# US 2017/0285376 A1 · Display device

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- Number: US 2017/0285376 A1
- Document ID: US20170285376A1
- Status: Published application
- Kind: A1
- Application number: 15/468,244
- Filed: 2017-03-24
- Published: 2017-10-05
- Earliest claimed: 2016-03-31
- Assignees: Japan Display Inc.
- Applicants: Japan Display Inc.
- Inventors: Tetsuya OKAMAE; Shinji YAMAKAWA; Kazuyuki SUNOHARA
- Web page: https://patentgrep.com/patent/US20170285376A1

## CPC

- H10D 86/441: {Interconnections, e.g. scanning lines}
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10D 86/60: wherein the TFTs are in active matrices
- H10P 74/23: {characterised by multiple measurements, corrections, marking or sorting processes}
- H10W 90/00: Package configurations
- G02F 1/13452: {Conductors connecting driver circuitry and terminals of panels}
- G02F 1/136254: {Checking; Testing}
- G09G 3/006: {Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays (testing individual LED's G01R31/2635; testing lamps G01R31/44; testing of optical features of LCD displays G02F1/1309)}
- G09G 3/3648: {using an active matrix (G09G3/367 - G09G3/3696 take precedence)}
- G09G 2300/0413: Details of dummy pixels or dummy lines in flat panels
- G09G 2300/0426: Layout of electrodes and connections
- H10W 70/655: Fan-out layouts
- H10W 72/07232: {Compression bonding, e.g. thermocompression bonding}
- H10W 72/074: {of anisotropic conductive adhesives}
- H10W 72/227: {Multiple bumps having different sizes}
- H10W 72/261: {Functions other than electrical connecting}
- H10W 72/267: {Multiple bump connectors having different functions}
- H10W 72/325: {Die-attach connectors having a filler embedded in a matrix}
- H10W 72/351: {Materials of die-attach connectors}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 90/722: {between stacked chips}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G09G: ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION (arrangements for transferring data between digital computers and displays G06F3/14; static indicating arrangements comprising an association of a number of separate sources or light control cells G09F9/00; static indicating arrangements comprising integral associations of a number of light sources H01J, H01K, H10H, H05B33/12; scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission, details thereof H04N1/00)

## Abstract

According to an aspect, a display device includes: a substrate including a display region and a non-display region surrounding the display region; at least one driver IC including connecting terminals with a first surface fixed to face the non-display region; first wires supplying a signal to the display region; first bumps connected with the first wires; second wires transferring a signal to and from outside; second bumps connected with the second wires; and inspection wires. The connecting terminals of the driver IC include first connecting terminals overlapping the first or second bumps in plan view, and second connecting terminals not overlapping the first or second bumps in plan view. The inspection wires include a connecting conductor between themselves and at least one of the second connecting terminals. The inspection wires are pulled out to an outside of the driver IC in plan view.

## Claims

### Claim 1

A display device comprising:
a substrate including a display region and a non-display region that is disposed on a periphery of the display region;
at least one driver IC including a plurality of connecting terminals, and having a first surface that is fixed to face the non-display region;
a plurality of first wires that supply a signal to the display region;
a plurality of first bumps electrically connected with the respective first wires;
a plurality of second wires that input and output a signal from and to an outside;
a plurality of second bumps electrically connected with the respective second wires; and
a plurality of inspection wires, wherein
the connecting terminals of the at least one driver IC comprise a plurality of first connecting terminals overlapping the respective first bumps or the respective second bumps in plan view, and a plurality of second connecting terminals not overlapping the first bumps or the second bumps in plan view, and
the inspection wires include a connecting conductor between themselves and at least one of the second connecting terminals, and are pulled out to an outside of the at least one driver IC in plan view.

### Claim 2 (depends on 1)

The display device according to claim 1, wherein
the connecting terminals are arranged to form a plurality of columns in a longitudinal direction of the at least one driver IC in plan view, and
the second connecting terminals overlapping the inspection wires in plan view are arranged in inside columns among the columns in a short direction of the driver IC.

### Claim 3 (depends on 1)

The display device according to claim 1, wherein
one of the second connecting terminals, the first connecting terminals, and one of the second connecting terminals are sequentially arranged in a longitudinal direction of the at least one driver IC in plan view.

### Claim 4 (depends on 1)

The display device according to claim 1, wherein
the second connecting terminals, the first connecting terminals, and the second connecting terminals are sequentially arranged in a longitudinal direction of the at least one driver IC in plan view.

### Claim 5 (depends on 1)

The display device according to claim 1, wherein
the second connecting terminals are closer to a short side of the at least one driver IC than the first connecting terminals are, in a longitudinal direction of the at least one driver IC in plan view.

### Claim 6 (depends on 1)

The display device according to claim 1, wherein
eight of the inspection wires are pulled out to an outside of the at least one driver IC in plan view.

### Claim 7 (depends on 1)

The display device according to claim 1, wherein
two of the inspection wires overlap the respective second connecting terminals adjacent to each other in plan view, and the second connecting terminals adjacent to each other are short-circuited inside the at least one driver IC.

### Claim 8 (depends on 1)

The display device according to claim 1, wherein
two of the inspection wires both overlap one of the second connecting terminals in plan view.

### Claim 9 (depends on 1)

The display device according to claim 1, wherein
two of the inspection wires both overlap the second connecting terminals adjacent to each other in plan view.