Integrated circuit device with overvoltage discharge protection

An apparatus comprising:

• a package;
• at least two leads extending from the package and providing electrical connections to the package;
• a first die situated in the package having a first substrate and at least a first terminal electrically coupled to a first one of the leads;
• a second die situated in the package having a second substrate and at least a second terminal electrically coupled to a second one of the leads, wherein the second die is electrically isolated from the first die;
• and
• an adhesive material forming a layer that supports the first and second die and holds the first and second die in place within the package, wherein the adhesive material forms an ESD current path between the first one of the leads and the second one of the leads.

An apparatus comprising:

• a package;
• a lead frame comprising:
• a plurality of leads, at least two of which are exposed external to the package to permit electrical connections to the package;
• at least two die-attach paddles, each associated with a respective lead;
• a die situated in the package comprising:
• a substrate;
• a first terminal electrically coupled to a first one of the leads;
• and
• a second terminal coupled to a second one of the leads;
• and
• a voltage-triggered conduction path between the first and second die-attach paddles to electrically isolate the first die-attach paddle from the second dielattach paddle under a first condition and provide an ESD current path between the first die-attach paddle from the second die-attach paddle under a second condition.