Perforated conductive material for emi shielding of semiconductor device and components
AssigneeIntel Corporation
InventorsRajendra C. Dias, Joshua D. Heppner, Mitul B. Modi, Anna M. Prakash
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Abstract
An electric device and method of fabrication of that electric device is disclosed. The electric device includes one or more electrical devices attached to a substrate. The electric device further includes one or more grounding pads attached to the substrate. The electric device further includes a perforated conductive material placed on the substrate. The electric device further includes a molding compound deposited to cover the perforated conductive material, the one or more devices, and the one or more grounding pads.
Claims22
An electrical device, comprising:
- one or more electrical devices attached to a substrate;
- one or more grounding pads attached to the substrate;
- a perforated conductive material placed on the substrate, wherein the perforated conductive material allows a molding compound to pass through.
- wherein the molding compound deposited over and through the perforated conductive material to cover the perforated conductive material, the one or more devices under the perforated conductive material, and the one or more grounding pads.
A method, comprising:
- attaching one or more electrical devices to a substrate;
- attaching one or more grounding pads to the substrate;
- placing a perforated conductive material on the substrate, wherein the perforated conductive material allows a molding compound to pass through.
- depositing the molding compound over and through the perforated conductive material to cover the perforated conductive material, the one or more devices under the perforated conductive material, and the one or more grounding pads.
A non-transitory computer readable storage medium storing one or more programs for execution by one or more processors, the one or more programs comprising instructions for:
- attaching one or more electrical devices to a substrate;
- attaching one or more grounding pads to the substrate;
- placing a perforated conductive material on the substrate, wherein the perforated conductive material allows a molding compound to pass through;
- and
- depositing the molding compound over and through the perforated conductive material to cover the perforated conductive material, the one or more devices under the perforated conductive material, and the one or more grounding pads.
Dependencies are inferred from the claim text.