# US 2017/0256451 A1 · Self-aligned interconnects > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2017/0256451 A1 - Document ID: US20170256451A1 - Status: Published application - Kind: A1 - Application number: 15/451,175 - Filed: 2017-03-06 - Published: 2017-09-07 - Earliest claimed: 2016-03-07 - Assignees: Imec Vzw - Applicants: IMEC vzw - Inventors: Juergen Boemmels; Zsolt Tokei; Christopher Wilson - Web page: https://patentgrep.com/patent/US20170256451A1 ## CPC - H10W 20/069: {by forming self-aligned vias or self-aligned contact plugs} - H10W 20/035: {combinations of barrier, adhesion or liner layers, e.g. multi-layered barrier layers} - H10W 20/063: {by forming conductive members before forming protective insulating material} - H10W 20/0633: {using subtractive patterning of the conductive members} - H10W 20/0693: {by forming self-aligned vias} - H10W 20/074: {of dielectric parts comprising thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers} - H10W 20/089: {using processes for implementing desired shapes or dispositions of the openings, e.g. double patterning} - H10W 20/092: {by smoothing the dielectric parts} - H10W 20/42: Vias, e.g. via plugs - H10W 20/425: {Barrier, adhesion or liner layers} - H10W 20/43: Layouts of interconnections - H10W 20/47: comprising two or more dielectric layers having different properties, e.g. different dielectric constants - H10W 20/077: {on sidewalls or on top surfaces of conductors (H10W20/076 takes precedence)} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An interconnect structure and a method for forming it is disclosed. In one aspect, the method includes the steps of providing a first entity. The first entity includes a first set of line structures. The first set of line structures include a first set of conductive lines, and a first set of dielectric lines made of a first dielectric material and aligned with and overlaying the first set of conductive lines. The first entity also includes gaps separating the line structures and filled with a second dielectric material of such a nature that the first dielectric material can be selectively etched with respect to the second dielectric material. The method also includes providing a patterned mask on the first entity. The method further includes etching selectively the first dielectric material through the patterned mask so as to form one or more vias in the first dielectric material. The method also includes removing the patterned mask. ## Claims ### Claim 1 A method of forming an interconnect structure, comprising the steps of: providing a first entity comprising: a first set of one or more line structures having a top surface, comprising: a first set of one or more conductive lines, a first set of one or more dielectric lines of width (w) made of a first dielectric material, aligned with and overlaying the first set of one or more conductive lines, and comprising the top surface, a second dielectric material of such a nature that the first dielectric material can be etched selectively with respect to the second dielectric material, the second dielectric material surrounding each line structure and having a top surface coplanar with the top surface of the one or more line structures; providing a patterned mask on the first entity, wherein the pattern comprises: at least one via exposing the whole width (w) of an underlying dielectric line of the first set of one or more dielectric lines, and/or at least one trench exposing the whole width (w) of at least one dielectric line of the first set of one or more dielectric lines; etching selectively the first dielectric material with respect to the second dielectric material through the patterned mask so as to form one or more vias in the first dielectric material, thereby exposing a portion of the set of one or more conductive lines; and removing the patterned mask, thereby uncovering a perforated surface. ### Claim 2 (depends on 1) The method according to claim 1, wherein the first set of line structures provided in step a have the first dielectric material exposed at the top surface thereof and have side surfaces comprising a conductive portion and a dielectric portion wherein at least the conductive portion is at least partially coated with a first dielectric barrier material, the first dielectric barrier material being such that the first dielectric material can be etched selectively with respect to the first dielectric barrier material. ### Claim 3 (depends on 1) The method according to claim 1, wherein the first set of conductive lines comprises: optionally a first set of diffusion barrier lines, a first set of metal lines aligned with and overlaying the first set of diffusion barrier lines if present, and optionally a second set of diffusion barrier lines aligned with and overlaying the first set of metal lines, wherein the first set of dielectric lines is aligned with and overlaying the second set of diffusion barrier lines if present or the first set of metal lines in absence of the second set of diffusion barrier lines, and wherein etching selectively exposes a portion of the second set of diffusion barrier lines if present or a portion of the first set of metal lines in absence of the second set of diffusion barrier lines. ### Claim 4 (depends on 3) The method according to claim 3, wherein providing the first entity (18a) comprises the steps of: providing a substrate; optionally overlying the substrate (with a first diffusion barrier layer; overlying a first metal layer on the first diffusion barrier layer if present or on the substrate if no first diffusion barrier layer is present; optionally overlying the first metal layer with a second diffusion barrier layer; overlying a layer of a first dielectric material on the second diffusion barrier layer if present or on the first metal layer if no second diffusion barrier layer is present; providing a first patterned mask on the layer of a first dielectric material, wherein the pattern comprises lines separated by gaps; etching the layer of a first dielectric material, the second diffusion barrier layer if present, the first metal layer, and the first diffusion barrier layer if present, through the first patterned mask, thereby forming a first set of line structures separated by gaps, the first set of line structures comprising a first set of metal lines; removing the first patterned mask; optionally coating the first set of line structures with a first dielectric barrier material so as to at least entirely coat all exposed surfaces of the first set of metal lines, the first dielectric barrier material being such that the first dielectric material can be etched selectively with respect to the first dielectric barrier material; overlaying the first set of line structures and the first dielectric barrier material if present with a second dielectric material in such a way as to fill the gaps and as to cover entirely the first set of line structures and the first dielectric barrier material if present, wherein the second dielectric material is such that the first dielectric material can be etched selectively with respect to the second dielectric material, thereby providing an intermediate first entity; and planarizing the intermediate first entity by removing a top portion thereof in such a way that the first dielectric material is exposed, thereby providing the first entity. ### Claim 5 (depends on 1) The method according to claim 1, further comprising the steps of: providing a second entity on the first entity, the second entity comprising: a second set of line structures at an angle relative to the first set of line structures, wherein at least one of the