# US 2017/0285474 A1 · Photosensitive resin composition, photosensitive resin laminate, resin pattern production method, cured film, and display device

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- Number: US 2017/0285474 A1
- Document ID: US20170285474A1
- Status: Published application
- Kind: A1
- Application number: 15/510,619
- Filed: 2015-09-24
- Published: 2017-10-05
- Earliest claimed: 2014-09-24
- Assignees: Asahi Kasei Kabushiki Kaisha
- Applicants: Asahi Kasei Kabushiki Kaisha
- Inventors: Mayuki YOSHIDA; Satoshi SHIBUI
- Web page: https://patentgrep.com/patent/US20170285474A1

## CPC

- G03F 7/033: the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
- G03F 7/027: Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds (G03F7/075 takes precedence)
- G03F 7/031: Organic compounds not covered by group G03F7/029
- G03F 7/038: Macromolecular compounds which are rendered insoluble or differentially wettable (G03F7/075 takes precedence; macromolecular azides G03F7/012; macromolecular diazonium compounds G03F7/021)
- G03F 7/09: characterised by structural details, e.g. supports, auxiliary layers (supports for printing plates in general B41N)
- G03F 7/20: Exposure; Apparatus therefor (photographic printing apparatus for making copies G03B27/00)
- G03F 7/322: {Aqueous alkaline compositions}
- G06F 3/041: Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- B32B 2457/208: Touch screens
- G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G)
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM

## Abstract

The present invention provides a photosensitive resin laminate in which (A) an alkali-soluble polymer, (B) a compound having an ethylenically unsaturated double bond, and (C) a photosensitive resin layer including a photopolymerization initiator are laminated on a support film. The photosensitive resin laminate is used in forming the protective film of a conductor part, the thickness of the photosensitive resin is 20 μm or less, and the cured product of the photosensitive resin layer satisfies conditions (1) to (3): (1) the crosslink density is 1,000 mol/m3-8,000 mol/m3; (2) the peak top value of Tan δ is 0.4 or greater; and (3) the refractive index at a wavelength of 532 nm is 1.50-1.60.

## Claims

### Claim 1

A photosensitive resin laminate comprising a support film, and a photosensitive resin layer including:
(A) an alkali-soluble polymer;
(B) a compound having an ethylenic unsaturated double bond; and
(C) a photopolymerization initiator;
wherein the photosensitive resin layer is laminated on the support film,
the photosensitive resin laminate is to be used to form a protective film for a conductor component,
the thickness of the photosensitive resin layer is less than or equal to 20 μm, and
a cured product of the photosensitive resin layer satisfies the following conditions (1) to (3):
(1) a crosslink density of 1,000 mol/m3 to 8,000 mol/m3;
(2) a Tan δ peak top value of 0.4 or greater; and
(3) a refractive index of 1.50 to 1.60 at a wavelength of 532 nm.

### Claim 2 (depends on 1)

The photosensitive resin laminate according to claim 1, wherein the alkali-soluble polymer (A) includes an optionally substituted phenyl group.

### Claim 3 (depends on 1)

The photosensitive resin laminate according to claim 1, wherein the glass transition temperature of the photosensitive resin layer after exposure is lower than 100° C.

### Claim 4 (depends on 1)

The photosensitive resin laminate according to claim 1, wherein the compound having an ethylenic unsaturated double bond (B) includes a compound having at least three ethylenic unsaturated double bonds, and a compound including in the molecule a group represented by the following formula (1):
{wherein A is an alkylene group with 4 or more carbon atoms, and m is an integer of 1 to 30}.

### Claim 5 (depends on 1)

The photosensitive resin laminate according to claim 1, wherein the conductor component is a copper electrode or a transparent electrode.

### Claim 6 (depends on 1)

The photosensitive resin laminate according to claim 1, wherein the photosensitive resin laminate is to be used as a protective film for a touch panel or a protective film for a touch sensor.

### Claim 7 (depends on 1)

The photosensitive resin laminate according to claim 1, wherein the photosensitive resin layer further includes a thermal crosslinking agent (D).

### Claim 8

A photosensitive resin composition for a wiring protective film, including 30 mass % to 70 mass % of an alkali-soluble polymer (A), 20 mass % to 60 mass % of a compound having an ethylenic unsaturated double bond (B) and 0.1 mass % to 10 mass % of a photopolymerization initiator (C), wherein
the alkali-soluble polymer (A) includes an optionally substituted phenyl group, and
the compound having an ethylenic unsaturated double bond (B) includes a compound including in the molecule a group represented by the following formula (1):
{wherein A is an alkylene group with 4 or more carbon atoms, and m is an integer of 1 to 30}, and a compound including in the molecule a group represented by the following formula (2):

### Claim 9 (depends on 8)

The photosensitive resin composition for a wiring protective film according to claim 8, wherein the compound having an ethylenic unsaturated double bond (B) includes trimethylolpropane tri(meth)acrylate and polytetramethyleneglycol di(meth)acrylate.

### Claim 10 (depends on 8)

The photosensitive resin composition according to claim 8, wherein the photosensitive resin composition for a wiring protective film further includes a thermal crosslinking agent (D).

### Claim 11 (depends on 8)

A photosensitive resin laminate comprising a support film, and a photosensitive resin layer made of the photosensitive resin composition for a wiring protective film according to claim 8, formed on the support film.

### Claim 12 (depends on 1)

A pattern production method including a step of laminating the photosensitive resin laminate according to claim 1 on a substrate, and exposing and developing the laminate to form a pattern.

### Claim 13 (depends on 12)

A cured film pattern obtained by subjecting a pattern formed by the method according to claim 12, to post-exposure treatment and/or heat treatment.

### Claim 14 (depends on 13)

A touch panel display having the cured film pattern according to claim 13.

### Claim 15 (depends on 13)

A device having the cured film pattern according to claim 13 and a touch sensor.