# US 2017/0284644 A1 · Illumination device

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2017/0284644 A1
- Document ID: US20170284644A1
- Status: Published application
- Kind: A1
- Application number: 15/631,482
- Filed: 2017-06-23
- Published: 2017-10-05
- Earliest claimed: 2012-05-29
- Assignees: Epistar Corporation
- Applicants: Epistar Corporation
- Inventors: Chih-Ping Ho; Chih-Wei Liao; Shyi-Ming Pan
- Web page: https://patentgrep.com/patent/US20170284644A1

## CPC

- F21V 21/14: Adjustable mountings
- F21K 9/20: Light sources comprising attachment means
- F21V 3/02: characterised by the shape
- F21V 17/10: characterised by specific fastening means or way of fastening (F21V17/02 - F21V17/08 take precedence)
- F21V 21/00: Supporting, suspending, or attaching arrangements for lighting devices (F21V17/00, F21V19/00 take precedence; arrangement of signalling or lighting devices, the mounting or supporting thereof or circuits therefor, for vehicles in general B60Q, stands for supporting apparatus or articles in general F16M11/00); Hand grips
- F21V 21/002: making direct electrical contact, e.g. by piercing (F21V21/35 takes precedence)
- F21V 23/06: the elements being coupling devices {, e.g. connectors}
- F21V 29/85: characterised by the material (liquid coolants F21V29/56)
- H10H 20/813: having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
- H10H 20/84: Coatings, e.g. passivation layers or antireflective coatings
- H10H 20/85: Packages
- H10H 20/8506: {Containers}
- H10H 20/851: Wavelength conversion means
- H10H 20/8514: {characterised by their shape, e.g. plate or foil}
- H10H 20/8515: {not being in contact with the bodies}
- H10H 20/8516: {having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer or wavelength conversion layer with a concentration gradient}
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10H 29/142: {Two-dimensional arrangements, e.g. asymmetric LED layout}
- H10H 29/24: comprising multiple light-emitting semiconductor devices
- H10H 29/8508: {Package substrates, e.g. submounts}
- H10W 90/00: Package configurations
- F21K 9/232: specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
- F21K 9/27: Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
- F21K 9/64: using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
- F21K 9/65: specially adapted for changing the characteristics or the distribution of the light, e.g. by adjustment of parts
- F21Y 2107/00: Light sources with three-dimensionally disposed light-generating elements
- F21Y 2107/50: on planar substrates or supports, but arranged in different planes or with differing orientation, e.g. on plate-shaped supports with steps on which light-generating elements are mounted
- F21Y 2107/70: on flexible or deformable supports or substrates, e.g. for changing the light source into a desired form
- F21Y 2109/00: Light sources with light-generating elements disposed on transparent or translucent supports or substrates
- F21Y 2115/10: Light-emitting diodes [LED]
- H10H 20/01335: {the light-emitting regions comprising nitride materials}
- H10H 20/819: characterised by their shape, e.g. curved or truncated substrates
- H10H 29/8512: {Wavelength conversion materials}
- H10H 29/8517: {Colour filters}
- H10H 29/855: Optical field-shaping means, e.g. lenses
- H10H 29/856: Reflecting means
- H10W 72/01515: {Forming coatings}
- H10W 72/07236: {Soldering or alloying}
- H10W 72/07251: {characterised by changes in properties of the bump connectors during connecting}
- H10W 72/075: {of bond wires}
- H10W 72/07554: {changes in dispositions}
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 72/225: {Bumps having a filler embedded in a matrix}
- H10W 72/227: {Multiple bumps having different sizes}
- H10W 72/237: {Multiple bump connectors having different shapes}
- H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
- H10W 72/253: {not comprising solid metals or solid metalloids, e.g. polymers or ceramics}
- H10W 72/29: Bond pads specially adapted therefor
- H10W 72/354: {comprising polymers}
- H10W 72/536: {the connected ends being ball-shaped}
- H10W 72/5363: {the connected ends being wedge-shaped}
- H10W 72/547: {Dispositions of multiple bond wires}
- H10W 72/551: {Materials of bond wires}
- H10W 72/5524: {comprising aluminium [Al]}
- H10W 72/5525: {comprising copper [Cu]}
- H10W 72/59: Bond pads specially adapted therefor
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 72/931: {Shapes of bond pads}
- H10W 72/932: {Plan-view shape, i.e. in top view}
- H10W 72/944: {Dispositions of multiple bond pads}
- H10W 72/953: {not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/753: {between laterally-adjacent chips}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED

