# US 2017/0287586 A1 · Electroconductive Resin Composite and Electroconductive Resin Composition Having Excellent Impact Strength, and Method of Producing the Same

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- Number: US 2017/0287586 A1
- Document ID: US20170287586A1
- Status: Published application
- Kind: A1
- Application number: 15/471,674
- Filed: 2017-03-28
- Published: 2017-10-05
- Earliest claimed: 2016-03-29
- Assignees: SK Innovation Co., Ltd.; SK Global Chemical Co., Ltd.
- Applicants: SK Innovation Co., Ltd.; SK Global Chemical Co., Ltd.
- Inventors: Yun Kyun Lee
- Web page: https://patentgrep.com/patent/US20170287586A1

## CPC

- H01B 1/20: Conductive material dispersed in non-conductive organic material {(organic macromolecular compounds or compositions C08)}
- C08J 3/22: using masterbatch techniques
- C08L 77/06: Polyamides derived from polyamines and polycarboxylic acids (C08L77/10 takes precedence)
- C08J 2377/06: Polyamides derived from polyamines and polycarboxylic acids (C08J2377/10 takes precedence)
- C08J 2423/20: having four to nine carbon atoms
- C08L 2203/20: use in electrical or conductive gadgets
- H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K})
- C08J: WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H (working, e.g. shaping, of plastics B29)
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)

## Abstract

An electroconductive resin composite having excellent impact strength, in which an impact modifier and an electroconductive filler are dispersed in a matrix resin, is provided. The impact modifier has an average particle size of 5 μm or less and is dispersed in a domain form in a polyamide matrix resin, and the number of agglomerates of the filler in which a longest diameter of an agglomerate particle is 10 μm or more is 50 or less, in 50 scanning electron microscope (SEM) images of an area of 0.5 mm×0.35 mm, captured at 250× magnification.

## Claims

### Claim 1

An electroconductive resin composite, the composite comprising:
a polyamide resin matrix;
impact modifier domains dispersed in the matrix, the domains having an average particle size of 5 μm or less (excluding 0); and
electroconductive fillers dispersed in the matrix, wherein the number of agglomerates of the fillers in which the length of a longest diameter of an agglomerate is 10 μm or more is 50 or less, in 50 scanning electron microscope (SEM) images of an area of 0.5 mm×0.35 mm, captured at 250× magnification.

### Claim 2 (depends on 1)

The composite of claim 1, wherein, based on the total weight of the fillers, 90% or more of the fillers are present in the matrix or at an interface between the matrix and the domains.

### Claim 3 (depends on 1)

The composite of claim 1, wherein interfacial energy between the domains and the fillers is higher than interfacial energy between the matrix and the fillers.

### Claim 4 (depends on 1)

The composite of claim 1, comprising 1 wt % to 40 wt % of the domains and 0.1 wt % to 20 wt % of the fillers based on the total weight of the composite.

### Claim 5 (depends on 1)

The composite of claim 1, wherein the domains include copolymer of ethylene and octene or copolymer of ethylene and butane.

### Claim 6 (depends on 1)

The composite of claim 1, further comprising a compatibilizing agent.

### Claim 7 (depends on 5)

The composite of claim 5, wherein the compatibilizing agent is a graft copolymer grafted from maleic anhydride (MAH) or glycidyl methacrylate (GMA).

### Claim 8 (depends on 6)

The composite of claim 6, comprising 1 wt % to 40 wt % of the domains, 0.5 wt % to 10 wt % of the compatibilizing agent and 0.1 wt % to 20 wt % of the fillers based on the total weight of the composite.

### Claim 9

An electroconductive resin composition comprising:
a polyamide resin; and
a masterbatch including an impact modifier and electroconductive fillers,
wherein, with respect to the fillers, interfacial energy of the impact modifier is higher than interfacial energy of the polyamide resin.

### Claim 10 (depends on 9)

The composition of claim 9, comprising 0.1 wt % to 50 wt % of the masterbatch based on the total weight of the composition, and wherein the masterbatch includes 1 wt % to 50 wt % of the fillers based on the total weight of the masterbatch.

### Claim 11 (depends on 9)

The composition of claim 9, further comprising a compatibilizing agent.

### Claim 12 (depends on 11)

The composition of claim 11, comprising 0.5 wt % to 10 wt % of the compatibilizing agent, 0.1 wt % to 50 wt % of the masterbatch based on the total weight of the composition, and wherein the masterbatch includes 1 wt % to 50 wt % of the fillers based on the total weight of the masterbatch.

### Claim 13 (depends on 11)

The composition of claim 11, comprising 0.1 wt % to 50 wt % of the masterbatch based on the total weight of the composition, wherein the masterbatch includes 1 wt % to 50 wt % of the fillers and 0.5 wt % to 10 wt % of the compatibilizing agent based on the total weight of the masterbatch.

### Claim 14 (depends on 11)

The composition of claim 11, wherein the compatibilizing agent is a copolymer grafted from maleic anhydride (MAH) or glycidyl methacrylate (GMA).

### Claim 15

A method of producing an electroconductive resin composite, the method comprising:
mixing a materbatch including an impact modifier and electroconductive filler with a polyamide resin to prepare a electroconductive resin composition; and
melt molding the composition to prepare a composite including:
a resin matrix including the polyamide resin;
impact modifier domains including the impact modifier, the domains being dispersed in the matrix and having an average particle size of 5 μm or less; and
conductive fillers dispersed in the matrix, wherein the number of agglomerates of the fillers in which the length of a longest diameter of an agglomerate is 10 μm or more is 50 or less, in 50 scanning electron microscope (SEM) images of an area of 0.5 mm×0.35 mm, captured at 250× magnification.

### Claim 16 (depends on 15)

The method of claim 15, further comprising:
melt-mixing the impact modifier and the fillers to prepare the masterbatch.

### Claim 17 (depends on 15)

The method of claim 15, further comprising:
melt-mixing the impact modifier, the fillers and a polyamide resin to prepare a secondary masterbatch.

### Claim 18 (depends on 15)

The method of claim 15, wherein the composition further comprises a compatibilizing agent.

### Claim 19 (depends on 18)

The method of claim 18, wherein the compatibilizing agent is a copolymer grafted from maleic anhydride (MAH) or glycidyl methacrylate (GMA).