# US 2017/0286731 A1 · Piezoelectric package-integrated delay lines for radio frequency identification tags > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2017/0286731 A1 - Document ID: US20170286731A1 - Status: Published application - Kind: A1 - Application number: 15/586,820 - Filed: 2017-05-04 - Published: 2017-10-05 - Earliest claimed: 2016-04-01 - Assignees: Intel Corporation - Applicants: Intel Corporation - Inventors: Adel A. ELSHERBINI; Telesphor KAMGAING; Feras EID; Vijay K. NAIR; Georgios C. DOGIAMIS; Johanna M. SWAN; Valluri R. RAO - Web page: https://patentgrep.com/patent/US20170286731A1 ## CPC - G06K 7/10297: {arrangements for handling protocols designed for non-contact record carriers such as RFIDs NFCs, e.g. ISO/IEC 14443 and 18092 (cryptographic protocols H04L9/00; network security protocols H04L63/00; real-time communication protocols in data switching networks H04L65/00; network protocols for data switching network services H04L67/00)} - G06K 7/10316: {using at least one antenna particularly designed for interrogating the wireless record carriers (antennas in general H01Q1/22)} - G06K 19/0672: {with resonating marks} - G06K 19/0675: {the resonating marks being of the surface acoustic wave [SAW] kind (SAW devices per se H03H9/64)} - H03H 9/30: Time-delay networks - G06K: GRAPHICAL DATA READING (image or video recognition or understanding G06V); PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS - H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P) ## Abstract Embodiments of the invention include delay line circuitry that is integrated with an organic substrate. Organic dielectric material and a plurality of conductive layers form the organic substrate. The delay line circuitry includes a piezoelectric transducer to receive a guided electromagnetic wave signal and to generate an acoustic wave signal to be transmitted with an acoustic transmission medium. An acoustic reflector is communicatively coupled to the acoustic transmission medium. The acoustic reflector receives a plurality of acoustic wave signals from the acoustic transmission medium and reflects acoustic wave signals to the piezoelectric transducer using the acoustic transmission medium. The transducer converts the reflected acoustic signals into electromagnetic waves which are then transmitted back through the antenna and decoded by the reader. ## Claims ### Claim 1 A delay line circuitry integrated with an organic substrate comprising: organic dielectric material and a plurality of conductive layers to form the organic substrate; a piezoelectric transducer to receive a guided electromagnetic wave signal and to generate an acoustic wave signal; and an acoustic transmission medium communicatively coupled to the piezoelectric transducer, the acoustic transmission medium to transmit a plurality of acoustic wave signals in response to receiving the acoustic wave signal. ### Claim 2 (depends on 1) The delay line circuitry of claim 1, further comprising: an acoustic reflector communicatively coupled to the acoustic transmission medium, the acoustic reflector to receive the plurality of acoustic wave signals from the acoustic transmission medium and to reflect acoustic wave signals to the piezoelectric transducer using the acoustic transmission medium. ### Claim 3 (depends on 1) The delay line circuitry of claim 1, further comprising: an antenna unit to receive an electromagnetic wave from a radio frequency identification (RFID) tag reader and to convert this electromagnetic wave into the guided electromagnetic wave signal for a transmission line for propagating to the piezoelectric transducer. ### Claim 4 (depends on 1) The delay line circuitry of claim 1, further comprising: a power splitter and combiner coupled to the piezoelectric transducer, the power splitter and combiner to split the acoustic wave signal received from the piezoelectric transducer into multiple acoustic wave signals to be transmitted by a plurality of acoustic transmission lines of the acoustic transmission medium to the acoustic reflector, wherein the power splitter and combiner to combine reflected acoustic wave signals that have been reflected from the acoustic reflector or have been reflected by one or more disconnected acoustic transmission lines. ### Claim 5 (depends on 4) The delay line circuitry of claim 4, wherein the piezoelectric transducer to receive reflected acoustic wave signals from the power splitter and combiner and to convert the reflected acoustic wave signals into electromagnetic wave signals to be transmitted to the RFID tag reader. ### Claim 6 (depends on 5) The delay line circuitry of claim 5, wherein the reflected acoustic wave signals represent a code stored in the delay line circuitry with the code being associated with a RFID tag. ### Claim 7 (depends on 1) The delay line circuitry of claim 1, wherein the piezoelectric transducer comprises a second electrode disposed on a piezoelectric material which is disposed on a first electrode of the piezoelectric transducer. ### Claim 8 (depends on 7) The delay line circuitry of claim 7, wherein the piezoelectric transducer to generate the acoustic wave signal in response to displacement of the piezoelectric transducer that is caused by the guided electromagnetic wave signal. ### Claim 9 (depends on 7) The delay line circuitry of claim 7, wherein the organic substrate comprises: a cavity having a plurality of acoustic transmission lines each having a different length, wherein the piezoelectric transducer is positioned in proximity to a first end of the cavity and the acoustic reflector is positioned in proximity to a second end of the cavity. ### Claim 10 (depends