## Abstract

An illumination device includes a supporting base, and a light-emitting element inserted in the supporting base. The light-emitting element includes a substrate having a supporting surface and a side surface, a light-emitting chip disposed on the supporting surface, and a first wavelength conversion layer covering the light-emitting chip and only a portion of the supporting surface without covering the side surface.

## Claims

### Claim 1

An illumination device comprising:
a supporting base; and
a light-emitting element inserted in the supporting base, and comprising:
a substrate having a supporting surface and a side surface;
a light-emitting chip disposed on the supporting surface; and
a first wavelength conversion layer covering the light-emitting chip and only a portion of the supporting surface without covering the side surface.

### Claim 2 (depends on 1)

The illumination device of claim 1, further comprising a first connecting conductor formed on the supporting surface and electrically connected to the light-emitting chip by a wire.

### Claim 3 (depends on 2)

The illumination device of claim 2, wherein the first connecting conductor extends to an edge of the substrate.

### Claim 4 (depends on 2)

The illumination device of claim 2, further comprising a second connecting conductor, wherein the first connecting conductor and the second connecting conductor are disposed at opposite sides of the light-emitting chip.

### Claim 5 (depends on 1)

The illumination device of claim 1, wherein the supporting base has a socket for receiving the light-emitting element.

### Claim 6 (depends on 1)

The illumination device of claim 1, wherein the supporting base is inclined with respect to the light-emitting element by an angle of 30°-150°.

### Claim 7 (depends on 1)

The illumination device of claim 1, further comprising a second wavelength conversion layer, wherein the substrate further comprises a main surface opposite to the supporting surface and covered by the second wavelength conversion layer.

### Claim 8 (depends on 7)

The illumination device of claim 7, wherein the first wavelength conversion layer and the second wavelength conversion layer have different areas.

### Claim 9 (depends on 7)

The illumination device of claim 7, wherein the second wavelength conversion layer does not cover the side surface.

### Claim 10 (depends on 1)

The illumination device of claim 1, further comprising a lamp housing enclosing the light-emitting element.

### Claim 11

An illumination device comprising:
a supporting base; and
a light-emitting element inserted in the supporting base and comprising:
a substrate;
a plurality of light-emitting chips disposed on the supporting base, and having a first chip with a first end, and a last chip with a last end; and
a first connecting conductor disposed on the supporting base and extending beyond the first end.

### Claim 12 (depends on 11)

The illumination device of claim 11, further comprising a wavelength conversion layer covering the plurality of light-emitting chips.

### Claim 13 (depends on 12)

The illumination device of claim 12, wherein the first connecting conductor is longer than the wavelength conversion layer.

### Claim 14 (depends on 12)

The illumination device of claim 12, wherein the wavelength conversion layer has an area less than that of the substrate.

### Claim 15 (depends on 11)

The illumination device of claim 11, wherein the first connecting conductor extends to an edge of the substrate.

### Claim 16 (depends on 11)

The illumination device of claim 11, wherein the supporting base has a socket for receiving the substrate.

### Claim 17 (depends on 11)

The illumination device of claim 11, wherein the first connecting conductor is electrically connected to at least one of the plurality of light-emitting chips by a wire.

### Claim 18 (depends on 11)

The illumination device of claim 11, further comprising a second connecting conductor disposed on the substrate and electrically connected to the plurality of light-emitting chips.

### Claim 19 (depends on 11)

The illumination device of claim 11, further comprising a lamp housing enclosing the light-emitting element.

### Claim 20 (depends on 19)

The illumination device of claim 19, further comprising a base connected to the lamp housing.