# US 2017/0283256 A1 · Apparatus and methods for integrated mems devices > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2017/0283256 A1 - Document ID: US20170283256A1 - Status: Published application - Kind: A1 - Application number: 15/479,154 - Filed: 2017-04-04 - Published: 2017-10-05 - Earliest claimed: 2016-04-04 - Assignees: mCube Inc. - Applicants: mCube, Inc. - Inventors: Ben LEE; Ming Hong KUO; Wen-Chih CHEN; Wensen TSAI - Web page: https://patentgrep.com/patent/US20170283256A1 ## CPC - B81C 99/0045: {End test of the packaged device} - B81C 99/005: {Test apparatus} - G01R 1/0433: {Sockets for IC's or transistors} - G01R 31/2607: {Circuits therefor (G01R31/2642 takes precedence)} - H10P 72/0442: {Apparatus for placing on an insulating substrate, e.g. tape} - B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01) - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A method for a MEMS device includes receiving a diced wafer having a plurality devices disposed upon an adhesive substrate and having an associated known good device data, removing a first set of devices from the plurality of devices from the adhesive substrate in response to the known good device data, picking and placing a first set of the devices into a plurality of sockets within a testing platform, testing the first set of integrated devices includes while physically stressing the first set of devices, providing electrical power to the first set of devices and receiving electrical response data from the first set of devices, determining a second set of devices from the first set of devices, in response to the electrical response data, picking and placing the second set of devices into a transport tape media. ## Claims ### Claim 1 A system for a plurality of integrated devices comprising CMOS and MEMS devices, the system including: a receiving stage configured to receive a diced wafer comprising the plurality of integrated devices disposed upon an adhesive substrate, wherein the diced wafer is associated with a known good device data associated with the plurality of integrated devices; a reel and tape packaging stage configured to receive and seal a first set of integrated devices from the plurality of integrated devices into a transport tape media, and configured to wind the transport tape media upon a reel; a testing stage coupled to the receiving stage and to the reel and tape packaging stage, wherein the testing stage comprises a testing platform comprising a socket substrate having a plurality of sockets, wherein the socket substrate is removably coupled to the testing platform, wherein each socket from the plurality of sockets is configured to releasably secure an integrated device from the plurality of integrated devices and configured to provide electrical power to the integrated device and to receive electrical response data from the integrated device during a testing phase, and wherein the testing platform is configured to physically stress the integrated device during the testing phase; a first pick and place device coupled to the testing stage and to the receiving stage, wherein the first pick and place device is configured to remove a second set of integrated devices from the plurality of integrated devices from the adhesive substrate in response to the known good device data, and wherein the first pick and place device is configured to dispose the second set of integrated devices into the plurality of sockets of the socket substrate; and a second pick and place device coupled to the testing stage and to the reel and tape packaging stage, wherein the second pick and place device is configured to remove the second set of integrated devices from the socket substrate, and wherein the second pick and place device is configured to dispose the first set of integrated devices into the transport tape media of the reel and tape packaging stage in response to electrical response data from integrated devices from the second set of integrated devices. ### Claim 2 (depends on 1) The system of claim 1 wherein a number of integrated devices from the first set of integrated devices is equal to or less than a number of integrated devices from the second set of integrated devices. ### Claim 3 (depends on 1) The system of claim 1 wherein the physical stress comprises shaking stress; and wherein the testing platform is configured to shake the second set of integrated devices in a direction selected from a group consisting of: x-direction, y-direction, z-direction, x-y-direction, x-z-direction, and y-z direction. ### Claim 4 (depends on 1) The system of claim 1 wherein the physical stress comprises rotational stress; and wherein the testing platform is configured to rotate the second set of integrated devices along an axis selected from a group consisting of: x-axis, y-axis, z-axis, x-y-axis, x-z-axis, and y-z axis. ### Claim 5 (depends on 1) The system of claim 1 wherein the MEMS devices are selected from a group consisting of: an accelerometer, a gyroscope, a magnetometer and a pressure sensor. ### Claim 6 (depends on 1) The system of claim 1 wherein the testing stage further comprises a processor coupled to the testing platform, wherein the processor is configured to determine integrated devices for the first set