# US 2017/0254705 A1 · Microbolometer contact systems and methods

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- Number: US 2017/0254705 A1
- Document ID: US20170254705A1
- Status: Published application
- Kind: A1
- Application number: 15/600,482
- Filed: 2017-05-19
- Published: 2017-09-07
- Earliest claimed: 2009-10-09
- Assignees: FLIR Systems, Inc.
- Applicants: FLIR Systems, Inc.
- Inventors: Eric A. Kurth; Patrick Franklin
- Web page: https://patentgrep.com/patent/US20170254705A1

## CPC

- G01J 5/20: using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
- C25D 1/003: {3D structures, e.g. superposed patterned layers}
- C25D 5/022: {using masking means}
- G01J 5/023: {Particular leg structure or construction or shape; Nanotubes}
- G01J 5/024: {Special manufacturing steps or sacrificial layers or layer structures}
- H04N 25/76: Addressed sensors, e.g. MOS or CMOS sensors
- G01J 2005/0077: {Imaging}
- G01J: MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY (light sources F21, H01J, H01K, H05B; investigating properties of materials by optical means G01N)
- C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION

## Abstract

Systems and methods are directed to contacts for an infrared detector. For example, an infrared imaging device includes a substrate having a first metal layer and an infrared detector array coupled to the substrate via a plurality of contacts. Each contact includes for an embodiment a plurality of metal studs each having a first end and a second end and each disposed between the first metal layer and a second metal layer, wherein the first end of each metal stud is disposed on a portion of the first metal layer that is at least partially on the surface of the substrate.

## Claims

### Claim 1

An infrared imaging device comprising:
a substrate having a first metal layer disposed at least partially on a surface of the substrate; and
an infrared detector array coupled to the substrate via a plurality of contacts.