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US 2017/0250166 A1Published application
Thermal performance structure for semiconductor packages and method of forming same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJung Wei Cheng, Tsung-Ding Wang, Mirng-Ji Lii, Chien-Hsun Lee
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Abstract
An embodiment device includes a first die, a second die electrically connected to the first die, and a heat dissipation surface on a surface of the second die. The device further includes a package substrate electrically connected to the first die. The package substrate includes a through-hole, and the second die is at least partially disposed in the through hole.
Claims20
A method comprising:
- forming first connectors on a first side of a first die;
- bonding a second die to the first die using the first connectors;
- forming second connectors on the first side of the first die, wherein the second connectors have a different pitch than the first connectors;
- bonding a package substrate to the first die using the second connectors, wherein the package substrate comprises a through hole, and wherein the second die is at least partially disposed in the through hole;
- and
- attaching a first heat dissipation feature to a surface of the second die.
3 more elements
A method comprising:
- forming a first plurality of connectors on a first surface of a first package component, wherein the first package component comprises a first die;
- bonding a package substrate to the first plurality of connectors, wherein a through hole extends through the package substrate;
- bonding one or more second dies to the first package component using a second plurality of connectors, wherein the second plurality of connectors is disposed on the first surface of the first package component, and wherein the one or more second dies is disposed at least partially in the through hole;
- attaching a first heat dissipation feature to the first die, wherein the first heat dissipation feature is disposed on an opposing side of the first die as the package substrate;
- and
- attaching a second heat dissipation feature to the one or more second dies, wherein the second heat dissipation feature comprises:
- a first portion directly attached to the one or more second dies by a first interfacing material;
- and
- a second portion directly attached to a second surface of the package substrate opposite the first package component by a second interfacing material, and wherein a third connector is disposed adjacent the second portion of the second heat dissipation feature on the second surface of the package substrate.
6 more elements
A method comprising:
- bonding a package substrate to a first package component using a first plurality of connectors disposed on a surface of the first package component, wherein the first package component comprises a first die;
- bonding one or more second dies to the first package component using a second plurality of connectors disposed on the surface of the first package component, the one or more second dies is disposed at least partially in a through hole extending through the package substrate;
- attaching a first heat dissipation feature to the first die;
- and
- attaching a second heat dissipation feature to the one or more second dies, wherein the second heat dissipation feature comprises:
- a first portion disposed at least partially in the through hole;
- and
- a second portion outside of the through hole, wherein the first portion is disposed between the second portion and the one or more second dies, wherein the first portion protrudes from the second portion, wherein a substantially level top surface of the second portion is directly attached to a surface of the package substrate by an interfacing material, and wherein the substantially level top surface of the second portion extends continuously from a sidewall of the second portion to a sidewall of the first portion.
5 more elements
Dependencies are inferred from the claim text.