Electronic device
AssigneeTaiyo Yuden Co., Ltd.
InventorsTakuma KUROYANAGI, Kazushige HATAKEYAMA
Life of this patent
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Abstract
An electronic device includes: a first substrate including a first functional element located on an upper surface of the first substrate; a second substrate that is flip-chip mounted on the upper surface of the first substrate through a bump, and includes a second functional element located on a lower surface of the second substrate; and a sealing member that is located on the upper surface of the first substrate, surrounds the second substrate in plan view, is not located between the first substrate and the second substrate, seals the first functional element and the second functional element so that the first functional element and the second functional element are located across an air gap.
Claims11
An electronic device comprising:
- a first substrate including a first functional element located on an upper surface of the first substrate;
- a second substrate that is flip-chip mounted on the upper surface of the first substrate through a bump, and includes a second functional element located on a lower surface of the second substrate;
- and
- a sealing member that is located on the upper surface of the first substrate, surrounds the second substrate in plan view, is not located between the first substrate and the second substrate, seals the first functional element and the second functional element so that the first functional element and the second functional element are located across an air gap.
Dependencies are inferred from the claim text.