# US 2017/0283250 A1 · Multi-pressure mems package

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- Number: US 2017/0283250 A1
- Document ID: US20170283250A1
- Status: Published application
- Kind: A1
- Application number: 15/626,764
- Filed: 2017-06-19
- Published: 2017-10-05
- Earliest claimed: 2016-03-24
- Assignees: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicants: Taiwan Semiconductor Manufacturing Co., Ltd.
- Inventors: Yu-Chia Liu; Chia-Hua Chu; Chun-Wen Cheng; Kuei-Sung Chang; Jung-Huei Peng
- Web page: https://patentgrep.com/patent/US20170283250A1

## CPC

- B81B 3/0051: {For defining the movement, i.e. structures that guide or limit the movement of an element (mechanical arrangements for preventing or damping vibration or shock H01H3/60)}
- B81B 7/02: containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] (B81B7/04 takes precedence)
- B81C 2203/0118: Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
- B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00)
- B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01)

## Abstract

The present disclosure relates to a microelectromechanical systems (MEMS) package having two MEMS devices with different pressures, and an associated method of formation. In some embodiments, the (MEMS) package includes a device substrate and a cap substrate bonded together. The device substrate includes a first trench and a second trench. A first MEMS device is disposed over the first trench and a second MEMS device is disposed over the second trench. A first stopper is raised from a first trench bottom surface of the first trench but below a top surface of the device substrate and a second stopper is raised from a second trench bottom surface of the second trench but below the top surface of the device substrate. A first depth of the first trench is greater than a second depth of the second trench.

## Claims

### Claim 1

A microelectromechanical systems (MEMS) package comprising:
a device substrate comprising a first trench and a second trench;
a first MEMS device disposed over the first trench and a second MEMS device disposed over the second trench; and
a cap substrate bonded to the device substrate, enclosing a first cavity over the first MEMS device and a second cavity over the second MEMS device;
wherein a first stopper is raised from a first trench bottom surface of the first trench but below a top surface of the device substrate and a second stopper is raised from a second trench bottom surface of the second trench but below the top surface of the device substrate;
wherein a first depth of the first trench is greater than a second depth of the second trench.

### Claim 2 (depends on 1)

The MEMS package of claim 1, wherein top surfaces of the first stopper and the second stopper are coplanar.

### Claim 3 (depends on 1)

The MEMS package of claim 1, wherein the second cavity has a second pressure that is different from a first pressure of the first cavity.

### Claim 4 (depends on 1)

The MEMS package of claim 1, wherein the device substrate and the cap substrate are bonded through a first bonding metal layer disposed on the device substrate and a second bonding metal layer, wherein a portion of the second bonding metal layer is disposed directly above the first or second MEMS device and configured as an upper stopper to prevent over movement or stiction of the first or second MEMS device.

### Claim 5 (depends on 4)

The MEMS package of claim 4, further comprising:
a polysilicon pillar extending through the cap substrate and electrically coupled to the first MEMS device or the second MEMS device through the first bonding metal layer and the second bonding metal layer; and
a contact pad disposed at a back side surface of the cap substrate and in contact with the polysilicon pillar.

### Claim 6

A microelectromechanical systems (MEMS) package comprising:
a device substrate comprising a first trench and a second trench;
a first MEMS device overlying the first trench and a second MEMS device overlying the second trench;
wherein a first depth of the first trench is greater than a second depth of the second trench.

### Claim 7 (depends on 6)

The MEMS package of claim 6, further comprising:
a first stopper raised from a first trench bottom surface of the first trench and a second stopper raised from a second trench bottom surface of the second trench.

### Claim 8 (depends on 7)

The MEMS package of claim 7, wherein the first stopper and the second stopper have a substantially equal height relative to a top surface of the device substrate.

### Claim 9 (depends on 6)

The MEMS package of claim 6, further comprising:
a cap substrate bonded to the device substrate, enclosing a first cavity over the first MEMS device and a second cavity over the second MEMS device.

### Claim 10 (depends on 9)

The MEMS package of claim 9, wherein an upper stopper is disposed on the cap substrate at a position corresponding to the first MEMS device or the second MEMS device to be enclosed.

### Claim 11 (depends on 9)

The MEMS package of claim 9, wherein a recess is disposed in a front side of the cap substrate bonded to a front side of the device substrate.

### Claim 12 (depends on 9)

The MEMS package of claim 9, wherein the cap substrate and the device substrate are bonded by a second bonding metal layer at a front side of the cap substrate including a bonding pad disposed at a position corresponding to a first bonding metal layer of the device substrate.

### Claim 13 (depends on 6)

The MEMS package of claim 6, wherein the second MEMS device is disposed in a second cavity which has a second pressure that is different from a first pressure of a first cavity of the first MEMS device.

### Claim 14

A microelectromechanical systems (MEMS) package comprising:
a device substrate comprising a first trench and a second trench;
a first MEMS device disposed over the first trench and a second MEMS device disposed over the second trench; and
a cap substrate bonded to the device substrate, enclosing a first cavity over the first MEMS device and a second cavity over the second MEMS device;
wherein the device substrate and the cap substrate are bonded through a first bonding metal layer disposed on the device substrate and a second bonding metal layer, wherein a the second bonding metal layer comprises a portion disposed directly above the first or second MEMS device not contacting the first bonding metal layer, wherein the portion of the second bonding metal layer is configured as an upper stopper to prevent over movement or stiction of the first or second MEMS device.

### Claim 15 (depends on 14)

The MEMS package of claim 14, wherein the second cavity has a second pressure that is different from a first pressure of the first cavity.

### Claim 16 (depends on 14)

The MEMS package of claim 14, further comprising:
a first stopper raised from a first trench bottom surface of the first trench and a second stopper raised from a second trench bottom surface of the second trench;
wherein a first depth of the first trench is greater than a second depth of the second trench.

### Claim 17 (depends on 16)

The MEMS package of claim 16,
wherein a first dielectric liner is disposed lining top surfaces of the first and second trenches, the first and second stoppers, and the device substrate.

### Claim 18 (depends on 16)

The MEMS package of claim 16, wherein top surfaces of the first stopper and the second stopper are below a top surface of the device substrate.

### Claim 19 (depends on 14)

The MEMS package of claim 14,
wherein the second bonding metal layer is disposed at a top surface of the cap substrate;
wherein a recess is disposed from the top surface into the cap substrate.

### Claim 20 (depends on 19)

The MEMS package of claim 19,
wherein a second dielectric liner is disposed on the top surface of the cap substrate between the second bonding metal layer and the cap substrate;
wherein bottom and sidewall surfaces of recess are not lined by the dielectric liner.