# US 2017/0256507 A1 · Signal transmission device using electromagnetic resonance coupler > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2017/0256507 A1 - Document ID: US20170256507A1 - Status: Published application - Kind: A1 - Application number: 15/423,589 - Filed: 2017-02-03 - Published: 2017-09-07 - Earliest claimed: 2016-03-02 - Assignees: Panasonic Intellectual Property Management Co., Lt - Applicants: Panasonic Intellectual Property Management Co., Lt - Inventors: SONGBAEK CHOE; SHUICHI NAGAI - Web page: https://patentgrep.com/patent/US20170256507A1 ## CPC - H10W 44/20: at high-frequency [HF] or radio frequency [RF] - H01P 1/20381: {Special shape resonators} - H01P 5/187: {Broadside coupled lines} - H01P 7/00: Resonators of the waveguide type - H01P 7/08: Strip line resonators - H04B 1/10: Means associated with receiver for limiting or suppressing noise or interference - H10W 70/041: {Connecting or disconnecting interconnections to or from leadframes, e.g. connecting bond wires or bumps} - H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers} - H10W 70/40: Leadframes - H10W 70/421: {Shapes or dispositions} - H10W 70/442: {of multiple leadframes in a single chip} - H10W 72/50: Bond wires - H10W 90/293: {characterised by non-galvanic coupling between the chips, e.g. capacitive coupling} - H10W 90/811: {Multiple chips on leadframes} - H10W 44/206: {Wires} - H10W 44/209: {Vertical interconnections, e.g. vias} - H10W 44/216: {Waveguides, e.g. strip lines} - H10W 44/241: {for passive devices or passive elements} - H10W 70/429: {being the outer leads} - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W 90/758: {between a chip and a stacked discrete passive device} - H10W 90/759: {between a chip and a laterally-adjacent discrete passive device} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H01P: WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE (operating at optical frequencies G02B) - H04B: TRANSMISSION ## Abstract A signal transmission device comprises: a first lead frame having a first major surface and a second major surface opposite to the first major surface; a second lead frame having a third major surface and a fourth major surface and isolated from the first lead frame, the fourth major surface located opposite to the third major surface; a transmission circuit that sends a transmission signal, the transmission circuit located on the first major surface of the first lead frame; a receiving circuit located on the third major surface of the second lead frame; and an electromagnetic resonance coupler located across between the second major surface of the first lead frame and the fourth major surface of the second lead frame to transmit the transmission signal, sent by the transmission circuit, to the receiving circuit in a contactless manner. ## Claims ### Claim 1 A signal transmission device comprising: a first lead frame having a first major surface and a second major surface opposite to the first major surface; a second lead frame having a third major surface and a fourth major surface and isolated from the first lead frame, the fourth major surface located opposite to the third major surface; a transmission circuit that sends a transmission signal, the transmission circuit located on the first major surface of the first lead frame; a receiving circuit located on the third major surface of the second lead frame; and an electromagnetic resonance coupler located across between the second major surface of the first lead frame and the fourth major surface of the second lead frame to transmit the transmission signal, sent by the transmission circuit, to the receiving circuit in a contactless manner. ### Claim 2 (depends on 1) The signal transmission device according to claim 1, wherein an end portion of the first lead frame is bent toward the first major surface side, and an end portion of the second lead frame is bent toward the third major surface side. ### Claim 3 (depends on 1) The signal transmission device according to claim 1, wherein an end portion of the first lead frame is bent toward the second major surface side, and an end portion of the second lead frame is bent toward the fourth major surface side. ### Claim 4 (depends on 1) The signal transmission device according to claim 1, wherein the electromagnetic resonance coupler includes a first terminal electrically connected to the transmission circuit, and a second terminal electrically connected to the receiving circuit; and wherein, when the electromagnetic resonance coupler is viewed from a direction perpendicular to the first major surface, the first terminal and the second terminal are located between the first lead frame and the second lead frame. ### Claim 5 (depends on 1) The signal transmission device according to claim 1, further comprising: a sealant that seals the transmission circuit, the receiving circuit, and the electromagnetic resonance coupler; and a heatsink that is provided on the second major surface of the first lead frame and is partly exposed from the sealant, wherein, when viewed from a direction perpendicular to the first major surface, the heatsink and the transmission circuit