# US 2017/0284880 A1 · Multi-Die Pressure Sensor Package > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2017/0284880 A1 - Document ID: US20170284880A1 - Status: Published application - Kind: A1 - Application number: 15/084,232 - Filed: 2016-03-29 - Published: 2017-10-05 - Earliest claimed: 2016-03-29 - Assignees: Infineon Technologies AG - Applicants: Infineon Technologies AG - Inventors: Sebastian Beer; Horst Theuss - Web page: https://patentgrep.com/patent/US20170284880A1 ## CPC - G01L 9/0041: {Transmitting or indicating the displacement of flexible diaphragms} - G01L 19/14: Housings {(G01L19/0007, G01L19/0084, G01L19/0092, G01L19/04, G01L19/06 take precedence)} - H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers} - H10W 70/465: {Bumps or wires} - H10W 74/016: {using moulds} - H10W 74/131: {the semiconductor body being only partially enclosed} - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - G01F 15/14: Casings, e.g. of special material - H10W 70/681: {comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage} - H10W 72/073: {of die-attach connectors} - H10W 72/075: {of bond wires} - H10W 72/536: {the connected ends being ball-shaped} - H10W 72/5363: {the connected ends being wedge-shaped} - H10W 72/884: {Die-attach connectors and bond wires} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 74/10: characterised by their shape or disposition - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - G01L: MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE (weighing G01G) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - G01F: MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME ## Abstract A pressure sensor package includes a pressure sensor having a first side attached to a substrate and a second side opposite the first side, the first side having a pressure inlet aligned with an opening in the substrate, the second side having one or more electrical contacts. A logic die attached to an opposite side of the substrate as the pressure sensor is operable to process signals from the pressure sensor. First electrical conductors connect to the one or more electrical contacts of the pressure sensor. Second electrical conductors connect to one or more electrical contacts of the logic die. A mold compound completely encapsulates the second electrical conductors and at least partly encapsulates the logic die and the first electrical conductors. An open passage in the mold compound is aligned with the opening in the substrate so as to define a pressure port of the pressure sensor package. ## Claims ### Claim 1 A pressure sensor package, comprising: a substrate having an opening; a pressure sensor having a first side attached to the substrate and a second side opposite the first side, the first side having a pressure inlet aligned with the opening in the substrate, the second side having one or more electrical contacts; a logic die attached to an opposite side of the substrate as the pressure sensor and operable to process signals from the pressure sensor; first electrical conductors connected to the one or more electrical contacts of the pressure sensor; second electrical conductors connected to one or more electrical contacts of the logic die; a mold compound completely encapsulating the second electrical conductors and at least partly encapsulating the logic die and the first electrical conductors; and an open passage in the mold compound which is aligned with the opening in the substrate so as to define a pressure port of the pressure sensor package. ### Claim 2 (depends on 1) The pressure sensor package of claim 1, wherein the logic die and the pressure sensor at least partly overlap in a vertical direction perpendicular to the first side of the pressure sensor. ### Claim 3 (depends on 1) The pressure sensor package of claim 1, wherein the logic die has an opening aligned with the open passage in the mold compound and the opening in the substrate, and wherein the pressure port of the pressure sensor package is further defined by the opening in the logic die. ### Claim 4 (depends on 3) The pressure sensor package of claim 3, wherein each sidewall which defines the open passage in the mold compound terminates at a surface of the logic die facing away from the substrate, and wherein each sidewall which defines the opening in the logic die is uncovered by the mold compound. ### Claim 5 (depends on 3) The pressure sensor package of claim 3, wherein each sidewall which defines the open passage in the mold compound terminates at a surface of the substrate to which the logic die is attached, and wherein each sidewall which defines the opening in the logic die is covered by the mold compound. ### Claim 6 (depends on 1) The pressure sensor package of claim 1, wherein the substrate is a circuit board, a ceramic substrate or part of a lead frame. ### Claim 7 (depends on 1) The pressure sensor package of claim 1, wherein the first electrical conductors and the second electrical conductors comprise bond wires. ### Claim 8 (depends on 1) The pressure sensor package of claim 1, further comprising: a plurality of leads embedded in the mold compound at a first end and protruding out of the mold compound at a second end, the second end of the leads forming external electrical contacts of the pressure sensor package, wherein the first electrical conductors connect the one or more electrical contacts of the pressure sensor to one or more of the leads, wherein the second electrical conductors connect the one or more electrical contacts of the logic die to one or more of the leads. ### Claim 9 (depends on 8) The pressure sensor package of claim 8, wherein the first end of the leads terminate in the mold compound at a different level than the substrate so that the first end of the leads and the substrate are vertically offset within the mold compound. ### Claim 10 (depends on 1) The pressure sensor package of claim 1, wherein: the pressure sensor comprises a first glass substrate attached to the opposite side of the substrate as the