# US 2017/0284881 A1 · Electronic part > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2017/0284881 A1 - Document ID: US20170284881A1 - Status: Published application - Kind: A1 - Application number: 15/428,244 - Filed: 2017-02-09 - Published: 2017-10-05 - Earliest claimed: 2016-03-29 - Assignees: Rohm Co., Ltd. - Applicants: Rohm Co., Ltd. - Inventors: Masahiro SAKURAGI - Web page: https://patentgrep.com/patent/US20170284881A1 ## CPC - G01L 9/0045: {Diaphragm associated with a buried cavity} - G01L 9/0051: {using variations in ohmic resistance} - G01L 19/0069: {from the sensor to its support} - G01L 19/0654: {against moisture or humidity} - G01L 19/147: {Details about the mounting of the sensor to support or covering means} - H05K 1/111: {Pads for surface mounting, e.g. lay-out} - H05K 1/183: associated with components mounted in and supported by recessed areas of the PCBs - H05K 2201/09781: Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components - H05K 2201/10151: Sensor - H10W 70/682: {comprising holes having chips therein} - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - G01L: MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE (weighing G01G) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract An electronic part (air pressure detecting device) 1 includes a sensor element (air pressure sensor element) 2 that includes an ambient air contacting surface S including an ambient air contacting region Sa to be exposed to ambient air, and a supporting substrate 4, arranged to support the sensor element 2. The sensor element 2 is bonded to one surface 4a of the supporting substrate 4 in a state where its ambient air contacting surface S faces the one surface 4a of the supporting substrate 4 and a gap, through which the ambient air flows, is formed between the ambient air contacting surface S and the one surface 4a of the supporting substrate 4. ## Claims ### Claim 1 An electronic part comprising: a sensor element that includes an ambient air contacting surface including an ambient air contacting region to be exposed to ambient air; and a supporting substrate, arranged to support the sensor element; and wherein the sensor element is bonded to one surface of the supporting substrate in a state where its ambient air contacting surface faces the one surface of the supporting substrate and a gap, through which the ambient air flows, is formed between the ambient air contacting region and the one surface of the supporting substrate. ### Claim 2 (depends on 1) The electronic part according to claim 1, further comprising: a plurality of electrodes, formed at the ambient air contacting surface side of the sensor element; and a plurality of pads, formed on the one surface of the supporting substrate; and wherein the plurality of electrodes are bonded to the plurality of pads. ### Claim 3 (depends on 1) The electronic part according to claim 1, wherein a recess, depressed from the one surface of the supporting substrate and housing the sensor element, is formed in the supporting substrate, and the sensor element is bonded to a bottom surface of the recess in a state where its ambient air contacting surface faces a bottom surface of the recess and a gap, through which the ambient air flows, is formed between the ambient air contacting region and the bottom surface of the recess. ### Claim 4 (depends on 3) The electronic part according to claim 3, further comprising: a plurality of electrodes, formed at the ambient air contacting surface side of the sensor element; and a plurality of pads, formed on the bottom surface of the recess, and wherein the plurality of electrodes are bonded to the plurality of pads. ### Claim 5 (depends on 4) The electronic part according to claim 4, further comprising: a plurality of external terminals formed in a region of the one surface of the supporting substrate that surrounds the recess and connected to any of the plurality of pads. ### Claim 6 (depends on 5) The electronic part according to claim 5, wherein the plurality of external terminals are connected to any of the plurality of pads via wirings formed on the one surface of the supporting substrate. ### Claim 7 (depends on 5) The electronic part according to claim 5, wherein the plurality of external terminals are connected to any of the plurality of pads via wirings formed inside the supporting substrate. ### Claim 8 (depends on 4) The electronic part according to claim 4, further comprising: a plurality of external terminals formed on another surface at aside opposite the one surface of the supporting substrate and connected to any of the plurality of pads. ### Claim 9 (depends on 8) The electronic part according to claim 8, wherein the plurality of external terminals are connected to any of the plurality of pads via wirings formed inside the supporting substrate. ### Claim 10 (depends on 1) The electronic part according to claim 1, further comprising: an integrated circuit element supported by the supporting substrate; and wherein the supporting substrate has formed therein a first recess, depressed from the one surface of the supporting substrate, and a second recess, depressed from the one surface of the supporting substrate, being in communication with a lateral surface of the first recess, and being shallower in depth than the first recess, the sensor element is bonded to a bottom surface of the first recess in a state where its ambient air contacting surface faces the bottom surface of the first recess and a gap, through which the ambient air flows, is formed between the ambient air contacting region and the bottom surface of the first recess, and the integrated circuit element is bonded to a bottom surface of the second recess in a state where one surface thereof faces the bottom surface of the second recess. ### Claim 11 (depends on 10) The electronic part according to claim 10, further comprising: a plurality of first electrodes, formed at the ambient air contacting surface side of the sensor element; and a plurality of first pads, formed on the bottom surface of the first recess; and wherein the plurality of first electrodes are bonded to the plurality of first pads. ### Claim 12 (depends on 11) The electronic part according to claim 11, further comprising: a plurality of second electrodes, formed at the one surface side of the integrated circuit element; and a plurality of second pads, formed on the bottom surface of the second recess and connected to any of the plurality of first pads; and wherein the plurality of second electrodes are bonded to the plurality of second pads. ### Claim 13 (depends on 12) The electronic part according to claim 12, further comprising: a plurality of external terminals formed in a region of the one surface of the supporting substrate that surrounds the first recess and the second recess and connected to any of the plurality of second pads. ### Claim 14 (depends on 13) The electronic part according to claim 13, wherein the plurality of second pads are connected to any of the plurality of first pads via first wirings formed on the one surface of the supporting substrate, and the plurality of external terminals are connected to any of the plurality of second pads via second wirings formed on the one surface of the supporting substrate. ### Claim 15 (depends on 1) The electronic part according to claim 1, further comprising: an integrated circuit element supported by the supporting substrate; and wherein the supporting substrate has formed therein a third recess, depressed from the one surface of the supporting substrate, and a fourth recess, depressed further from a bottom surface of the third recess, the sensor element is bonded to a bottom surface of the fourth recess in a state where its ambient air contacting surface faces the bottom surface of the fourth recess and a gap, through which the ambient air flows, is formed between the ambient air contacting region and the bottom surface of the fourth recess, and the integrated circuit element is bonded to the bottom surface of the third recess in a state where one surface thereof faces the bottom surface of the third recess and a gap, through which the ambient air flows, is formed between the one surface and the bottom surface of the third recess. ### Claim 16 (depends on 15) The electronic part according to claim 15, further comprising: a plurality of first electrodes, formed at the ambient air contacting surface side of the sensor element; and a plurality of first pads, formed on the bottom surface of the fourth recess; and wherein the plurality of first electrodes are bonded to the plurality of first pads. ### Claim 17 (depends on 16) The electronic part according to claim 16, further comprising: a plurality of second electrodes, formed at the one surface side of the integrated circuit element; and a plurality of second pads, formed on the bottom surface of the third recess and connected to any of the plurality of first pads; and wherein the plurality of second electrodes are bonded to the plurality of second pads. ### Claim 18 (depends on 17) The electronic part according to claim 17, further comprising: a plurality of external terminals formed in a region of the one surface of the supporting substrate that surrounds the third recess and connected to any of the plurality of second pads. ### Claim 19 (depends on 18) The electronic part according to claim 18, wherein the plurality of second pads are connected to any of the plurality of first pads via first wirings formed inside the supporting substrate, and the plurality of external terminals are connected to any of the plurality of second pads via second wirings formed inside the supporting substrate.