# US 2017/0287585 A1 · Electroconductive Resin Composite and Electroconductive Resin Composition Having Excellent Impact Strength, and Method of Producing the Same

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- Number: US 2017/0287585 A1
- Document ID: US20170287585A1
- Status: Published application
- Kind: A1
- Application number: 15/471,834
- Filed: 2017-03-28
- Published: 2017-10-05
- Earliest claimed: 2016-03-29
- Assignees: SK Innovation Co., Ltd.; SK Global Chemical Co., Ltd.
- Applicants: SK Innovation Co., Ltd.; SK Global Chemical Co., Ltd.
- Inventors: Yun Kyun Lee
- Web page: https://patentgrep.com/patent/US20170287585A1

## CPC

- H01B 1/18: the conductive material comprising carbon-silicon compounds, carbon or silicon
- C08J 3/22: using masterbatch techniques
- C08K 3/04: Carbon
- C08K 3/041: {Carbon nanotubes}
- C08K 7/06: Elements
- C08L 23/00: Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L 69/00: Compositions of polycarbonates; Compositions of derivatives of polycarbonates
- H01B 1/24: the conductive material comprising carbon-silicon compounds, carbon or silicon
- B82Y 30/00: Nanotechnology for materials or surface science, e.g. nanocomposites
- B82Y 40/00: Manufacture or treatment of nanostructures
- C08J 2369/00: Characterised by the use of polycarbonates; Derivatives of polycarbonates
- C08J 2423/00: Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
- C08K 2201/001: Conductive additives
- C08K 2201/011: Nanostructured additives
- Y10S 977/752: Multi-walled
- Y10S 977/753: with polymeric or organic binder
- Y10S 977/842: for carbon nanotubes or fullerenes
- Y10S 977/932: for electronic or optoelectronic application
- H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K})
- C08J: WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H (working, e.g. shaping, of plastics B29)
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- B82Y: SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- Y10S: TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

## Abstract

An electroconductive resin composite includes an impact modifier domains and an electroconductive fillers dispersed therein. The domains are dispersed in a matrix in the form of a domain having an average particle size of 5 μm or less. The electroconductive fillers are dispersed in the matrix or at an interface between the matrix and the domains to form a network.

## Claims

### Claim 1

An electroconductive resin composite, the composite comprising:
a resin matrix;
impact modifier domains dispersed in the matrix, the domains having an average particle size of 5 μm or less (excluding 0); and
electroconductive fillers dispersed in the matrix.

### Claim 2 (depends on 1)

The composite of claim 1, wherein the size distribution of the domains has a standard deviation of 3 μm or less.

### Claim 3 (depends on 1)

The composite of claim 1, wherein, based on the total weight of the fillers, 90% or more of the fillers are present in the matrix or at an interface between the matrix and the domains.

### Claim 4 (depends on 1)

The composite of claim 1, wherein interfacial energy between the domains and the fillers is higher than interfacial energy between the matrix and the fillers.

### Claim 5 (depends on 1)

The composite of claim 1, comprising 1 wt % to 40 wt % of the domains and 0.1 wt % to 20 wt % of the fillers based on the total weight of the composite.

### Claim 6 (depends on 1)

The composite of claim 1, wherein the matrix includes at least one resin selected from the group consisting of polyamide, polycarbonate, polyacrylonitrile butadiene styrene, polymethyl metacrylate, polyphenylene sulfide and polyetheretherketone.

### Claim 7 (depends on 6)

The composite of claim 6, wherein the resin is polycarbonate.

### Claim 8 (depends on 1)

The composite of claim 1, having a notched Izod impact strength of 10 kgfcm/cm to 65 kgfcm/cm.

### Claim 9 (depends on 1)

The composite of claim 1, wherein the domains include at least one selected from the group consisting of polyolefin elastomer, polystyrene elastomer, thermoplastic polyurethane, polyester polymer, vinyl chloride resin and acrylic copolymer.

### Claim 10 (depends on 9)

The composite of claim 9, wherein the domains include polyolefin elastomer.

### Claim 11 (depends on 10)

The composite of claim 10, wherein the polyolefin elastomer is copolymer of ethylene and octene or copolymer of ethylene and butane.

### Claim 12 (depends on 1)

The composite of claim 1, wherein the fillers are at least one selected from the group consisting of carbon nanotubes, carbon black, graphite, graphene and carbon fibers.

### Claim 13

An electroconductive resin composition comprising:
a resin; and
a masterbatch including an impact modifier and electroconductive fillers,
wherein, with respect to the electroconductive fillers, interfacial energy of the impact modifier is higher than interfacial energy of the polymer for the resin.

### Claim 14 (depends on 13)

The electroconductive resin composition of claim 13, comprising 0.1 wt % to 50 wt % of the masterbatch based on the total weight of the composition, and wherein the masterbatch includes 1 wt % to 50 wt % of the electroconductive fillers based on the total weight of the masterbatch.

### Claim 15 (depends on 13)

The electroconductive resin composition of claim 13, wherein the masterbatch further includes a polymer.

### Claim 16

A method of producing an electroconductive resin composite, the method comprising:
blending a masterbatch including an impact modifier and electroconductive filler with a resin to prepare an electroconductive resin composition; and
melt-mixing the composition to prepare a composite including:
a resin matrix including the resin;
impact modifier domains including the impact modifier, the domains being dispersed in the matrix and having an average particle size of 5 μm or less; and
electroconductive fillers dispersed in the composite.

### Claim 17 (depends on 16)

The method of claim 16, wherein interfacial energy between the impact modifier and the fillers is higher than interfacial energy between the resin and the fillers.

### Claim 18 (depends on 16)

The method of claim 16, further comprising:
melt-mixing the impact modifier and the fillers to prepare the masterbatch.

### Claim 19 (depends on 16)

The method of claim 16, further comprising:
melt-mixing the impact modifier, the fillers and a polymer to prepare the masterbatch.

### Claim 20 (depends on 16)

The method of claim 16, wherein the composition includes 1 wt % to 40 wt % of the impact modifier and 0.1 wt % to 20 wt % of the fillers based on the total weight of the composition.