US 2017/0250659 A1 · RADIO FREQUENCY AMPLIFIER SYSTEM AND HEAT DISSIPATION DEVICE THEREOF

Abstract

In a radio frequency (RF) amplifier system and a heat dissipation device thereof, the RF amplifier system includes an RF amplifier and a heat dissipation device. The RF amplifier includes an RF power element. The heat dissipation device includes a heat conduction board, a plurality of heat pipes and fins. The heat conduction board is thermally conductively coupled to the RF power element, and one end of the heat pipe is thermally conductively coupled to the heat conduction board. The fins are arranged in parallel and spaced from each other. The other end of each of the heat pipes is inserted through the fins. The heat of the RF power element is conducted to the heat conduction board and the heat pipe, and then the heat is quickly conducted to the fins to be dissipated away quickly, and the RF power element can quickly reach a stable temperature.

Claims19

Dependent claims

A radio frequency (RF) amplifier system, comprising:

an RF amplifier including an RF power element;
and
a heat dissipation device including:
a heat conduction block, one side of the heat conduction block being in contact with the RF power element;
a heat conduction board thermally conductively coupled to the other side of the heat conduction block;
a plurality of heat pipes, an end of each of the heat pipes being disposed at the heat conduction block;
and
a plurality of fins disposed in parallel and spaced from each other on the heat conduction board, the other end of each of the heat pipes being inserted through the fins, wherein heat generated from the RF power element is conducted to the heat conduction block, and then the heat is conducted to the fins through the heat conduction board and the heat pipes.

5 more elements

A heat dissipation device of an RF amplifier system, for dissipating heat of an RF power element of an RF amplifier, comprising:

a heat conduction board thermally conductively coupled to the RF power element;
a plurality of heat pipes, each of the heat pipes including an evaporation section and a condensation section, the evaporation section of each of the heat pipes being thermally conductively coupled to the heat conduction board;
and
a plurality of fins arranged in parallel and spaced from each other, the condensation section of the heat pipes being inserted through the fins, wherein heat generated by the RF power element is conducted to the heat conduction board and the evaporation section of each of the heat pipes, and then is conducted to the fins through the condensation section of each of the heat pipes.

1 more element

Dependencies are inferred from the claim text.

Radio frequency amplifier system and heat dissipation device thereof

Life of this patent

Radio frequency amplifier system and heat dissipation device thereof

Life of this patent

Abstract

Claims19