10P70/52 takes precedence)}
- B08B 3/02: Cleaning by the force of jets or sprays
- B08B 3/041: {Cleaning travelling work}
- B08B 3/08: the liquid having chemical or dissolving effect
- C23F 1/02: Local etching
- C23F 1/08: Apparatus, e.g. for photomechanical printing surfaces (photo- mechanical reproduction G03F)
- C23F 1/16: Acidic compositions (C23F1/42 takes precedence)
- C23F 1/32: Alkaline compositions (C23F1/42 takes precedence)
- G03F 7/168: {Finishing the coated layer, e.g. drying, baking, soaking}
- H10P 72/0414: {using mainly spraying means, e.g. nozzles}
- H10P 72/0604: {Process monitoring, e.g. flow or thickness monitoring}
- H10P 72/7618: {characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel}
- H10P 74/23: {characterised by multiple measurements, corrections, marking or sorting processes}
- H10P 70/54: {Cleaning of wafer edges}
- H10P 74/203: {Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects}
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- B08B: CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- C23F: NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE (working metal by laser beams B23K26/00; desurfacing by applying flames B23K7/00; working of metal by electro-erosion B23H; producing decorative effects by removing surface material, e.g. by engraving, by etching, B44C1/22; electrolytic etching or polishing C25F); INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G)

## Abstract

Provided is a substrate processing apparatus that removes a film by supplying a processing liquid to the peripheral edge of a substrate. An ejection unit ejects the processing liquid to the peripheral edge of the substrate held and rotated by a substrate holding unit. An ejection position setting unit sets the ejection position of the processing liquid of the ejection unit to correspond to the removal width of the film included in a recipe, and a property information acquisition unit acquires property information of the film to be removed. A correction amount acquisition unit acquires the correction amount for correcting the ejection position of the processing liquid based on the property information of the film, and an ejection position correction unit corrects the ejection position of the processing liquid by the ejection unit based on the correction amount acquired by the correction amount acquisition unit.

## Claims

### Claim 1

A substrate processing apparatus that removes a film on a peripheral edge of a substrate by supplying a processing liquid to the substrate, the substrate processing apparatus comprising:
a substrate holding unit configured to hold the substrate and including a rotation mechanism configured to rotate the substrate;
an ejection unit configured to eject the processing liquid to the peripheral edge of the substrate held by the substrate holding unit;
an ejection position setting unit configured to set an ejection position of the processing liquid to correspond to a removal width of the film included in an input recipe;
a movement mechanism configured to move the ejection position of the processing liquid from the ejection unit toward a diametric direction of the substrate based on the ejection position set by the ejection position setting unit;
a property information acquisition unit configured to acquire property information of the film to be removed;
a correction amount acquisition unit configured to acquire a correction amount for correcting the ejection position set by the ejection position setting unit, based on the property information of the film acquired by the property information acquisition unit; and
an ejection position correction unit configured to correct the ejection position set by the ejection position setting unit, based on the correction amount acquired by the correction amount acquisition unit.

### Claim 2 (depends on 1)

The apparatus of claim 1, wherein the property information of the film is type information of the film.

### Claim 3 (depends on 1)

The apparatus of claim 1, wherein the property information of the film is physical property information of the film.

### Claim 4 (depends on 3)

The apparatus of claim 3, wherein the physical property information of the film is a hardness or a film thickness of the film.

### Claim 5 (depends on 1)

The apparatus of claim 1, wherein the property information acquisition unit includes an analysis sensor, and acquires the property information based on a result of analyzing the film formed on the substrate by the analysis sensor.

### Claim 6 (depends on 5)

The apparatus of claim 5, wherein the substrate holding unit, the movement unit, and the analysis sensor are disposed in a common chamber.

### Claim 7 (depends on 1)

The apparatus of claim 1, wherein the property information acquisition unit acquires the property information via communication with an outside.

### Claim 8 (depends on 1)

The apparatus of claim 1, wherein the correction amount acquisition unit acquires at least one of a rotation number correction amount for correcting a rotation number per unit time of the substrate rotated by the rotation mechanism, and a correction flow rate for correcting a supply flow rate of the processing liquid ejected from the ejection unit, depending on the property information of the film acquired by the property information acquisition unit, and
wherein the rotation mechanism corrects the rotation number of the substrate based on the rotation number correction amount, and the processing liquid supply unit corrects the supply flow rate of the processing liquid based on the correction flow rate.

### Claim 9

A liquid processing method for removing a film on a peripheral edge of a substrate by supplying a processing liquid to the substrate, the liquid processing method comprising:
an ejection position setting process of setting an ejection position of the processing liquid from an ejection unit, which is disposed opposite to the peripheral edge of the substrate, to correspond to a removal width of the film included in a recipe;
a property information acquisition process of acquiring property information of the film to be removed;
a correction amount acquisition process of acquiring a correction amount for correcting the ejection position set in the ejection position setting process, based on the property information of the film acquired in the property information acquisition process;
an ejection position correction process of correcting the ejection position set in the ejection position setting process, based on the correction amount acquired in the correction amount acquisition process;
an ejection unit movement process of moving the ejection unit to an ejection execution position corrected in the ejection position correction process; and
a removal process of removing the film on the peripheral edge by supplying the processing liquid to the peripheral edge of the substrate that is being rotated by ejecting the processing liquid from the ejection unit moved to the ejection execution position.

### Claim 10 (depends on 9)

The method of claim 9, wherein the property information of the film is type information of the film.

### Claim 11 (depends on 9)

The method of claim 9, wherein the property information of the film is physical property information of the film.

### Claim 12 (depends on 11)

The method of claim 11, wherein the physical property information of the film is a hardness of the film or a film thickness.

### Claim 13 (depends on 9)

The method of claim 9, wherein, in the property information acquisition process, the property information is acquired based on a result of analyzing the film formed on the substrate by an analysis sensor.

### Claim 14 (depends on 9)

The method of claim 9, further comprising at least one of:
a rotation number correction process of correcting a rotation number of the substrate in the removal process; and
a flow rate correction process of correcting a supply flow rate of the processing liquid ejected from the ejection unit in the removal process, depending on the property information of the film acquired in the property information acquisition process.

### Claim 15 (depends on 9)

A non-transitory computer readable storage medium storing a computer program that, when executed, to cause a computer to control a substrate processing apparatus that removes a film on a peripheral edge of a substrate by supplying a processing liquid to the substrate,
wherein the computer program includes a group of steps that are programmed to execute the liquid processing method of claim 9.