on 9) The delay line circuitry of claim 9, wherein the acoustic reflector includes at least one mechanical anchor and the acoustic reflector is positioned within the cavity or within the organic dielectric material. ### Claim 11 (depends on 9) The delay line circuitry of claim 9, wherein the transmission medium comprises at least one of air and a suspended conductive beam. ### Claim 12 (depends on 9) The delay line circuitry of claim 9, wherein the organic substrate is fabricated at panel level. ### Claim 13 A delay line structure comprising: organic dielectric material and a plurality of conductive layers to form the delay line structure; a plurality of piezoelectric transducers to receive a plurality of guided electromagnetic wave signals and to generate a plurality of acoustic wave signals; and an acoustic transmission medium communicatively coupled to the plurality of piezoelectric transducer, the acoustic transmission medium to transmit a plurality of acoustic wave signals in response to receiving the plurality of acoustic wave signals. ### Claim 14 (depends on 13) The delay line structure of claim 13, further comprising: a plurality of acoustic reflectors communicatively coupled to the acoustic transmission medium, the plurality of acoustic reflectors to receive the plurality of acoustic wave signals from the acoustic transmission medium and to reflect a plurality of reflected acoustic wave signals to the plurality of piezoelectric transducers using the acoustic transmission medium. ### Claim 15 (depends on 13) The delay line structure of claim 13, further comprising: an antenna unit to receive an electromagnetic wave from a radio frequency identification (RFID) tag reader and to convert this electromagnetic wave into a guided electromagnetic wave signal for a transmission line. ### Claim 16 (depends on 15) The delay line structure of claim 15, further comprising: a power splitter and combiner coupled to the plurality of piezoelectric transducers, the power splitter and combiner to split the electromagnetic wave signal received from the antenna unit into multiple electromagnetic wave signals to be transmitted by a plurality of transmission lines to the plurality of piezoelectric transducers, wherein the plurality of piezoelectric transducers to receive the reflected acoustic wave signals that have been reflected from the plurality of acoustic reflectors or have been reflected by one or more disconnected acoustic transmission lines. ### Claim 17 (depends on 16) The delay line structure of claim 16, wherein the plurality of piezoelectric transducers to convert the reflected acoustic wave signals into electromagnetic wave signals to be transmitted to the power splitter and combiner which combines the signals and sends to the antenna unit to be transmitted to the RFID tag reader. ### Claim 18 (depends on 17) The delay line structure of claim 17, wherein the reflected acoustic wave signals represent a code stored in the delay line structure with the code being associated with a RFID tag. ### Claim 19 (depends on 13) The delay line structure of claim 13, wherein the plurality of piezoelectric transducers each comprise a second electrode disposed on a piezoelectric material which is disposed on a first electrode of each piezoelectric transducer. ### Claim 20 (depends on 13) The delay line structure of claim 13, further comprising: a cavity having a plurality of acoustic transmission lines each having a different length, wherein the plurality of piezoelectric transducers are positioned in proximity to a first end of the cavity and the plurality of acoustic reflectors are positioned in proximity to a second end of the cavity. ### Claim 21 (depends on 20) The delay line structure of claim 20, wherein each acoustic reflector includes at least one mechanical anchor and each acoustic reflector is positioned within the cavity or within the organic dielectric material. ### Claim 22 (depends on 13) The delay line structure of claim 13, wherein each acoustic transmission line of the transmission medium comprises at least one of air and a suspended conductive beam. ### Claim 23 (depends on 13) The delay line structure of claim 13, wherein the delay line structure is fabricated at panel level. ### Claim 24 A computing device comprising: at least one processor to process data; a package substrate coupled to the at least one processor, the package substrate includes organic material and a plurality of conductive layers to form the package substrate which includes a piezoelectric transducer to receive a guided electromagnetic wave signal and to generate an acoustic wave signal, an acoustic transmission medium communicatively coupled to the piezoelectric transducer, the acoustic transmission medium to transmit a plurality of acoustic wave signals in response to receiving the acoustic wave signal. ### Claim 25 (depends on 24) The computing device of claim 24, wherein the package substrate further comprises an acoustic reflector communicatively coupled to the acoustic transmission medium, the acoustic reflector to receive the plurality of acoustic wave signals from the acoustic transmission medium and to reflect acoustic wave signals to the piezoelectric transducer using the acoustic transmission medium. ### Claim 26 (depends on 25) The computing device of claim 25, further comprising: an antenna unit to receive an electromagnetic wave from a radio frequency identification (RFID) tag reader and to convert this electromagnetic wave into a guided electromagnetic wave signal for a transmission line for propagating to the piezoelectric transducer; and a printed circuit board coupled to the package substrate.