# US 2017/0285294 A1 · Titanium Copper Foil Having Plated Layer > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2017/0285294 A1 - Document ID: US20170285294A1 - Status: Published application - Kind: A1 - Application number: 15/473,696 - Filed: 2017-03-30 - Published: 2017-10-05 - Earliest claimed: 2016-03-31 - Assignees: JX Nippon Mining & Metals Corporation - Applicants: JX Nippon Mining & Metals Corporation - Inventors: Kenta Tsujie - Web page: https://patentgrep.com/patent/US20170285294A1 ## CPC - G02B 7/026: {using retaining rings or springs (G02B7/027 takes precedence)} - B32B 15/01: all layers being exclusively metallic {(making layered metal workpieces by pressure cladding B23K20/22; making coatings with a metallic material characterised by its composition C23C30/00)} - C22C 9/00: Alloys based on copper - C25D 3/30: of tin - C25D 5/10: Electroplating with more than one layer of the same or of different metals (for bearings C25D7/10) - C25D 7/0614: {Strips or foils} - G02B 7/09: adapted for automatic focusing or varying magnification - G02B 7/10: by relative axial movement of several lenses, e.g. of varifocal objective lens - B23K 1/0016: {Soldering of electronic components} - B23K 2101/36: Electric or electronic devices - C25D 3/38: of copper - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - C22C: ALLOYS (treatment of alloys C21D, C22F) - C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM ## Abstract The present invention provides a titanium copper foil having improved adhesion to solder and higher resistance to discoloration due to a high temperature and high humidity environment, an acid solution or an alkaline solution, and as well as having improved etching processability. The present invention provides a titanium copper foil comprising a base metal, the base metal having a composition containing Ti of from 1.5 to 5.0% by mass, the balance being copper and inevitable impurities, and having a thickness of from 0.018 to 0.1 mm, wherein the titanium copper foil has a plated layer in which an underlying Cu plated layer and a Sn plated layer have been laminated in this order on a surface of the base metal, and has an adhesive strength of 1 N or more as measured by a solder adhesive strength test according to the definition in the specification. ## Claims ### Claim 1 A titanium copper foil comprising a base metal, the base metal having a composition containing Ti of from 1.5% by mass to 5.0% by mass, optionally containing one or more elements selected from the group consisting of Ag, B, Co, Fe, Mg, Mn, Mo, Ni, P, Si, Cr, and Zr in a total amount of from 0% by mass to 1.0% by mass, the balance being copper and inevitable impurities, and the base metal having a thickness of from 0.018 mm to 0.1 mm, wherein the titanium copper foil has a plated layer in which an underlying Cu plated layer and an Sn plated layer have been laminated in this order on a surface of the base metal, and has an adhesive strength of 1 N or more as measured by a solder adhesive strength test according to a definition in the specification. ### Claim 2 (depends on 1) The titanium copper foil according to claim 1, wherein the underlying Cu plated layer has a thickness of from 0.01 μm to 2.0 μm. ### Claim 3 (depends on 1) The titanium copper foil according to claim 1, wherein the Sn plated layer has a thickness of from 0.01 μm to 2.0 μm. ### Claim 4 (depends on 1) The titanium copper foil according to claim 1, wherein the base metal further contains one or more elements selected from the group consisting of Ag, B, Co, Fe, Mg, Mn, Mo, Ni, P, Si, Cr, and Zr in a total amount of from 0% by mass to 1.0% by mass. ### Claim 5 (depends on 1) The titanium copper foil according to claim 1, wherein the titanium copper foil has a tensile strength in a direction parallel to a rolling direction of 1100 MPa or more. ### Claim 6 (depends on 1) The titanium copper foil according to claim 1, wherein the adhesive strength is 20 N or more. ### Claim 7 (depends on 1) The titanium copper foil according to claim 1, wherein a decreasing rate of the adhesive strength after heating at a temperature of 85° C. for 100 hours relative to the adhesive strength before the heating is less than 5%. ### Claim 8 (depends on 1) The titanium copper foil according to claim 1, wherein the titanium copper foil is used for etching processing. ### Claim 9 (depends on 1) An electronic component comprising the titanium copper foil according to claim 1. ### Claim 10 (depends on 1) A joined body of the titanium copper foil according to claim 1 and a solder, wherein the joined body has a joined site to the solder on a surface of the plated layer of the titanium copper foil. ### Claim 11 (depends on 1) A method for joining the titanium copper foil according to claim 1 to a conductive member, comprising shape processing the titanium copper foil by etching; and joining the resulting profiled product of the titanium copper foil to the conductive member at a location having the plated layer by soldering. ### Claim 12 (depends on 1) An autofocus module comprising the titanium copper foil according to claim 1 as a spring material. ### Claim 13 (depends on 1) An autofocusing camera module comprising a lens; a spring member made of the titanium copper foil according to claim 1 for elastically biasing the lens to an initial position in an optical axis direction; and an electromagnetic driving means configured to generate electromagnetic force for withstanding the biasing force of the spring member so that the lens can be driven in the optical axis direction, wherein the electromagnetic driving means comprises a coil, and wherein the spring member is joined to the coil at a location having the plated layer by soldering. ### Claim 14 A method for producing a titanium copper foil, comprising: preparing a base metal having a composition containing Ti of from 1.5% by mass to 5.0% by mass, optionally containing one or more elements selected from the group consisting of Ag, B, Co, Fe, Mg, Mn, Mo, Ni, P, Si, Cr, and Zr in a total amount of from 0% by mass to 1.0% by mass, the balance being copper and inevitable impurities, wherein the base metal has a thickness of from 0.018 mm to 0.1 mm, and has a surface glossiness of from 100 to 200; and laminating an underlying Cu plated layer and an Sn plated layer in this order on a surface of the base metal. ### Claim 15 (depends on 14) The method for producing the titanium copper foil according to claim 14, wherein the underlying Cu plated layer has a thickness of from 0.01 μm to 2.0 μm. ### Claim 16 (depends on 14) The method for producing the titanium copper foil according to claim 14, wherein the Sn plated layer has a thickness of from 0.01 μm to 2.0 μm. ### Claim 17 (depends on 14) The method for producing the titanium copper foil according to claim 14, wherein the base metal further contains one or more elements selected from the group consisting of Ag, B, Co, Fe, Mg, Mn, Mo, Ni, P, Si, Cr, and Zr in a total amount of 0% by mass to 1.0% by mass. ### Claim 18 (depends on 14) The method for producing the titanium copper foil according to claim 14, wherein the surface of the base metal having the surface glossiness of from 100 to 200 has arithmetic average roughness (Ra) of 0.5 μm or less.