line structures is aligned with at least one of the one or more vias and penetrating the at least one of the one or more vias so as to connect with the exposed portion of the first set of conductive lines, the second set of line structures comprising: a second set of conductive lines wherein at least one of the conductive lines is aligned with at least one of the one or more vias and penetrating at least one of the one or more vias, and a second set of dielectric lines made of a third dielectric material and aligned with and overlaying the second set of conductive lines; and gaps separating the line structures and filled with a fourth dielectric material of such a nature that the third dielectric material can be etched selectively with respect to the fourth dielectric material. ### Claim 6 (depends on 5) The method according to claim 5, wherein providing the second entity comprises: optionally overlying the perforated surface with a third diffusion barrier layer penetrating the one or more vias and connecting with the exposed portion of the first set of conductive lines; overlying a second metal layer on the third diffusion barrier layer if present or on the perforated surface, so as to fill the one or more vias and connect with the exposed portion of the first set of conductive lines; optionally overlying the second metal layer with a fourth diffusion barrier layer; overlying a layer of a third dielectric material on the fourth diffusion barrier layer if present or on the second metal layer if no fourth diffusion barrier layer is present, providing a third patterned mask on the layer of a third dielectric material, wherein the pattern comprises lines separated by gaps, wherein the lines are at an angle relative to the first set of line structures, wherein at least one of the line structures is aligned with at least one of the one or more vias; etching the layer of a third dielectric material, the fourth diffusion barrier layer if present, the second metal layer, and the third diffusion barrier layer if present, through the third patterned mask, thereby forming the second set of line structures separated by gaps; removing the third patterned mask; optionally coating the second set of line structures with a second dielectric barrier material so as to at least entirely coat all exposed surfaces of the second set of conductive lines, the second dielectric barrier material being such that the third dielectric material can be etched selectively with respect to the second dielectric barrier material; overlaying the second set of line structures and the second dielectric barrier material if present with a fourth dielectric material in such a way as to fill the gaps and as to cover entirely the second set of line structures and the second dielectric barrier material if present, wherein the fourth dielectric material is such that the third dielectric material can be etched selectively with respect to the fourth dielectric material, thereby providing an intermediate second entity; and planarizing the intermediate second entity by removing a top portion thereof in such a way that the third dielectric material is exposed, thereby providing the second entity. ### Claim 7 (depends on 3) The method according to claim 3, wherein the metal comprises copper and wherein all optional steps are performed. ### Claim 8 (depends on 5) The method according to claim 5, wherein the second set of line structures is perpendicular to the first set of line structures. ### Claim 9 (depends on 6) The method according to claim 6, wherein etching through the second metal layer and the third diffusion barrier layer if present is continued until: away from the one or more vias, it exposes either the top surface of the second dielectric material underlying the second metal layer, or the third diffusion barrier layer if present; and in the one or more vias, it exposes the second barrier layer if present or a metal line. ### Claim 10 An interconnect structure comprising: a first set of one or more line structures comprising: a first set of one or more conductive lines, a first set of one or more dielectric lines made of a first dielectric material and aligned with and overlaying the first set of one or more conductive lines; and a second dielectric material of such a nature that the first dielectric material can be etched selectively with respect to the second dielectric material, the second dielectric material surrounding each line structure and having a top surface coplanar with the top surface of the line structures, wherein the first set of dielectric lines is perforated with one or more vias exposing a portion of the first set of conductive lines. ### Claim 11 (depends on 10) The interconnect structure according to claim 10, wherein the first set of conductive lines comprises: optionally a first set of diffusion barrier lines, a first set of metal lines, and optionally a second set of diffusion barrier lines, wherein when the first set of diffusion barrier lines is present, it is aligned with and overlaid by the first set of metal lines, wherein the second set of diffusion barrier lines if present is aligned with and is overlying the first set of metal lines, wherein the first set of dielectric lines is aligned with and is overlying the second set of barrier lines if present or the first set of metal lines in absence of the second set of barrier lines, wherein the first set of dielectric lines is perforated with one or more vias exposing a portion of the first set of conductive lines. ### Claim 12 (depends on 11) The interconnect structure according to claim 11, wherein the first set of line structures have the first dielectric material exposed at the top surface thereof and have side surfaces comprising a conductive portion and a dielectric portion, wherein at least part of the conductive portion has a coating of a first dielectric barrier material thereon, the first dielectric barrier material being such that the first dielectric material can be etched selectively with respect to the first dielectric barrier material. ### Claim 13 (depends on 12) The interconnect structure according to claim 12, wherein the first set of line structures is coated with the dielectric barrier material so as to at least entirely coat all exposed surfaces of the first set of metal lines. ### Claim 14 (depends on 9) The interconnect structure according to claim 9, further comprising a second set of line structures at an angle relative to the first set of line structures, wherein at least one of the line structures is aligned with at least one of the one or more vias and penetrating the one of the one or more vias so as to connect with the exposed portion of the first set of conductive lines, the line structures being separated by gaps, the second set of line structures comprising: a second set of conductive lines penetrating the one or more vias, a second set of dielectric lines made of a third dielectric material and aligned with and overlaying the second set of conductive lines, wherein a fourth dielectric material, of such a nature that the third dielectric material can be etched selectively with respect to the fourth dielectric material, surrounds each line structure and has a top surface coplanar with the top surface of the line structures of the second set. ### Claim 15 (depends on 10) The interconnect structure according to claim 10, wherein the metal comprises copper and wherein the interconnect structure includes all optional features. ### Claim 16 (depends on 14) The interconnect structure according to claim 14, wherein the second set of line structures is perpendicular to the first set of line structures.