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US 2017/0250148 A1Published application
Method of manufacturing a semiconductor device
AssigneeRohm Co., Ltd.
InventorHiroshi OKUMURA
Life of this patent
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Abstract
A method of manufacturing a semiconductor device forming a pad on the semiconductor substrate. A rewiring is formed that is electrically connected to the pad and led to a region outside the pad. A resin layer is formed on the rewiring. An external terminal is electrically connected to the rewiring via the resin layer. The resin layer is formed so as to enter the inside of a slit formed in a region along the periphery of the external terminal in the rewiring.
Claims8
A manufacturing method for a semiconductor device, comprising:
- forming a pad on a semiconductor substrate;
- forming a rewiring that is electrically connected to the pad and led to a region outside the pad;
- forming a resin layer on the rewiring;
- and
- forming an external terminal so that the external terminal is electrically connected to the rewiring via the resin layer, wherein
- the forming the rewiring includes forming a slit in a region along the periphery of the external terminal in the rewiring, and
- the resin layer is formed so as to enter the inside of the slit.
4 more elements
Dependencies are inferred from the claim text.