# US 2017/0257537 A1 · Camera device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2017/0257537 A1 - Document ID: US20170257537A1 - Status: Published application - Kind: A1 - Application number: 15/448,236 - Filed: 2017-03-02 - Published: 2017-09-07 - Earliest claimed: 2016-03-03 - Assignees: Denso Corporation - Applicants: Denso Corporation - Inventors: Soji Masui; Yasuki Furutake; Daisuke Takama; Kazuma Yamaguchi; Takashi Aoki - Web page: https://patentgrep.com/patent/US20170257537A1 ## CPC - H04N 23/55: Optical parts specially adapted for electronic image sensors; Mounting thereof - H04N 23/51: Housings - H04N 23/54: Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils - H04N 23/57: Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices - H05K 1/0274: {Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42)} - H05K 1/056: {the metal substrate being covered by an organic insulating layer} - H05K 1/09: Use of materials for the {conductive, e.g. } metallic pattern - H05K 1/181: associated with surface mounted components - H05K 2201/10121: Optical component, e.g. opto-electronic component - H05K 2201/10151: Sensor - H05K 2201/2018: Presence of a frame in a printed circuit or printed circuit assembly - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract A camera device which includes a holder which retains an optical member therein and a circuit board on which an image sensor is mounted. The holder is joined to the circuit board using an adhesive agent. The circuit board at least partially includes a metallic layer and a resinous layer stacked in a thickness-wise direction of the circuit board. The circuit board has a metallic layer-absent portion in which the metallic layer is partially omitted. The metallic layer-absent portion is located so as to overlap the joint between the holder and the circuit board in the thickness-wise direction of the circuit board, thereby minimizing the transfer of heat of the adhesive agent to the metallic layer. This achieves effective hardening the adhesive agent, which will facilitate the ease with which the camera device is assembled. ## Claims ### Claim 1 A camera device comprising: a circuit board (143) which at least partially includes a resinous layer (143c, 143e) and a metallic layer (143b, 143d, 143f) stacked in a thickness-wise direction thereof; an image sensor (144) which is disposed on the circuit board; an optical member (141) which works to direct light to said image sensor; a holder (142) which holds said optical member; and a thermosetting adhesive agent (16) which achieves a joint between said holder and said circuit board, wherein said circuit board has a metallic layer-absent portion (K) in which the metallic layer is partially omitted, the metallic layer-absent portion being located to overlap the joint between the holder and the circuit board in the thickness-wise direction of the circuit board. ### Claim 2 (depends on 1) A camera device as set forth in claim 1, wherein said circuit board at least partially includes the resinous layer and a plurality of metallic layers stacked in the thickness-wise direction thereof, the resinous layer being disposed between two of the metallic layers, and wherein the metallic layer-absent portion is made by partially omitting one of the metallic layers which is located closest to the joint between the holder and the circuit board. ### Claim 3 (depends on 1) A camera device as set forth in claim 1, wherein said circuit board at least partially includes the resinous layer and a plurality of metallic layers stacked in the thickness-wise direction thereof, the resinous layer being disposed between two of the metallic layers, and wherein the metallic layer-absent portion is made by omitting a portion of each of the metallic layers which overlaps the joint between the holder and the circuit aboard in the thickness-wise direction. ### Claim 4 (depends on 1) A camera device as set forth in claim 1, wherein the metallic layer is made of copper foil. ### Claim 5 (depends on 1) A camera device as set forth in claim 1, wherein the thermosetting adhesive agent is an epoxy adhesive. ### Claim 6 A camera device comprising: a circuit board (143); an image sensor (144) which is disposed on the circuit board; an optical member (141) which works to direct light to said image sensor; a holder (142) which holds said optical member; and a light curable adhesive agent (216) which achieves a joint between said holder and said circuit board. ### Claim 7 (depends on 6) A camera device as set forth in claim 6, further comprising a case which covers the image sensor, the circuit board, and the adhesive agent to prevent light from reaching the image sensor without passing through said optical member. ### Claim 8 (depends on 6) A camera device as set forth in claim 6, wherein the light curable adhesive agent is an epoxy adhesive.