# US 2017/0283672 A1 · Thermosetting resin composition > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2017/0283672 A1 - Document ID: US20170283672A1 - Status: Published application - Kind: A1 - Application number: 15/473,170 - Filed: 2017-03-29 - Published: 2017-10-05 - Earliest claimed: 2016-03-30 - Assignees: Asahi Kasel Kabushiki Kaisha - Applicants: ASAHI KASEl KABUSHIKI KAISHA - Inventors: Akinori Inoue; Shozo Takada - Web page: https://patentgrep.com/patent/US20170283672A1 ## CPC - C09K 3/10: {Materials in mouldable or extrudable form} for sealing or packing joints or covers (filling pastes C09D5/34) - C08G 59/20: characterised by the epoxy compounds used - C08G 59/50: Amines - C08L 63/00: Compositions of epoxy resins; Compositions of derivatives of epoxy resins - C09J 163/00: Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins - H10W 74/016: {using moulds} - H10W 74/47: comprising organic materials, e.g. plastics or resins - H10W 74/473: {containing a filler} - C08K 3/013: Fillers, pigments or reinforcing additives - C08K 3/36: Silica - C08K 2201/005: Additives being defined by their particle size in general - C08K 2201/006: Additives being defined by their surface area - C09K 2003/1078: {Fire-resistant, heat-resistant materials} - H10W 72/884: {Die-attach connectors and bond wires} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - C09K: MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) ## Abstract A resin composition including at least (A) an epoxy resin, (B) a curing agent and (C) an inorganic filler, satisfies the following conditions: (I-I) the minimum modulus is no greater than 104 MPa when evaluated at a set temperature of 200° C. after temperature increase from room temperature to 200° C. at 50° C./min by evaluation with a rheometer, and the final modulus is 105 MPa or greater from 10 minutes after the initial temperature increase; (I-II) the softening point of the epoxy resin (A) is 35° C. or higher; (I-III) the residual solvent in the resin composition is no greater than 0.1%; and (I-IV) the equivalent value of the curing agent (B) is no greater than 90 g/eq and the softening point is 105° C. or higher. ## Claims ### Claim at position 1 -6. (canceled) ### Claim 7 A resin composition including (A) an epoxy resin, (B) a curing agent and (C) an inorganic filler, and satisfying the following conditions: (I-I) the minimum modulus is no greater than 104 MPa by evaluation with a rheometer, when evaluated at a set temperature of 200° C. after temperature increase from 23° C. to 200° C. at 50° C./min; (I-II) the softening point of the epoxy resin (A) is 35° C. or higher; (I-III) the residual solvent in the resin composition is less than 0.1 wt %; and (I-IV) the softening point of the curing agent (B) is 105° C. or higher. ### Claim 8 (depends on 7) The resin composition according to claim 7, wherein, under the condition (I-I), the final modulus is 105 MPa or greater from 10 minutes after the temperature increase. ### Claim 9 (depends on 7) The resin composition according to claim 7, wherein, under the condition (I-IV), the equivalent value of the curing agent (B) is no greater than 90 g/eq. ### Claim 10 (depends on 7) A resin composition according to claim 7, wherein the curing agent (B) is a compound with amino groups. ### Claim 11 (depends on 7) A sealing material comprising the cured product of a resin composition according to claim 7. ### Claim 12 (depends on 11) A semiconductor device wherein a semiconductor element is sealed with a sealing material according to claim 11. ### Claim 13 (depends on 11) A method for producing a semiconductor device, including a step of sealing a semiconductor element by compression molding using a sealing material according to claim 11. ### Claim 14 A resin composition including (A) an epoxy resin, (B) a curing agent and (C) an inorganic filler, and satisfying the following conditions: (II-I) X atoms other than C, O, H and N atoms in the main component of the inorganic filler (C) (the component present in a range of 1 to 95 mol %), based on EDX measurement, are on the surface of the inorganic filler (C) in the resin composition; (II-II) the weight percentage of the inorganic filler (C) in the resin composition is no greater than 95 wt %; (II-III) the mean particle size of the inorganic filler (C) is 0.5 μm or greater; (II-IV) a ratio of the specific surface area of the inorganic filler (C) for the total resin composition is no greater than 3 m2/g; (II-V) the softening point of the epoxy resin (A) is 35° C. or higher; (II-VI) the residual solvent in the resin composition is less than 0.1 wt %; and (II-VII) the softening point of the curing agent (B) is 105° C. or higher. ### Claim 15 (depends on 14) The resin composition according to claim 14, wherein, under the condition (II-I), the abundance ratio of C atoms of the epoxy resin (A) or curing agent (B) and the X atoms of the inorganic filler (C), based on EDX measurement, on the surface of the inorganic filler (C) in the resin composition satisfies the following formula: C/X=≧1 wherein C is defined as a molar concentration of the C atoms and X is defined as a molar concentration of the X atoms. ### Claim 16 (depends on 14) The resin composition according to claim 14, wherein, under the condition (II-VII), the equivalent value of the curing agent (B) is no greater than 90 g/eq and the softening point is 105° C. or higher. ### Claim 17 (depends on 14) A resin composition according to claim 14, wherein the curing agent (B) is a compound with amino groups. ### Claim 18 (depends on 14) A sealing material comprising the cured product of a resin composition according to claim 14. ### Claim 19 (depends on 18) A semiconductor device wherein a semiconductor element is sealed with a sealing material according to claim 18. ### Claim 20 (depends on 18) A method for producing a semiconductor device, including a step of sealing a semiconductor element by compression molding using a sealing material according to claim 18.