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US 2017/0255098 A1Published application
Positive type resist composition for use in liquid immersion exposure and a method of forming the pattern using the same
AssigneeFUJIFILM Corporation
InventorsHiromi KOBAYASHI, Haruki INABE
Life of this patent
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Abstract
A resist composition contains (A) a resin having a monocyclic or polycyclic cycloaliphatic hydrocarbon structure, the resin increasing its solubility in an alkali developer by an action of acid, (B) a compound generating acid upon irradiation with one of an actinic ray and a radiation, (C) particular an alkali soluble compound, and (D) a solvent.
Claims15
A resist composition for ArF exposure comprising:
- (A) a resin having a monocyclic or polycyclic cycloaliphatic hydrocarbon structure, the resin increasing its solubility in an alkali developer by an action of acid;
- (B) a compound generating the acid upon irradiation with one of an actinic ray and a radiation;
- (C) a resin containing a repeating unit represented by the following formula (Cc), an amount of the resin (C) being 1 to 10% by mass based on the total solid components in the resist composition;
- and
- (D) a solvent,
- wherein
- Xc represents a hydrogen atom, a methyl group or an alkyl group having 5 or more carbon atoms;
- Rf1 and Rf2 each represents a hydrogen atom or an alkyl group and at least one of Rf1 and Rf2 represents a fluorine-substituted alkyl group;
- Qc represents a single bond or a (nc+1)-valent linking group;
- and
- nc represents a positive integer.
8 more elements
Dependencies are inferred from the claim text.