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US 2017/0250484 A1Published application
Contact terminal and ic socket including the same
AssigneeYamaichi Electronics Co., Ltd.
InventorsHideki SAGANO, Hideki SATO
Life of this patent
Estimating the term…
Abstract
In a contact terminal, a first touch portion and a second touch portion of a movable piece and a first touch portion and a second touch portion of a movable piece bite into and thus pinch a spherical surface of a bump of a semiconductor device. In this state, when an electrode surface of the semiconductor device is warped upward during a test and the bump is about to be moved up, an inclined surface of a fixing portion of the movable piece and an inclined surface of a fixing portion of the movable piece fix the spherical surface of the bump.
Claims7
A contact terminal comprising:
- at least one movable piece selectively coming into contact with a spherical electrode portion in a semiconductor device;
- and
- a terminal portion coupled to a proximal end portion of the movable piece, wherein
- a contact point portion of the movable piece includes
- at least one touch portion extending along a longitudinal direction of the movable piece, and coming into contact with the spherical electrode portion, and
- a fixing portion intersecting with a tip end of the touch portion, and having an inclined surface portion to fix the spherical electrode portion.
3 more elements
Dependencies are inferred from the claim text.