# US 2017/0283295 A1 · Mold stack for forming 3d glass-based articles > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2017/0283295 A1 - Document ID: US20170283295A1 - Status: Published application - Kind: A1 - Application number: 15/475,897 - Filed: 2017-03-31 - Published: 2017-10-05 - Earliest claimed: 2016-04-05 - Assignees: Corning Incorporated - Applicants: Corning Incorporated - Inventors: Jacob Immerman; Andrew Peter Kittleson; Rohit Rai; Ljerka Ukrainczyk - Web page: https://patentgrep.com/patent/US20170283295A1 ## CPC - C03B 11/125: {Cooling} - C03B 23/0093: {Tools and machines specially adapted for re-forming shaped glass articles in general, e.g. chucks (C03B23/0086, C03B23/02, C03B23/04, C03B23/18 take precedence)} - C03B 23/0235: {involving applying local or additional heating, cooling or insulating means} - C03B 23/0357: {by suction without blowing, e.g. with vacuum or by venturi effect} - C03B 2215/03: defined by material properties or parameters, e.g. relative CTE of mould parts - C03B 2215/06: Metals or alloys - C03B: MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES ## Abstract A mold stack for forming 3D glass-based articles includes a plenum and a cooling structure integrated with the plenum. The mold stack includes a mold with a flange that can be used to mount the mold on the plenum. The mold stack includes features to reduce mold warp without significantly increasing thermal mass. ## Claims ### Claim 1 A mold stack for forming 3D glass-based articles, comprising: a plenum having a plenum base integrated with a plenum enclosure wall, the plenum base and plenum enclosure wall defining a plenum chamber; a cooling structure disposed within the plenum chamber, the cooling structure comprising: a cooling structure enclosure wall integrated with the plenum base such that a portion of the plenum base forms a cooling structure base, the cooling structure enclosure wall dividing the plenum chamber into a cooling chamber within the cooling structure enclosure wall and a process chamber outside of the cooling structure enclosure wall; a diffuser plate mounted on the cooling structure enclosure wall, the diffuser plate isolating the cooling chamber from the process chamber; and an inlet hole and an exit hole formed in the cooling structure base, the inlet hole and exit hole being in communication with the cooling chamber; and a mold having a flange at a periphery thereof, the flange being removably attached to a top surface of the plenum enclosure wall. ### Claim 2 (depends on 1) The mold stack of claim 1, further comprising an insulation block disposed underneath the plenum. ### Claim 3 (depends on 1) The mold stack of claim 1, further comprising a tube assembly having a first fluid passage in communication with the cooling chamber and a second fluid passage in communication with the process chamber ### Claim 4 (depends on 1) The mold stack of claim 1, wherein a portion of a bottom surface of the mold is in opposing relation with a top surface of the diffuser plate when the flange is attached to the top surface of the plenum enclosure wall. ### Claim 5 (depends on 4) The mold stack of claim 4, wherein a gap between the portion of the bottom surface of the mold that is in opposing relation with the top surface of the diffuser plate is in a range from 0 to 25 microns. ### Claim 6 (depends on 5) The mold stack of claim 5, wherein the top surface of the diffuser plate is level with the top surface of the plenum enclosure wall. ### Claim 7 (depends on 1) The mold stack of claim 1, wherein a bottom surface of the mold is contoured to apply a preload to the mold. ### Claim 8 (depends on 1) The mold stack of claim 1, wherein mounting holes are formed in each of the plenum enclosure wall and the flange, and wherein a pattern of the mounting holes in the plenum enclosure wall matches a pattern of the mounting holes in the flange such that the mounting holes in the plenum enclosure wall can be aligned with the mounting holes in the flange. ### Claim 9 (depends on 8) The mold stack of claim 8, wherein the pattern of the mounting holes is selected to provide a sealed interface between the flange and the plenum enclosure wall when fasteners are received in the mounting holes and made up. ### Claim 10 (depends on 8) The mold stack of claim 8, wherein the mounting holes are adapted to receive fasteners to removably attach the flange to the plenum enclosure wall. ### Claim 11 (depends on 10) The mold stack of claim 10, wherein at least a portion of the mounting holes are adapted to receive fasteners from a top surface of the flange. ### Claim 12 (depends on 10) The mold stack of claim 10, wherein the mounting holes are adapted to receive fasteners from a bottom surface of the plenum, and wherein a top surface of the plenum enclosure wall is flat. ### Claim 13 (depends on 8) The mold stack of claim 8, wherein the mold is made of a nickel alloy and the flange is attached to the top surface of the plenum enclosure wall by means of at least one strip of bolts having a strip made of an alloy having a higher strength than the nickel alloy. ### Claim 14 (depends on 1) The mold stack of claim 1, further comprising a tube attached to the cooling structure base, wherein at least two first orifices are formed in a surface of the tube exposed to the cooling chamber, the at least two first orifices being in communication with the cooling chamber, wherein at least one second orifice is formed in a surface of the tube in contact with the cooling structure base, the at least one second orifice being in communication with the exit hole. ### Claim 15 (depends on 14) The mold stack of claim 14, wherein the inlet hole is located at the center of the cooling structure base, and wherein the at least two first orifices are located near opposite edges of the cooling structure base. ### Claim 16 (depends on 15) The mold stack of claim 15, wherein the at least two orifices are symmetrical about the inlet hole. ### Claim 17 (depends on 1) The mold stack of claim 1, wherein the mold has at least one vacuum hole, and wherein the at least one vacuum hole communicates with the process chamber. ### Claim 18 (depends on 1) The mold stack of claim 1, wherein the plenum enclosure wall has a uniform wall thickness, the plenum base has a uniform base thickness, a ratio of the plenum enclosure wall thickness to the plenum base thickness is in a range from 0.8 to 1.2, and a ratio of the plenum base thickness to a wall height of the plenum enclosure wall is in a range from 0.6 to 1.0. ### Claim 19 (depends on 18) The mold stack of claim 18, wherein a ratio of the plenum base thickness to a thickness of a center of the mold is in a range from 0.8 to 1.2, and wherein a ratio of the plenum enclosure wall thickness to the mold center thickness is in a range from 0.8 to 1.2. ### Claim 20 (depends on 1) The mold stack of claim 1, wherein the diffuser plate is made of a high thermal conductivity material with a minimum plate thickness of 3 mm. ### Claim 21 (depends on 20) The mold stack of claim 20, wherein the high thermal conductivity material is a nickel alloy.