# US 2017/0285478 A1 · Coating compositions for photolithography

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- Number: US 2017/0285478 A1
- Document ID: US20170285478A1
- Status: Published application
- Kind: A1
- Application number: 15/631,958
- Filed: 2017-06-23
- Published: 2017-10-05
- Earliest claimed: 2006-04-11
- Assignees: Rohm and Haas Electronic Materials LLC
- Applicants: Rohm and Haas Electronic Materials LLC
- Inventors: Anthony Zampini; Michael K. Gallagher; Owendi Ongayi
- Web page: https://patentgrep.com/patent/US20170285478A1

## CPC

- G03F 7/11: having cover layers or intermediate layers, e.g. subbing layers {(G03F7/091 - G03F7/093, B41N3/03 take precedence)}
- G03F 7/038: Macromolecular compounds which are rendered insoluble or differentially wettable (G03F7/075 takes precedence; macromolecular azides G03F7/012; macromolecular diazonium compounds G03F7/021)
- G03F 7/039: Macromolecular compounds which are photodegradable, e.g. positive electron resists (G03F7/075 takes precedence; macromolecular quinonediazides G03F7/023)
- G03F 7/091: {characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement}
- G03F 7/162: {Coating on a rotating support, e.g. using a whirler or a spinner}
- G03F 7/168: {Finishing the coated layer, e.g. drying, baking, soaking}
- G03F 7/20: Exposure; Apparatus therefor (photographic printing apparatus for making copies G03B27/00)
- G03F 7/32: Liquid compositions therefor, e.g. developers
- G03F 7/322: {Aqueous alkaline compositions}
- G03F 7/38: Treatment before imagewise removal, e.g. prebaking {(G03F7/265 takes precedence)}
- G03F 7/40: Treatment after imagewise removal, e.g. baking
- H10P 76/2042: {using lasers}
- H10P 76/2043: {using an anti-reflective coating}
- G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G)
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

In a first aspect, methods are provided that comprise: (a) applying a curable composition on a substrate; (b) applying a hardmask composition above the curable composition; (c) applying a photoresist composition layer above the hard mask composition, wherein one or more of the compositions are removed in an ash-free process. In a second aspect, methods are provided that comprise (a) applying an organic composition on a substrate; (b) applying a photoresist composition layer above the organic composition, wherein the organic composition comprises a material that produce an alkaline-soluble group upon thermal and/or radiation treatment. Related compositions also are provided.

## Claims

### Claim 1

A method of preparing an electronic device, comprising:
applying a curable composition on a substrate;
applying a hardmask composition above the curable composition;
applying a photoresist composition layer above the hard mask composition,
wherein one or more of the compositions are removed in an ash-free process.

### Claim 2 (depends on 1)

The method of claim 1 wherein the curable composition is exposed to activating radiation to cure the applied composition.

### Claim 3 (depends on 2)

The method of claim 2 wherein a silicon-containing hard mask composition is applied over the cured composition.

### Claim 4

A method of preparing an electronic device, comprising:
applying an organic composition on a substrate;
applying a photoresist composition layer above the organic composition,
wherein the organic composition comprises a material that produces an alkaline-soluble group upon thermal and/or radiation treatment.

### Claim 5 (depends on 4)

The method of claim 4 wherein the organic composition comprises a resin having photoacid-labile groups.

### Claim 6 (depends on 4)

The method of claim 4 wherein the organic composition comprises a resin comprising anhydride groups.

### Claim 7 (depends on 4)

The method of claim 4 wherein the organic composition is thermally treated prior to applying the photoresist composition.

### Claim at position 8

8-10. (canceled)