Multi-channel optical communications integrated circuit chip having an improved layout for use in multi-channel optical transmitters, receivers and transceivers

A multi-channel optical transmitter integrated circuit (IC) chip having a layout the helps prevent or reduce electrical cross talk and maintain high signal integrity, the IC chip comprising:

• an optical interface side for interfacing the chip with an optoelectronic array chip comprising an array of optoelectronic elements positioned side by side such that centers of adjacent optoelectronic elements are separated from one another by a first pitch;
• a first electrical interface side, the first electrical interface side being opposite and parallel to the optical interface side;
• N electrical channels, where N is a positive integer that is greater than or equal to four, each electrical channel being partitioned into at least first and second channel portions that are electrically interconnected with one another, each first channel portion having a first end located on the optical interface side and a second end that is opposite the first end, the second channel portions having firsts ends that are located on one of the electrical interface sides and second ends that are opposite the respective first ends of the second channel portions, the first channel portions extending in a direction away from the optical interface side and perpendicular to the optical interface side, wherein adjacent first channel portions are separated from one another by the first pitch, wherein adjacent second channel portions are separated from one another by a second pitch that is greater than the first channel pitch and that is sufficiently great to prevent electrical cross talk between high speed signal paths of adjacent second channel portions.

A multi-channel optical communications integrated circuit (IC) chip having a layout the helps dissipate heat, the IC chip comprising:

• an optical interface side for interfacing the chip with an optoelectronic array chip comprising an array of optoelectronic elements positioned side by side such that centers of adjacent optoelectronic elements are separated from one another by a first pitch;
• first, second and third electrical interface sides, the first electrical interface side being opposite and parallel to the optical interface side, the second and third electrical interface sides being opposite and parallel to one another and perpendicular to the first electrical interface side;
• at least one auxiliary block located in corner of the multi-channel optical communications IC chip;
• and
• N electrical channels, where N is a positive integer that is greater than or equal to four, each electrical channel being partitioned into at least first and second channel portions that are electrically interconnected with one another, each first channel portion having a first end located on the optical interface side and a second end that is opposite the first end, the second channel portions having firsts ends that are located on one of the electrical interface sides and second ends that are opposite the respective first ends of the second channel portions, the first channel portions extending in a direction away from the optical interface side and perpendicular to the optical interface side, wherein adjacent first channel portions are separated from one another by the first pitch, wherein adjacent second channel portions are separated from one another by a second pitch that is greater than the first channel pitch, wherein locating the second channel portions such that first ends of the second channel portions are located on one of the electrical interface sides helps with heat dissipation by spreading out the circuit elements of the channel over a wide area of the multi-channel optical communications IC chip.