# US 2017/0257130 A1 · Packaged intrinsic safe industrial modem > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2017/0257130 A1 - Document ID: US20170257130A1 - Status: Published application - Kind: A1 - Application number: 15/060,201 - Filed: 2016-03-03 - Published: 2017-09-07 - Earliest claimed: 2016-03-03 - Assignees: Honeywell International Inc. - Applicants: Honeywell International Inc. - Inventors: AJIT YADAV; MURALI THAVVA. V.V; MURALI KRISHNA BEZAWADA; JOHN BOETTGER - Web page: https://patentgrep.com/patent/US20170257130A1 ## CPC - H04B 1/3818: Arrangements for facilitating insertion or removal of identification devices - H04B: TRANSMISSION ## Abstract A packaged cellular modem system includes a capacitor for receiving power from a DC power source, a DC-to-DC converter coupled to capacitor electrodes, a cellular modem coupled to the converter output and to an antenna, and an IS barrier circuit coupled to a modem output. A microcontroller coupled to a boost regulator has its output coupled to electrodes. A metrology jumper is between the microcontroller and ground. An encapsulation material provides a potted area for the capacitor, converter, modem, IS barrier circuit and microcontroller. A SIM card is coupled to the modem by the IS barrier circuit. LED's are coupled to the microcontroller. The SIM card and LEDs are in a non-potted area. A transparent SIM card access cover over the SIM card and LEDs enables exposing the SIM card. ## Claims ### Claim 1 A packaged cellular modem system (modem system), comprising: a printed circuit board (PCB) upon which said modem system is configured on; at least one capacitor having electrodes coupled for receiving power from a DC power source, a DC-to-DC converter having inputs is coupled to said electrodes, a cellular modem coupled to an output of said DC-to-DC converter and coupled to an antenna through a first intrinsic safety (IS) barrier circuit, and a second IS barrier circuit coupled to an output of said cellular modem; a microcontroller control section including a microcontroller is coupled to a boost regulator having an output coupled to said electrodes for receiving power, and a metrology jumper coupled between said microcontroller and a ground pin; input/output (IO) connectors coupled to said cellular modem; an encapsulation material providing a potted area of said PCB which pots said capacitor, said DC-to-DC converter, said cellular modem, said second IS barrier circuit, and said microcontroller control section; a Subscriber Identity Module (SIM) card inserted into a SIM connector that is coupled to said cellular modem by said second IS barrier circuit; LED's coupled to said microcontroller, wherein said SIM card and said LEDs are in a non-potted area of said PCB; a visible light transparent SIM card access cover (transparent cover) over said SIM card and over said LEDs having a hinge pivoted to an encapsulation separator for lifting said transparent cover to expose said SIM card for providing access thereto. ### Claim 2 (depends on 1) The modem system of claim 1, wherein said capacitor comprises a supercapacitor. ### Claim 3 (depends on 1) The modem system of claim 1, wherein all said TO connectors are located on one side of said modem system. ### Claim 4 (depends on 1) The modem system of claim 1, wherein said metrology jumper is accessible for configuration by breaking a metrology seal and removing a connector cover that is over said metrology jumper. ### Claim 5 (depends on 1) The modem system of claim 1, wherein said encapsulation separator is configured including a sufficient height to function as a barrier for a filling process for applying said encapsulation material. ### Claim 6 (depends on 1) The modem system of claim 1, wherein said LED's are coupled to said microcontroller through at least one infallible resistor. ### Claim 7 (depends on 1) The modem system of claim 1, further comprising an outer case having a cutout which exposes said non-potted area of said PCB. ### Claim 8 (depends on 7) The modem system of claim 7, further comprising a connector cover secured to said outer case by metrology seals, wherein said connector cover is removable by breaking said metrology seals. ### Claim 9 (depends on 1) The modem system of claim 1, wherein said encapsulation separator comprises a material different from said encapsulation material. ### Claim 10 A packaged cellular modem system (modem system), comprising: a printed circuit board (PCB) upon which said modem system is configured on; at least one supercapacitor having electrodes coupled for receiving power from a DC power source, a DC-to-DC converter having inputs is coupled to said electrodes, a cellular modem coupled to an output of said DC-to-DC converter and coupled to an antenna through a first intrinsic safety (IS) barrier circuit, and a second IS barrier circuit coupled to an output of said cellular modem; a microcontroller control section including a microcontroller is coupled to a boost regulator having an output coupled to said electrodes for receiving power, and a metrology jumper coupled between said microcontroller and a ground pin; input/output (IO) connectors coupled to said cellular modem, wherein all said IO connectors are located on one side of said modem system; an encapsulation material providing a potted area of said PCB which pots said supercapacitor, said DC-to-DC converter, said cellular modem, said second IS barrier circuit, and said microcontroller control section; a Subscriber Identity Module (SIM) card inserted into a SIM connector that is coupled to said cellular modem by said second IS barrier circuit; LED's coupled to said microcontroller, wherein said SIM card and said LEDs are in a non-potted area of said PCB; a visible light transparent SIM card access cover (transparent cover) over said SIM card and over said LEDs having a hinge pivoted to an encapsulation separator for lifting said transparent cover to expose said SIM card for providing access thereto. ### Claim 11 (depends on 10) The modem system of claim 10, wherein said metrology jumper is accessible for configuration by breaking a metrology seal and removing a connector cover that is over said metrology jumper. ### Claim 12 (depends on 10) The modem system of claim 10, wherein said encapsulation separator is configured including a sufficient height to function as a barrier for a filling process for applying said encapsulation material. ### Claim 13 (depends on 10) The modem system of claim 10, wherein said LED's are coupled to said microcontroller through at least one infallible resistor. ### Claim 14 (depends on 10) The modem system of claim 10, further comprising an outer case having a cutout which exposes said non-potted area of said PCB. ### Claim 15 (depends on 14) The modem system of claim 14, further comprising a connector cover secured to said outer case by metrology seals, wherein said connector cover is removable by breaking said metrology seals.