Semiconductor package and rework process for the same

A method comprising:

• directing a laser beam at a first semiconductor package to melt solder joints, the solder joints bonding first contact pads of the first semiconductor package to second contact pads of a second semiconductor package;
• removing the first semiconductor package using a first bond head;
• and
• bonding a replacement semiconductor package to the second contact pads.

A method comprising:

• forming a first package comprising:
• forming an electrical connector over a carrier substrate;
• attaching a first die to the carrier substrate, the electrical connector extending from a second side of the first die to a first side of the first die, the second side being opposite the first side, the electrical connector being adjacent the first die;
• encapsulating the first die and the electrical connector with a molding compound;
• forming an interconnect structure proximate the first side of the first die and the molding compound;
• forming a first set of conductive connectors on the interconnect structure;
• bonding a second package to the interconnect structure with a first set of solder joints;
• testing the second package for defects;
• heating the first set of solder joints and the second package by directing a laser beam at a surface of the second package based on testing the second package for defects;
• removing the heated second package based on testing the second package for defects;
• if the second package is removed, bonding a third package to interconnect structure;
• and
• removing the first package from the carrier substrate.