Multi-access memory system and a method to manufacture the system
AssigneeAltera Corporation
InventorHui LIU
Life of this patent
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Abstract
A multiple memory access system is disclosed. The system includes a first die disposed on a package substrate. A second die is stacked above the first die. The first die, the second die and the package substrate form a first package. An IC is placed within a close proximity of the first package where the first die communicates with the second die at a first data rate while the first die communicates with the IC at a second data rate. The first data rate is higher than the second data rate. Methods of forming a multi-access memory system are also disclosed.
Claims15
A method for forming a multi-access memory system, said method comprising:
- forming a first package that includes a first die, a second die and a package substrate, wherein the method of forming comprises,
- placing the first die on the package substrate;
- stacking the second die on the first die, wherein the first die is operable to communicate with the second die at a first data rate via a plurality of bumps or balls each physically contacting the second die and the first die;
- and
- interconnecting the first die to the package substrate;
A method of forming a multiple-access memory system, the method comprising:
- disposing a first die on a package substrate;
- stacking a second die on the first die with a plurality of bumps or balls each coupling the second die to the first die by physically contacting the second die and the first die, wherein the first die, the second die and the package substrate form a first package;
- and
- placing an Integrated Circuit (IC) proximate to the first package.
Dependencies are inferred from the claim text.