of integrated devices from the second set of integrated devices in response to the electrical response data from integrated devices from the second set of integrated devices. ### Claim 7 (depends on 6) The system of claim 6 wherein the processor is configured to compare electrical response data for each integrated device in the second set of integrated devices to a plurality of threshold data to determine the first set of integrated devices. ### Claim 8 The system of 6 wherein the electrical response indicates a lack of a stiction condition. ### Claim 9 (depends on 1) The system of claim 1 wherein the second set of integrated devices is selected from the plurality of integrated devices in response to the known good device data. ### Claim 10 (depends on 1) The system of claim 1 wherein the tape and reel stage comprises at least a first transport tape media and a second transport tape media; wherein the second pick and place device is configured to dispose the first set of integrated devices into the first transport tape media of the reel and tape packaging stage in response to electrical response data from integrated devices from the second set of integrated devices; and wherein the second pick and place device is configured to dispose remaining integrated devices from the second set of integrated devices not within the first set of integrated devices into the second transport tape media. ### Claim 11 A method comprising: receiving in a receiving stage, a diced wafer having a plurality of integrated devices comprising CMOS and MEMS devices disposed upon an adhesive substrate, wherein the diced wafer is associated with a known good device data associated with the plurality of integrated devices; removing with a first pick and place device, a first set of integrated devices from the plurality of integrated devices from the adhesive substrate in response to the known good device data; placing with the first pick and place device, the first set of integrated devices into a plurality of sockets within a socket substrate; testing with the testing platform, the first set of integrated devices comprising: while physically stressing with the testing platform, the first set of integrated devices, providing with the plurality of sockets, electrical power to the first set of integrated devices and receiving with the plurality of sockets, electrical response data from the first set of integrated devices; determining with a processing unit coupled to the testing platform, a second set of integrated devices from the first set of integrated devices, in response to the electrical response data; removing with a second pick and place device, the second set of integrated devices from the plurality of sockets within the first substrate; and disposing the second set of integrated devices into a transport tape media. ### Claim 12 (depends on 11) The method of claim 11 wherein a number of integrated devices from the second set of integrated devices is equal to or less than a number of integrated devices from the first set of integrated devices. ### Claim 13 (depends on 11) The method of claim 11 physical stressing the first set of integrated devices comprises shaking the first set of integrated devices; and wherein the shaking comprises shaking the testing platform in a direction selected from a group consisting of: x-direction, y-direction, z-direction, x-y-direction, x-z-direction, and y-z direction. ### Claim 14 (depends on 11) The method of claim 11 physical stressing the first set of integrated devices comprises rotating the first set of integrated devices; and wherein the rotating comprises rotating the testing platform along an axis selected from a group consisting of: x-axis, y-axis, z-axis, x-y-axis, x-z-axis, and y-z axis. ### Claim 15 (depends on 11) The method of claim 11 wherein the MEMS devices are selected from a group consisting of: an accelerometer, a gyroscope, a magnetometer and a pressure sensor. ### Claim 16 (depends on 11) The method of claim 11 wherein the determining the second set of integrated devices comprises: comparing with the processing unit the electrical response data from the first set of integrated devices against threshold data to determine comparison data; and determining with the processing unit, the second set of integrated devices from the first set of integrated devices, in response to the comparison data. ### Claim 17 (depends on 16) The method of claim 16 wherein the comparison data indicates a stiction condition associated with an integrated device from the first set of integrated devices. ### Claim 18 (depends on 16) The method of claim 16 wherein the comparison data indicates an out of range condition associated with an integrated device from the first set of integrated devices. ### Claim 19 (depends on 16) The method of claim 16 wherein the comparison data indicates a ringing condition associated with an integrated device from the first set of integrated devices. ### Claim 20 (depends on 11) The method of claim 11 removing with the second pick and place device, remaining integrated devices from the first set of integrated devices not within the second set of integrated devices from the socket substrate; and placing the remaining integrated devices into a disposal region.