Monolayer thin film capacitor and method for manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJong Pil LEE, Jong Bong LIM, Hai Joon LEE, Ji Hyun PARK
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Abstract
A monolayer thin film capacitor includes: a bottom electrode; a top electrode; a dielectric layer disposed between the bottom electrode and the top electrode; a first via formed in the dielectric layer so as to penetrate through the dielectric layer; a second via formed in the top electrode so as to penetrate through the top electrode and having a greater width or a greater diameter than that of the first via; and a connection electrode disposed on inner sides of the first and second vias, electrically connected to the bottom electrode, and electrically insulated from the top electrode.
Claims15
A monolayer thin film capacitor comprising:
- a bottom electrode;
- a top electrode;
- a dielectric layer disposed between the top and bottom electrodes;
- a first via formed in the dielectric layer so as to penetrate through the dielectric layer;
- a second via formed in the top electrode so as to penetrate through the top electrode and having a greater width or a greater diameter than that of the first via;
- and
- a connection electrode disposed on inner sides of the first and second vias, electrically connected to the bottom electrode, and electrically insulated from the top electrode.
A method for manufacturing a monolayer thin film capacitor, the method comprising:
- preparing a bottom electrode;
- forming a dielectric layer and a first via on the bottom electrode;
- forming a first metal layer on the dielectric layer on which the first via is formed;
- forming a second metal layer in which a second via is formed after disposing a second via formation member around the first via on the first metal layer;
- and
- forming a connection electrode and a top electrode by removing the second via formation member and etching the exposed first metal layer.
Dependencies are inferred from the claim text.