Printed circuit board product with antenna structure and method for its production

A method for producing an intermediate printed circuit board product (80) with an antenna structure (5), comprising the following steps:

• providing a ground layer (10);
• attaching a dielectric insulating layer (30) on one exterior side (11) of the ground layer (10), wherein the dielectric insulating layer (30) has at least one recess (39) extending throughout the dielectric insulating layer height (35) of the dielectric insulating layer (30), and wherein the at least one recess (39) is positioned on an antenna subarea (12) of the exterior side (11) of the ground layer (10);
• attaching a conducting layer (40) on a first exterior side (31) of the dielectric insulating layer (30) opposite to the ground layer (10), wherein the dielectric insulating layer (30) is arranged between the conducting layer (40) and the ground layer (10), and wherein the conducting layer (40) preferably has at least one recess (49) extending throughout the conducting layer height (45) of the conducting layer (40) which at least one recess (49) is positioned coextensive with the at least one recess (39) of the dielectric insulating layer (30);
• laminating of the ground layer (10), the at least one dielectric insulating layer (30) and the at least one conducting layer (40) and
• optionally attaching a layer arrangement on a first exterior side (41) of said conducting layer (40), said layer arrangement comprising at least one further dielectric insulating layer (30′, 30″) and at least one further conducting layer (40′, 40″), whereby at least one further dielectric insulating layer (30′, 30″) is attached on said first exterior side (41) of the conducting layer (40) and at least one further conducting layer (40′) is attached on a first exterior side (31) of at least one further dielectric insulating layer (30′), and wherein preferably at least one further dielectric insulating layer (30′, 30″) and at least one further conducting layer (40′, 40″) has at least one recess (39, 49) that is positioned in registry with at least one of the preceding recesses (39, 49) as well as in registry with an antenna subarea (12) on the exterior side (11) of the ground layer (10), to obtain a first semi-finished product (50);
• receiving at least one antenna cavity (60) within the first semi-finished product (50) starting on its exterior side (51) that is made up of the recess (49) of at least one conducting layer (40) as well as the coextensive recess (39) of at least one dielectric insulating layer (30), the at least one antenna cavity (60) comprising a cavity height (65) equal to the sum of at least one conducting layer height (45) and at least one dielectric insulating layer height (35), wherein a cavity projection area (65) of the antenna cavity (60) is positioned (22) on the antenna subarea (12);
• optionally coating (66) of the side walls (67, 68) within the antenna cavity (60);
• attaching a compound signal layer (70) on the exterior side (51) made up of the conducting layer (40) of the first semi-finished product (50), wherein the compound signal layer (70) covers the at least one antenna cavity (60);
• and
• laminating of the first semi-finished product (50) and the compound signal layer (70) to obtain an intermediate printed circuit board product (80).

An intermediate printed circuit board product (80) with an antenna structure (5), wherein at least one antenna cavity (60) is arranged within a first semi-finished product (50) comprising:

• at least one ground layer (10);
• at least one dielectric insulating layer (30) which is attached to the ground layer (10);
• and
• at least one conducting layer (40) which is attached to the dielectric insulating layer (30) opposite to the ground layer (10) in a way that the at least one dielectric insulating layer (30) is arranged between the at least one conducting layer (40) and the ground layer (10),
• whereby the ground layer (10), the at least one dielectric insulating layer (30) and the at least one conducting layer (40) are laminated, and
• wherein the antenna cavity (60) touches the ground layer (10) alongside a ground-plane area (62) and extends throughout the at least one conducting layer (40) as well as the at least one dielectric insulating layer (30) with a cavity height (65) equal to the sum of at least one conducting layer height (45) and of at least one dielectric insulating layer height (35), wherein a compound signal layer (70) is attached on the conducting layer (40) of the first semi-finished product (50) covering the antenna cavity (60), and the first semi-finished product (50) and the compound signal layer (70) are laminated.