# US 2017/0283246 A1 · Transducer package with integrated sealing > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2017/0283246 A1 - Document ID: US20170283246A1 - Status: Published application - Kind: A1 - Application number: 15/478,946 - Filed: 2017-04-04 - Published: 2017-10-05 - Earliest claimed: 2016-04-04 - Assignees: Infineon Technologies AG - Applicants: Infineon Technologies AG - Inventors: Klaus ELIAN; Franz GABLER; Thomas MUELLER; Horst THEUSS; Mathias VAUPEL - Web page: https://patentgrep.com/patent/US20170283246A1 ## CPC - B81B 7/0035: {for maintaining a controlled atmosphere inside of the chamber containing the MEMS} - B81B 7/0061: {suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound} - B81C 1/00277: {for maintaining a controlled atmosphere inside of the cavity containing the MEMS} - B81B 2201/0257: Microphones or microspeakers - B81C 2203/019: characterised by the material or arrangement of seals between parts - H10W 72/01515: {Forming coatings} - H10W 72/075: {of bond wires} - H10W 72/884: {Die-attach connectors and bond wires} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/752: {between stacked chips} - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) - B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A package which comprises a carrier, a transducer mounted on the carrier and configured for converting between a package-external property and an electric signal, a package housing at least partially housing at least one of the carrier and the transducer, and a sealing which forms at least part of the package housing for sealing between the package and a package-external body. ## Claims ### Claim 1 A package, comprising: a carrier; a transducer mounted on the carrier and configured for converting between a package-external property and an electric signal; a package housing at least partially housing at least one of the carrier and the transducer; and a sealing for sealing between the package and a package-external body; wherein the sealing forms at least part of the package housing. ### Claim 2 (depends on 1) The package according to claim 1, wherein the sealing is configured for fluidically decoupling an interior with regard to an exterior of an electronic device when the package is mounted in the electronic device. ### Claim 3 (depends on 1) The package according to claim 1, wherein the package housing comprises or consists of an elastic material. ### Claim 4 (depends on 1) The package according to claim 1, wherein the package housing consists of the sealing. ### Claim 5 (depends on 1) The package according to claim 1, wherein the package housing comprises an encapsulant encapsulating at least part of at least one of the transducer and the carrier and being surrounded, in particular circumferentially delimited, by the sealing. ### Claim 6 (depends on 1) The package according to claim 1, wherein the sealing has an annular shape. ### Claim 7 (depends on 1) The package according to claim 1, wherein the sealing extends beyond an edge of the transducer in at least one of a vertical direction and a lateral direction. ### Claim 8 (depends on 1) The package according to claim 1, configured as one of a premolded package, a mold-over-chip package, and a Wafer Level Ball Grid Array package. ### Claim 9 (depends on 1) The package according to claim 1, comprising an electric coupling element, in particular at least one of a bond wire and a solder connection, configured for electrically coupling the transducer with the carrier and extending at least partially within the sealing. ### Claim 10 (depends on 1) The package according to claim 1, wherein the sealing is adhesively joint or in material engagement with a rest of the package housing. ### Claim 11 (depends on 1) The package according to claim 1, wherein at least one of the sealing and a rest of the package housing is made of a compressible material. ### Claim 12 (depends on 1) The package according to claim 1, wherein the sealing forms at least part of an exterior surface of the package housing. ### Claim 13 An electronic device, comprising: a device casing having a port; a package comprising a transducer and a package-integrated sealing; wherein the package is mounted in the device casing so that the transducer is coupled with an exterior of the device casing via the port and so that the sealing fluidically decouples an interior of the device casing from the port. ### Claim 14 (depends on 13) The electronic device according to claim 13, wherein the port is a through hole in the device casing. ### Claim 15 (depends on 13) The electronic device according to claim 13, wherein the electronic device is configured as one of the group consisting of a portable user equipment, a mobile phone, a smart phone, a watch, and a tablet. ### Claim 16 (depends on 13) The electronic device according to claim 13, comprising a mounting base on which a carrier of the package is mounted, in particular with which the carrier is electrically connected. ### Claim 17 (depends on 13) The electronic device according to claim 13, wherein the sealing is configured for sealing by being pressed between the device casing and a carrier of the package. ### Claim 18 (depends on 1, 13) The electronic device according to claim 13, wherein the package is configured as a package according to claim 1. ### Claim 19 A method of manufacturing a package, the method comprising: providing a transducer configured for converting between a package-external property and an electric signal; at least partially housing the transducer by a package housing; and forming a sealing as at least part of the package housing for sealing between the package and a package-external body. ### Claim 20 (depends on 19) The method according to claim 19, wherein the sealing is provided by one of the group consisting of molding, dispensing, vulcanizing, and pick-and-place assembling.