at least partly overlap each other. ### Claim 6 (depends on 5) The signal transmission device according to claim 5, wherein a gap is provided between the electromagnetic resonance coupler and the heatsink, and the first lead frame has an opening that communicates with the gap between the electromagnetic resonance coupler and the heatsink. ### Claim 7 (depends on 1) The signal transmission device according to claim 1, wherein the electromagnetic resonance coupler includes a first resonator that is electrically connected to the transmission circuit, and a second resonator that faces the first resonator and is electrically connected to the receiving circuit; and wherein the transmission circuit sends a signal, obtained by modulating a high-frequency wave with an input signal, to the first resonator as the transmission signal, the first resonator transmits the transmission signal, sent by the transmission circuit, to the second resonator in the contactless manner, the second resonator sends the transmission signal, transmitted by the first resonator in the contactless manner, to the receiving circuit, and the receiving circuit receives the transmission signal sent by the second resonator and demodulates the received transmission signal to generate an output signal corresponding to the input signal. ### Claim 8 (depends on 7) The signal transmission device according to claim 7, wherein each of a wiring-line length of the first resonator and a wiring-line length of the second resonator is one-fourth of a wavelength of the high-frequency wave. ### Claim 9 (depends on 1) The signal transmission device according to claim 1, wherein the electromagnetic resonance coupler further includes a heat diffusion layer thermally connected to the first lead frame. ### Claim 10 (depends on 9) The signal transmission device according to claim 9, wherein the electromagnetic resonance coupler further includes a first terminal that provides electrical connection between the electromagnetic resonance coupler and the transmission circuit, and a second terminal that provides thermal connection between the heat diffusion layer and the first lead frame, and wherein the second terminal is directly connected to the first lead frame, and is different from the first terminal. ### Claim 11 (depends on 9) The signal transmission device according to claim 9, wherein the heat diffusion layer comprises a ground shield for the electromagnetic resonance coupler. ### Claim 12 (depends on 9) The signal transmission device according to claim 9, wherein the heat diffusion layer is a first ground shield for the electromagnetic resonance coupler, the first ground shield having the same potential as that of ground for the transmission circuit; wherein the electromagnetic resonance coupler further includes a first metal layer that includes a first resonator electrically connected to the transmission circuit, a second metal layer that includes a second resonator electrically connected to the receiving circuit, and a second ground shield that has the same potential as that of ground for the receiving circuit; and wherein a thickness of the heat diffusion layer is larger than any of a thickness of the first metal layer, a thickness of the second metal layer, and a thickness of the second ground shield. ### Claim 13 (depends on 1) The signal transmission device according to claim 1, wherein the first major surface of the first lead frame and the third major surface of the second lead frame are directed in the same direction. ### Claim 14 (depends on 1) The signal transmission device according to claim 1, wherein the electromagnetic resonance coupler has a fifth major surface, and the second major surface of the first lead frame and the fourth major surface of the second lead frame are located on the fifth major surface. ### Claim 15 (depends on 14) The signal transmission device according to claim 14, wherein the first major surface of the first lead frame and the third major surface of the second lead frame are located in a same hypothetical plane. ### Claim 16 A manufacturing method for a signal transmission device including a first lead frame having a first major surface and a second major opposite to the first major surface, a second lead frame having a third major surface and a fourth major surface and isolated from the first lead frame, the fourth major surface located opposite to the third major surface, a transmission circuit that sends a transmission signal, a receiving circuit, and an electromagnetic resonance coupler that transmits the transmission signal, sent by the transmission circuit, to the receiving circuit in a contactless manner, the manufacturing method comprising: arranging the electromagnetic resonance coupler across between the second major surface of the first lead frame and the fourth major surface of the second lead frame; arranging, after the arranging of the electromagnetic resonance coupler, the transmission circuit on the first major surface of the first lead frame; and arranging, after the arranging of the electromagnetic resonance coupler, the receiving circuit on the third major surface of the second lead frame.