# US 2017/0285097 A1 · Buried electrical debug access port

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- Number: US 2017/0285097 A1
- Document ID: US20170285097A1
- Status: Published application
- Kind: A1
- Application number: 15/089,385
- Filed: 2016-04-01
- Published: 2017-10-05
- Earliest claimed: 2016-04-01
- Assignees: Intel Corporation
- Applicants: Intel Corporation
- Inventors: Florence R. PON; Bilal KHALAF; Saeed S. SHOJAIE
- Web page: https://patentgrep.com/patent/US20170285097A1

## CPC

- H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)}
- G01R 31/2818: {using test structures on, or modifications of, the card under test, made for the purpose of testing, e.g. additional components or connectors (G01R31/2805 takes precedence; printed circuits having, e.g. symbols, test patterns or visualisation means H05K1/0266)}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Embodiments are generally directed to a buried electrical debug access port. An embodiment of an apparatus includes a substrate or printed circuit board; one or more electronic components coupled with the substrate or printed circuit board; one or more electrical access ports coupled with the substrate or printed circuit board, each electrical access port including electrically conductive material; and an encapsulant material, the encapsulant material encapsulating the one or more access ports, wherein the one or more access ports are electrically connected to one or more circuits of the apparatus to provide debugging access to the apparatus.

## Claims

### Claim 1

An apparatus comprising:
a substrate or printed circuit board;
one or more electronic components coupled with the substrate or printed circuit board;
one or more electrical access ports coupled with the substrate or printed circuit board, each electrical access port including electrically conductive material; and
an encapsulant material, wherein the encapsulant material encapsulates the one or more access ports;
wherein the one or more access ports are electrically connected to one or more circuits of the apparatus to provide debugging access to the apparatus.

### Claim 2 (depends on 1)

The apparatus of claim 1, wherein each of the one or more access ports is insulated from electrical contact by the encapsulant material.

### Claim 3 (depends on 1)

The apparatus of claim 1, wherein the apparatus is a system in package (SiP).

### Claim 4 (depends on 1)

The apparatus of claim 1, wherein each of the one or more access ports is adjacent to an edge of the encapsulant material.

### Claim 5 (depends on 1)

The apparatus of claim 1, wherein a first access port is a closest element of the apparatus to an edge of the encapsulant material.

### Claim 6 (depends on 1)

The apparatus of claim 1, wherein a first access port is a closest element of the apparatus to a top surface of the encapsulant material.

### Claim 7 (depends on 1)

The apparatus of claim 1, wherein the one or more electrical access ports are accessible by breaking through the encapsulate material.

### Claim 8 (depends on 7)

The apparatus of claim 7, wherein breaking through the encapsulate material includes drilling through or piercing through the encapsulate material.

### Claim 9 (depends on 1)

The apparatus of claim 1, wherein the one or more electrical access ports are accessible by electromagnetic coupling with at least one access port.

### Claim 10

A method comprising:
installing one or more electronic components on a substrate or printed circuit board;
installing one or more electrical access ports on the substrate or printed circuit board; and
encapsulating the one more electronic components and one or more electrical access ports in an encapsulant material;
wherein the one more electrical access ports are fully encapsulated to generate one or more buried access ports.

### Claim 11 (depends on 10)

The method of claim 10, wherein encapsulating the one or more buried access ports is to insulate the one or more buried access ports from electrical contact.

### Claim 12 (depends on 10)

The method of claim 10, wherein installing the one or more electrical access ports on the substrate or printed circuit board includes installing each of the one or more electrical access ports adjacent to an edge of the encapsulant material.

### Claim 13 (depends on 10)

The method of claim 10, wherein installing the one or more electrical access ports on the substrate or printed circuit board includes installing a first electrical access port to be a closest element of the package to an edge of the encapsulant material.

### Claim 14 (depends on 10)

The method of claim 10, wherein installing the one or more electrical access ports on the substrate or printed circuit board includes installing a first electrical access port to be a closest element of the package to a top surface of the encapsulant material.

### Claim 15 (depends on 10)

The method of claim 10, wherein the one or more buried access ports are accessible by breaking through the encapsulate material.

### Claim 16 (depends on 10)

The method of claim 10, wherein the one or more electrical access ports are accessible by electromagnetic coupling with at least one access port.

### Claim 17

A system comprising:
a processor;
an electronic package; and
a motherboard, the electronic package being installed in the motherboard;
wherein the electronic package includes:
a substrate or printed circuit board,
a plurality of electronic components including a solid state drive (SSD) coupled with the substrate or printed circuit board,
one or more electrical access ports coupled with the substrate or printed circuit board, each electrical access port including electrically conductive material, and
an encapsulant material, wherein the encapsulant material encapsulates the one or more access ports;
wherein the one or more access ports are electrically connected to one or more circuits of the electronic package to provide debugging access to the electronic package.

### Claim 18 (depends on 17)

The system of claim 17, wherein each of the one or more access ports is insulated from electrical contact by the encapsulant material.

### Claim 19 (depends on 17)

The system of claim 17, wherein each of the one or more access ports of the electronic package is adjacent to an edge of the encapsulant material.

### Claim 20 (depends on 17)

The system of claim 17, wherein a first access port is a closest element of the electronic package to an edge of the encapsulant material, to a top surface of the encapsulant material, or both.

### Claim 21 (depends on 17)

The system of claim 17, wherein the one or more electrical access ports are accessible by breaking through the encapsulate material.

### Claim 22 (depends on 17)

The system of claim 17, wherein the one or more electrical access ports are accessible by electromagnetic coupling with at least one access port.

### Claim 23 (depends on 17)

The system of claim 17, wherein access to the electrical access ports provides debug access to the electronic package without removing the electronic package from the motherboard.