# US 2017/0285698 A1 · Method for cooling storage device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2017/0285698 A1 - Document ID: US20170285698A1 - Status: Published application - Kind: A1 - Application number: 15/505,739 - Filed: 2014-10-28 - Published: 2017-10-05 - Earliest claimed: 2014-10-28 - Assignees: Hitachi, Ltd. - Applicants: Hitachi, Ltd. - Inventors: Toru KOBAYASHI; Tadaharu MAEDA; Syun NAKAYAMA - Web page: https://patentgrep.com/patent/US20170285698A1 ## CPC - G06F 1/20: Cooling means - G06F 1/263: {Arrangements for using multiple switchable power supplies, e.g. battery and AC (G06F1/30 takes precedence)} - G11B 33/128: {of the plurality of recording/reproducing devices, e.g. disk drives, onto a chassis} - G11B 33/14: Reducing influence of physical parameters, e.g. temperature change, moisture, dust - G11B 33/142: {by air cooling} - H05K 7/20145: {Means for directing air flow, e.g. ducts, deflectors, plenum or guides} - H05K 7/20154: {Heat dissipaters coupled to components} - H05K 7/20727: {within server blades for removing heat from heat source} - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - G11B: INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER (recording measured values in a way that does not require playback through a transducer G01D9/00; recording or playback apparatus using mechanically marked tape, e.g. punched paper tape, or using unit records, e.g. punched or magnetically marked cards G06K; transferring data from one type of record carrier to another G06K1/18; circuits for coupling output of reproducer to radio receiver H04B1/20; gramophone pick-ups or like acoustic electromechanical transducers or circuits therefor H04R) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract The present invention aims at improving a cooling efficiency and a maintenance workability related to heat generating components in a storage subsystem. Therefore, the present invention provides multiple cooling fans configured to cool multiple components for operating the storage subsystem, a first wind direction panel defining a passage configured to blow a cooling air generated by the cooling fans to a first component, a second wind direction panel defining a passage configured to blow a cooling air generated by the cooling fans to a second component having a smaller heating value than the first heat generating component and having a low temperature, and a chassis configured to store the multiple components, the cooling fans and the first and second wind direction panels, wherein the second wind direction panel is configured to be integrated with a side wall of the chassis and detachable from the chassis. ## Claims ### Claim 1 A storage subsystem configured to store data of an external device, comprising: multiple components configured to operate the subsystem; multiple cooling fans configured to cool the components; a first wind direction panel defining a passage configured to blow a cooling air generated by the cooling fans to a first component; a second wind direction panel defining a passage configured to blow a cooling air generated by the cooling fans to a second component having a smaller heating value than the first heat generating component and having a low temperature; and a chassis configured to store the multiple components, the cooling fans and the first and second wind direction panels, wherein the second wind direction panel is configured to be integrated with a side wall of the chassis and detachable from the chassis. ### Claim 2 (depends on 2) The storage subsystem according to claim 2, wherein the first wind direction panel is fixed to the chassis. ### Claim 3 (depends on 2) The storage subsystem according to claim 2, wherein a connecting body is further provided to join the first wind direction panel and the second wind direction panel. ### Claim 4 (depends on 3) The storage subsystem according to claim 3, wherein the first heat generating component is mounted to a position closer to the cooling fan than the second heat generating component, an air quantity generated by the multiple cooling fans is divided into a first air quantity passing through the passage defined by the first wind direction panel and a second air quantity passing through the passage defined by the second wind direction panel, and the first air quantity is greater than the second air quantity. ### Claim 5 (depends on 4) The storage subsystem according to claim 4, wherein multiple storage devices configured to store data of the external device are further provided to the chassis, the cooling fans are provided between the multiple storage devices and the first and second components, the storage devices are cooled by air taken in from an exterior of the storage subsystem by the cooling fans, and the air having cooled the storage device is blown to the first component via the first wind direction panel to cool the first component, and to the second component via the second wind direction panel to cool the second component. ### Claim 6 (depends on 5) The storage subsystem according to claim 5, wherein the first component is a processor controlling the whole storage subsystem. ### Claim 7 (depends on 6) The storage subsystem according to claim 6, wherein the second component is one or more of the following: a volatile memory configured to temporarily store data of the external device, a backup nonvolatile memory configured to store the contents of the volatile memory, a backup battery configured to supply power for storing data to the backup nonvolatile memory when power supply from the exterior to the storage subsystem is cut off, and an expansion board equipped with a communication controller configured to communicate with the external device. ### Claim 8 A method for cooling a storage subsystem storing data of an external device, the storage subsystem comprising: multiple components configured to operate the subsystem; multiple cooling fans for cooling the components; a first wind direction panel defining a passage configured to blow a cooling air generated by the cooling fans to a first component; a second wind direction panel defining a passage configured to blow a cooling air generated by the cooling fans to a second component having a smaller heating value than the first heat generating component and having a low temperature; and a chassis configured to store the multiple components, the cooling fans and the first and second wind direction panels, wherein the second wind direction panel is configured to be integrated with a side wall of the chassis and detachable from the chassis, and the first component and the second component are cooled by the first wind direction panel and the second wind direction panel. ### Claim 9 (depends on 8) The method for cooling a storage subsystem according to claim 8, wherein the first wind direction panel is fixed to the chassis. ### Claim 10 (depends on 9) The method for cooling a storage subsystem according to claim 9, wherein a connecting body is further provided to join the first wind direction panel and the second wind direction panel. ### Claim 11 (depends on 10) The method for cooling a storage subsystem according to claim 10, wherein the first heat generating component is mounted to a position closer to the cooling fan than the second heat generating component, an air quantity generated by the multiple cooling fans is divided into a first air quantity passing through the passage defined by the first wind direction panel and a second air quantity passing through the passage defined by the second wind direction panel, and the first air quantity is greater than the second air quantity. ### Claim 12 (depends on 11) The method for cooling a storage subsystem according to claim 11, wherein multiple storage devices for storing data of the external device are further provided to the chassis, the cooling fans are provided between the multiple storage devices and the first and second components, the storage devices are cooled by air taken in from an exterior of the storage subsystem by the cooling fans, and the air having cooled the storage device is blown to the first component via the first wind direction panel to cool the first component, and to the second component via the second wind direction panel to cool the second component. ### Claim 13 (depends on 12) The method for cooling a storage subsystem according to claim 12, wherein the first component is a processor controlling the whole storage subsystem. ### Claim 14 (depends on 13) The method for cooling a storage subsystem according to claim 13, wherein the second component is one or more of the following: a volatile memory configured to temporarily store data of the external device, a backup nonvolatile memory configured to store the contents of the volatile memory, a backup battery configured to supply power for storing data to the backup nonvolatile memory when power supply from the exterior to the storage subsystem is cut off, and an expansion board equipped with a communication controller configured to communicate with the external device.