# US 2017/0285472 A1 · Composition for forming interlayer insulating film, interlayer insulating film, method for forming interlayer insulating film pattern, and device

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- Number: US 2017/0285472 A1
- Document ID: US20170285472A1
- Status: Published application
- Kind: A1
- Application number: 15/467,793
- Filed: 2017-03-23
- Published: 2017-10-05
- Earliest claimed: 2016-03-31
- Assignees: Tokyo Ohka Kogyo Co., Ltd.
- Applicants: Tokyo Ohka Kogyo Co., Ltd.
- Inventors: Kazuhide UNO
- Web page: https://patentgrep.com/patent/US20170285472A1

## CPC

- G03F 7/0388: {with ethylenic or acetylenic bands in the side chains of the photopolymer}
- C08F 2/48: by ultraviolet or visible light
- C08F 2/50: with sensitising agents
- C08F 4/00: Polymerisation catalysts
- C08F 220/1811: {C10or C11-(Meth)acrylate, e.g. isodecyl (meth)acrylate, isobornyl (meth)acrylate or 2-naphthyl (meth)acrylate}
- C09D 4/00: Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond {; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16}
- C09D 5/00: Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced {(electrically insulating plastics, resins or waxes H01B3/30)}; Filling pastes
- C09D 175/14: Polyurethanes having carbon-to-carbon unsaturated bonds
- G03F 7/027: Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds (G03F7/075 takes precedence)
- G03F 7/035: the binders being polyurethanes
- H10P 14/6342: {Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating}
- H10P 14/683: {carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC}
- H10P 50/28: of insulating materials
- C08F 220/06: Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
- C08F 220/14: Methyl esters {, e.g. methyl (meth)acrylate}
- C08F 222/102: {of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate}
- C08F 222/103: {of trialcohols, e.g. trimethylolpropane tri(meth)acrylate}
- C09D 7/40: Additives
- G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G)
- C08F: MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D)
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

A composition for forming an interlayer insulating film including a polymerizable monomer, an alkali-soluble elastomer containing a polymerizable group, an imide compound represented by general formula (z-1), and a polymerization initiator, an interlayer insulating film containing a polymerized product thereof, a method for forming an interlayer insulating film pattern, and a device including the interlayer insulating film on a support. In the formula (z-1), R1 and R2 represent a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, Rz00 represents a divalent organic group containing an aliphatic hydrocarbon group and/or an aromatic hydrocarbon group, Rz01 and Rz02 represent an alkyl group or an alkoxy group, and n1 and n2 are 0 or 1.

## Claims

### Claim 1

A composition for forming an interlayer insulating film, comprising:
a polymerizable monomer (M);
an alkali-soluble elastomer (P) containing a polymerizable group;
an imide compound (Z) represented by the following general formula (z-1); and
a polymerization initiator:
wherein R1 and R2 each independently represent a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, Rz00 represents a divalent organic group containing a linear, branched, or cyclic aliphatic hydrocarbon group, and/or an aromatic hydrocarbon group, Rz01 and Rz02 each independently represent an alkyl group having 1 to 5 carbon atoms or an alkoxy group having 1 to 5 carbon atoms, and n1 and n2 each independently represent 0 or 1.

### Claim 2 (depends on 1)

The composition for forming an interlayer insulating film according to claim 1, wherein the content of the imide compound (Z) is 5 to 50% by mass with respect to the total content (100% by mass) of the polymerizable monomer (M), the alkali-soluble elastomer (P), and the imide compound (Z).

### Claim 3 (depends on 1)

The composition for forming an interlayer insulating film according to claim 1, wherein the alkali-soluble elastomer (P) contains a polymer (P1) having a urethane bond as a main chain.

### Claim 4 (depends on 3)

The composition for forming an interlayer insulating film according to claim 3, wherein the polymer (P1) is a polymer having a urethane bond as a main chain and a (meth)acryloyl group and a carboxy group as a side chain.

### Claim 5 (depends on 1)

The composition for forming an interlayer insulating film according to claim 1, wherein Rz00 in general formula (z-1) is a divalent organic group represented by the following formula (Rz00-4), formula (Rz00-37), or formula (Rz00-38):
wherein the symbol of “*” in the formulae represents a bond which is bonded to the nitrogen atom (N) in the formula (z-1).

### Claim 6 (depends on 1)

The composition for forming an interlayer insulating film according to claim 1, wherein the imide compound (Z) comprises at least one member selected from the group consisting of a compound represented by the following chemical formula (z-11), a compound represented by the following chemical formula (z-12), and a compound represented by the following chemical formula (z-13):

### Claim 7 (depends on 1)

The composition for forming an interlayer insulating film according to claim 1, wherein the polymerizable monomer (M) comprises at least one member selected from the group consisting of a compound represented by the following general formula (m-1) and a compound represented by the following general formula (m-2):
wherein Rm00 represents an organic group having a valence of Pm. Pm is an integer of 1 to 6, R3 represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, Rm1 represents an alkylene group having 1 to 5 carbon atoms, Rm2 represents a modified group, and Qm is 0 or 1;
wherein Rm01 represents a hexavalent organic group, Pm1 is an integer of 0 to 6, and Pm2 is an integer of 0 to 6, provided that Pm1+Pm2=6, R31 and R32 each independently represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, Rm3 represents an alkylene group having 1 to 5 carbon atoms, and Qm2 is 1 or 2.

### Claim 8 (depends on 1)

The composition for forming an interlayer insulating film according to claim 1, wherein the polymerizable monomer (M) comprises a caprolactone-modified (meth)acrylate monomer.

### Claim 9 (depends on 1)

An interlayer insulating film comprising a polymerized product of the composition for forming an interlayer insulating film according to claim 1.

### Claim 10 (depends on 1)

A method for forming an interlayer insulating film pattern, comprising:
applying the composition for forming an interlayer insulating film according to claim 1 on a support to form a coated film;
a exposing the coated film;
alkali developing the coated film after the exposing to form a pre-pattern; and
curing the pre-pattern with heat to obtain an interlayer insulating film pattern.

### Claim 11 (depends on 10)

The method for forming an interlayer insulating film pattern according to claim 10, wherein the curing is performed at a temperature of 220° C. or less.

### Claim 12 (depends on 9)

A device comprising a support having thereon the interlayer insulating film according to claim 9.