US 2017/0283677 A1Published application

Uv-thickening thermally conductive silicone grease composition

AssigneeShin-Etsu Chemical Co., Ltd.

InventorMitsuhiro IWATA

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Abstract

A UV-thickening thermally conductive silicone grease composition: which has (A) an organopolysiloxane, the viscosity at 25° C. of which is 50-100,000 mPa·s and which contains at least one alkenyl group in a single molecule, (B) an organohydrogenpolysiloxane, a single molecule of which contains a hydrogen atom directly bonded to at least two silicon atoms, (C) a photoactive platinum complex curing catalyst, and (D) a thermally conductive filler with a thermal conductivity of at least 10 W/m·° C. as essential components; and the viscosity at 25° C. of which is 30-800 Pa·s when measured at a 10 rpm rotation rate using a Malcom viscometer. For this UV-thickening thermally conductive silicone grease composition, shape-retaining properties at low viscosity are high, deep curing properties can be adjusted using the UV irradiation dose, and the composition after being thickened by irradiating UV rays does not become hard but sets so as to be malleable.

A UV-thickening, heat-conductive silicone grease composition comprising, as essential components,

(A) 100 parts by weight of an organopolysiloxane having a viscosity of 50 to 100,000 mPa·s at 25° C. and containing at least one alkenyl group per molecule,
(B) an organohydrogenpolysiloxane containing at least two silicon-bonded hydrogen atoms per molecule in such an amount that the number of Si—H groups divided by the number of alkenyl groups in the composition may fall in the range from 0.1 to 5.0,
(C) an effective amount of a photoactive platinum complex curing catalyst selected from the group consisting of
trimethyl(acetylacetonato)platinum complex,
trimethyl(2,4-pentanedionate)platinum complex,
trimethyl(3,5-heptanedionate)platinum complex,
trimethyl(methylacetoacetate)platinum complex,
bis(2,4-pentanedionato)platinum complex,
bis(2,4-hexanedionato)platinum complex,
bis(2,4-heptanedionato)platinum complex,
bis(3,5-heptanedionato)platinum complex,
bis(1-phenyl-1,3-butanedionato)platinum complex,
bis(1,3-diphenyl-1,3-propanedionato)platinum complex,
(1,5-cyclooctadienyl)dimethyl platinum complex,
(1,5-cyclooctadienyl)diphenyl platinum complex,
(1,5-cyclooctadienyl)dipropyl platinum complex,
(2,5-norbornadiene)dimethyl platinum complex,
(2,5-norbornadiene)diphenyl platinum complex,
(cyclopentadienyl)dimethyl platinum complex,
(methylcyclopentadienyl)diethyl platinum complex,
(trimethylsilylcyclopentadienyl)diphenyl platinum complex,
(methylcycloocta-1,5-dienyl)diethyl platinum complex,
(cyclopentadienyl)trimethyl platinum complex,
(cyclopentadienyl)ethyldimethyl platinum complex,
(cyclopentadienyl)acetyldimethyl platinum complex,
(methylcyclopentadienyl)trimethyl platinum complex,
(methylcyclopentadienyl)trihexyl platinum complex,
(trimethylsilylcyclopentadienyl)trimethyl platinum complex,
(dimethylphenylsilylcyclopentadienyl)triphenyl platinum complex, and
(cyclopentadienyl)dimethyltrimethylsilylmethyl platinum complex, and
(D) 100 to 20,000 parts by weight of a heat-conductive filler having a thermal conductivity of at least 10 W/m·° C.,
the composition having a viscosity of 30 to 800 Pa·s at 25° C. as measured by a Malcom viscometer at a rotational speed of 10 rpm.

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Abstract

Claims8