# US 2017/0285281 A1 · Electronic module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2017/0285281 A1 - Document ID: US20170285281A1 - Status: Published application - Kind: A1 - Application number: 15/513,638 - Filed: 2015-09-03 - Published: 2017-10-05 - Earliest claimed: 2014-09-24 - Assignees: KYOCERA Corporation - Applicants: KYOCERA Corporation - Inventors: Youhei AIKOU - Web page: https://patentgrep.com/patent/US20170285281A1 ## CPC - G02B 6/428: {containing printed circuit boards [PCB]} - G02B 6/4206: {Optical features (G02B6/4207, G02B6/421 take precedence)} - H05K 1/18: structurally associated with non-printed electric components (H05K1/16 takes precedence) - H10W 90/00: Package configurations - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract In an electronic module 30, a groove 3 is disposed in a single side surface A of an electronic device 20 that faces an outer principal surface 33 of a circuit board 31. In the groove 3, an end portion of a mounting electrode 2 near a joining body 21 is located further toward an insulating substrate 1 than an end portion 3 of the groove 3 near the joining body 21. A fillet F of a joining material 41 is disposed in a region of the groove near the joining body 21. Owing to the fillet F, the reliability of connection between the electronic device 20 and the circuit board 31 can be increased. ## Claims ### Claim 1 An electronic module comprising: an electronic device comprising an insulating substrate comprising a first principal surface on which a light emitting-receiving device is mounted and a side surface perpendicular to the first principal surface, a joining body comprising an end surface at which an end portion of an optical transmission path extending through the joining body is disposed and a side surface perpendicular to the end surface, the end surface facing the first principal surface of the insulating substrate and being joined to the first principal surface in a state in which the end portion of the optical transmission path is positioned with respect to the light emitting-receiving device, the side surface being continuous with the side surface of the insulating substrate and defining a single side surface together with the side surface of the insulating substrate, and a mounting electrode disposed on an inner surface of a groove in the single side surface and extending in a thickness direction perpendicular to the first principal surface of the insulating substrate; a circuit board comprising a board body comprising an outer principal surface, and a connecting circuit portion disposed on the outer principal surface of the board body; and a joining material that connects the mounting electrode to the connecting circuit portion and mounts the electronic device on the circuit board in a state in which the single side surface of the electronic device faces the outer principal surface of the circuit board, wherein an end portion of the mounting electrode near the joining body is located further toward the insulating substrate than an end portion of the groove near the joining body, and a fillet of the joining material is disposed in a region of the groove near the joining body. ### Claim 2 (depends on 1) The electronic module according to claim 1, wherein the groove is disposed only in the side surface of the insulating substrate. ### Claim 3 (depends on 1) The electronic module according to claim 1, wherein the insulating substrate further comprises a second principal surface that opposes the first principal surface, wherein the groove extends over an entire length of the side surface of the insulating substrate in the thickness direction, and wherein the mounting electrode extends to the second principal surface. ### Claim 4 (depends on 3) The electronic module according to claim 3, wherein the second principal surface of the insulating substrate comprises a step portion having a recessed shape at a peripheral portion near the single side surface, and wherein an end portion of the groove near the second principal surface is disposed in the step portion. ### Claim 5 (depends on 4) The electronic module according to claim 4, wherein the mounting electrode covers an entire area of the second principal surface in the step portion. ### Claim 6 (depends on 4) The electronic module according to claim 4, wherein a plurality of the grooves is disposed in the single side surface, and a plurality of the step portions is disposed in the second principal surface, and wherein the step portions are in one-to-one correspondence with the grooves. ### Claim 7 (depends on 2) The electronic module according to claim 2, wherein the groove is disposed only in a portion of the side surface of the insulating substrate in the thickness direction. ### Claim 8 (depends on 1) The electronic module according to claim 1, wherein the groove extends along the side surface of the insulating substrate and the side surface of the joining body, and wherein the mounting electrode is not disposed in a portion of the groove disposed in the side surface of the joining body. ### Claim 9 (depends on 1) The electronic module according to claim 1, further comprising: an auxiliary mounting electrode disposed on the inner surface of the groove, the auxiliary mounting electrode being apart from the mounting electrode in the thickness direction; an auxiliary connecting circuit portion disposed on the outer principal surface of the circuit board and facing the auxiliary mounting electrode; and an auxiliary joining material connected to the auxiliary mounting electrode and the auxiliary connecting circuit portion in the groove, wherein a fillet of the auxiliary joining material is disposed between the mounting electrode and the auxiliary mounting electrode that are apart from each other. ### Claim 10 (depends on 2) The electronic module according to claim 2, wherein the insulating substrate further comprises a second principal surface that opposes the first principal surface, wherein the groove extends over an entire length of the side surface of the insulating substrate in the thickness direction, and wherein the mounting electrode extends to the second principal surface. ### Claim 11 (depends on 5) The electronic module according to claim 5, wherein a plurality of the grooves is disposed in the single side surface, and a plurality of the step portions is disposed in the second principal surface, and wherein the step portions are in one-to-one correspondence with the grooves. ### Claim 12 (depends on 2) The electronic module according to claim 2, further comprising: an auxiliary mounting electrode disposed on the inner surface of the groove, the auxiliary mounting electrode being apart from the mounting electrode in the thickness direction; an auxiliary connecting circuit portion disposed on the outer principal surface of the circuit board and facing the auxiliary mounting electrode; and an auxiliary joining material connected to the auxiliary mounting electrode and the auxiliary connecting circuit portion in the groove, wherein a fillet of the auxiliary joining material is disposed between the mounting electrode and the auxiliary mounting electrode that are apart from each other.