logic die and having an opening which forms the pressure inlet, a semiconductor die stacked on the first glass substrate and comprising a membrane, and a second glass substrate stacked on the semiconductor die and comprising a cavity; the pressure port of the pressure sensor package is further defined by the opening in the first glass substrate; the opening in the first glass substrate is aligned with the membrane at one side of the membrane so as to permit air flowing into the pressure port to impinge upon the membrane; and the cavity in the second glass substrate is aligned with the membrane at an opposite side of the membrane as the first glass substrate so as to permit movement of the membrane in response to the air flow. ### Claim 11 (depends on 1) The pressure sensor package of claim 1, wherein: the pressure sensor comprises a semiconductor die attached to the opposite side of the substrate as the logic die and having a membrane and a recessed region; the pressure port of the pressure sensor package is further defined by the recessed region of the semiconductor die; and the recessed region of the semiconductor die is aligned with the membrane so as to permit air flowing into the pressure port to impinge upon the membrane. ### Claim 12 (depends on 1) The pressure sensor package of claim 1, further comprising a silicone gel covering the pressure sensor and part of the first electrical conductors, the silicone gel being interposed between the mold compound and the pressure sensor. ### Claim 13 A method of manufacturing a pressure sensor package, the method comprising: attaching a first side of a pressure sensor to a substrate which has an opening, the pressure sensor having a second side opposite the first side, the first side having a pressure inlet aligned with the opening in the substrate, the second side having one or more electrical contacts; attaching a logic die to an opposite side of the substrate as the pressure sensor, the logic die operable to process signals from the pressure sensor; connecting first electrical conductors to the one or more electrical contacts of the pressure sensor; connecting second electrical conductors to one or more electrical contacts of the logic die; completely encapsulating the second electrical conductors and at least partly encapsulating the logic die and the first electrical conductors in a mold compound; and forming an open passage in the mold compound which is aligned with the opening in the substrate so as to define a pressure port of the pressure sensor package. ### Claim 14 (depends on 13) The method of claim 13, further comprising: aligning an opening in the logic die with the open passage in the mold compound and the opening in the substrate, wherein the pressure port of the pressure sensor package is further defined by the opening in the logic die. ### Claim 15 (depends on 14) The method of claim 14, wherein mold compound is formed such that each sidewall which defines the open passage in the mold compound extends to and terminates at a surface of the logic die facing away from the substrate and each sidewall which defines the opening in the logic die is uncovered by the mold compound. ### Claim 16 (depends on 14) The method of claim 14, wherein mold compound is formed such that each sidewall which defines the open passage in the mold compound extends to and terminates at a surface of the substrate to which the logic die is attached and each sidewall which defines the opening in the logic die is covered by the mold compound. ### Claim 17 (depends on 13) The method of claim 13, further comprising: embedding a plurality of leads in the mold compound at a first end and such that the leads protrude out of the mold compound at a second end, the second end of the leads forming external electrical contacts of the pressure sensor package; connecting the one or more electrical contacts of the pressure sensor to one or more of the leads via the first electrical conductors; and connecting the one or more electrical contacts of the logic die to one or more of the leads via the second electrical conductors. ### Claim 18 (depends on 13) The method of claim 13, wherein attaching the first side of the pressure sensor to the substrate comprises: attaching a first glass substrate of the pressure sensor to the opposite side of the substrate as the logic die, the first glass substrate having an opening which forms the pressure inlet, the pressure sensor further having a semiconductor die stacked on the first glass substrate and comprising a membrane, and a second glass substrate stacked on the semiconductor die and comprising a cavity, wherein the pressure port of the pressure sensor package is further defined by the opening in the first glass substrate, wherein the first glass substrate is attached to the opposite side of the substrate as the logic die such that the opening in the first glass substrate is aligned with the membrane at one side of the membrane so as to permit air flowing into the pressure port to impinge upon the membrane, and the cavity in the second glass substrate is aligned with the membrane at an opposite side of the membrane as the first glass substrate so as to permit movement of the membrane in response to the air flow. ### Claim 19 (depends on 13) The method of claim 13, wherein the pressure sensor comprises a semiconductor die attached to the opposite side of the substrate as the logic die and having a membrane and a recessed region, wherein the pressure port of the pressure sensor package is further defined by the recessed region of the semiconductor die, the method further comprising: aligning the recessed region of the semiconductor die with the membrane so as to permit air flowing into the pressure port to impinge upon the membrane. ### Claim 20 (depends on 13) The method of claim 13, further comprising: covering the pressure sensor and part of the first electrical conductors with a silicone gel, the silicone gel being interposed between the mold compound and the pressure sensor.