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US 2017/0250152 A1Published application
Chip embedding package with solderable electric contact
AssigneeInfineon Technologies AG
InventorsThorsten SCHARF, Steffen Jordan, Wolfgang Schober, Thomas Ziegler
Life of this patent
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Abstract
A package comprising an electronic chip, a laminate-type encapsulant at least partially encapsulating the electronic chip, a wiring structure extending from the electronic chip up to a contact pad, and a completely galvanically formed solderable exterior electric contact electrically coupled with the electronic chip by being arranged on the contact pad.
Claims24
A package, comprising:
- an electronic chip;
- a laminate-type encapsulant at least partially encapsulating the electronic chip;
- a wiring structure extending from the electronic chip up to a contact pad;
- a completely galvanically formed solderable exterior electric contact electrically coupled with the electronic chip by being arranged on the contact pad.
1 more element
A package, comprising:
- an electronic chip;
- a laminate-type encapsulant at least partially encapsulating the electronic chip;
- a solderable exterior electric contact electrically coupled with the electronic chip, comprising a first galvanically formed layer directly on a second galvanically formed layer, and having a substantially flat exterior surface.
A method of manufacturing a package, the method comprising:
- at least partially encapsulating an electronic chip by an encapsulant;
- forming a wiring structure extending from the electronic chip up to a contact pad;
- galvanically forming a layer as a solderable exterior electric contact electrically coupled with the electronic chip by being arranged in contact with the contact pad.
Dependencies are inferred from the claim text.